Presentation of the research theme
The evolution of technologies allows the development of innovative and highly integrated devices and power modules. We can cite the development of 3D architecture for 3D power modules, with doubled thermal performance for a reduced converter volume made more integrable, with a notable reduction in parasitic inductances, all at a reduced cost. At other scale factors, the development of 3D microelectronic devices with very high integration density is also booming with integration in complex and highly heterogeneous systems, a source of innovation for multiple applications (IoT, biomedical, etc.). Furthermore, the deployment of electronics in increasingly varied environments that are often highly constrained and severe, requires rigorous and methodological consideration of the operational conditions of the systems in order to guarantee their expected service life. For all these devices, the high level of reliability required constitutes a real challenge to which we wish to respond by implementing new modelling and experimental characterisation approaches.