Eric WOIRGARD

Professor

Research group : RELIABILITY

Team : RIAD

Tel : 0540006546

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Article (41)

Electro-thermo-mechanical modelling of a SiC MOSFET transistor under non-destructive short-circuit Auteur(s): Florent Loche-Moinet, Loïc Théolier, Eric Woirgard Lien HAL : https://hal.science/hal-04263300 Mechanical stress investigation after technological process in Deep Trench Termination DT2 using BenzoCycloButene as dielectric material Auteur(s): H. Arbess, F. Baccar, L. Theolier, S. Azzopardi, E. Woirgard Lien HAL : https://hal.science/hal-02500148 Ageing mechanisms in Deep Trench Termination (DT2) Diode Auteur(s): F. Baccar, H. Arbess, L. Theolier, S. Azzopardi, E. Woirgard Lien HAL : https://hal.science/hal-02500141 Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses Auteur(s): Omar Chihani, Loïc Théolier, Alain Bensoussan, Jean-Yves Delétage, André Durier, Eric Woirgard Lien HAL : https://hal.science/hal-02499971 Thermo-Mechanical Reliability Assessment of AlN Power Substrates Subjected to Severe Aging Tests Auteur(s): Faical Arabi, Loic Theolier, Donatien Martineau, J.-Y. Delétage, Mathieu Médina, Eric Woirgard Lien HAL : https://hal.science/hal-01662917 Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering Auteur(s): Barriere Maxime, Alexandrine Guédon-Gracia, Eric Woirgard, Serge Bontemps, Francois Le Henaff Lien HAL : https://hal.science/hal-01671865 Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices Auteur(s): Faical Arabi, Loic Theolier, Donatien Martineau, J.-Y. Delétage, Mathieu Médina, Eric Woirgard Lien HAL : https://hal.science/hal-01662946 Identification and analysis of power substrates degradations subjected to severe aging tests Auteur(s): Eric Woirgard, Faical Arabi, Wissam Sabbah, Donatien Martineau, Loic Theolier, Stéphane Azzopardi Lien HAL : https://hal.science/hal-01662947 Lifetime evaluation of nano-scale silver sintered power modules for automotive application based on experiments and finite elements modeling Auteur(s): Francois Le Henaff, Stephane Azzopardi, Eric Woirgard, Toni Youssef, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-01671796 Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity Auteur(s): Toni Youssef, Wafaa Rmili, Eric Woirgard, Stephane Azzopardi, Nicolas Vivet, Donatien Martineau, Régis Meuret, Guenhael Le Quilliec, Caroline Richard Lien HAL : https://hal.science/hal-01333171 Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach Auteur(s): Fédia Baccar, Stéphane Azzopardi, Loïc Théolier, Kamal El Boubkari, Jean-Yves Deletage, Eric Woirgard Lien HAL : https://hal.science/hal-00955719 A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization Auteur(s): François Le Henaff, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-00795345 Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy Auteur(s): Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard Lien HAL : https://hal.science/hal-00881584 Remaining Useful Life prediction of Lithium batteries in calendar ageing for automotive applications Auteur(s): Akram Eddahech, Olivier Briat, Eric Woirgard, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00765063 Ageing monitoring of lithium-ion cell during power cycling tests Auteur(s): Akram Eddahech, Olivier Briat, Hervé Henry, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00641829 How supercapacitors reach end of life criteria during calendar life and power cycling tests Auteur(s): Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00641859 Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00584164 Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling Auteur(s): Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Hassane El Brouji, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00527080 Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly. Auteur(s): J.-Y. Delétage, E. Woirgard, I. Favre, P. Lagonotte, G. Burban Lien HAL : https://hal.science/hal-00380410 An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications Auteur(s): Alexandre Micol, Adrien Zéanh, Tony Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny, Moussa Karama Lien HAL : https://hal.science/hal-00414780 L'enseignement de l'électronique accessible aux étudiants handicapés Auteur(s): François Demontoux, Eric Woirgard, Elise Belliard, Karine Verdeau, Catherine Bernou Lien HAL : https://hal.science/hal-00393003 Analysis of the dynamic behavior changes of supercapacitors during calendar life test under several voltages and temperatures conditions Auteur(s): Hassane El Brouji, Olivier Briat, Jean-Michel Vinassa, Hervé Henry, Eric Woirgard Lien HAL : https://hal.science/hal-00414775 Impact of Calendar Life and Cycling Ageing on Supercapacitor Performance Auteur(s): Hassane El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard Lien HAL : https://hal.science/hal-00424304 Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations Auteur(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Lien HAL : https://hal.science/hal-00403579 Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Adel Benmansour, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00414779 Reliability of the connections used in IGBT modules, in aeronautical environment Auteur(s): Adrien Zéanh, Olivier Dalverny, Moussa Karama, Eric Woirgard, Stephane Azzopardi, A. Bouzourene, J. Casut, Michel Mermet-Guyennet Lien HAL : https://hal.science/hal-00324002 Comparison between changes of ultracapacitors model parameters during calendar life and power cycling ageing tests Auteur(s): Hassane El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard Lien HAL : https://hal.science/hal-00333031 Failure mechanism of Trench IGBT under short-circuit after turn-off Auteur(s): Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard Lien HAL : https://hal.science/hal-00324011 Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions Auteur(s): Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard Lien HAL : https://hal.science/hal-00324008 A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation Auteur(s): Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard Lien HAL : https://hal.science/hal-00324010 Assessment of the Trench IGBT reliability: low temperature experimental characterization Auteur(s): Stephane Azzopardi, Adel Benmansour, Masayasu Ishiko, Eric Woirgard Lien HAL : https://hal.science/hal-00324013 IGBT power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power ? Auteur(s): Stéphane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat, Christian Zardini Lien HAL : https://hal.science/hal-00183574 Local lifetime control IGBT structures: turn-off performances comparisonfor hard-soft-switching between 1200 V trench and new planar PT-IGBTs Auteur(s): Stéphane Azzopardi, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini Lien HAL : https://hal.science/hal-00183576 Quantification of ageing of ultracapacitors during cycling tests with current profile characteristics of hybrid and electric vehicles applications Auteur(s): Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Hassane El Brouji, Stéphane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00168779 Specification and use of pulsed current profiles for ultracapacitors power cycling Auteur(s): Whalid Lajnef, Jean-Michel Vinassa, Olivier Briat, Eric Woirgard Lien HAL : https://hal.science/hal-00183571 Strategy for designing accelerated ageing tests to evaluate IGBT power modules lifetime in real operation mode Auteur(s): Jean-Marc Thebaud, Eric Woirgard, Christian Zardini, Stéphane Azzopardi, Olivier Briat, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00183575 Principle, design and validation of a flywheel based peak power source for heavy-duty electric vehicles Auteur(s): Olivier Briat, Jean-Michel Vinassa, Stéphane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00168775 Power cycling tests for accelerated ageing of ultracapacitors Auteur(s): Olivier Briat, Walid Lajnef, Jean-Michel Vinassa, Eric Woirgard Lien HAL : https://hal.science/hal-00161309 Monitoring fading rate of ultracapacitors using online characterization during power cycling Auteur(s): Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Hassane El Brouji, Eric Woirgard Lien HAL : https://hal.science/hal-00180190 A systematic hard- and soft-switching performances evaluation of 1200V punch through IGBT structures Auteur(s): Stephane Azzopardi, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini, Olivier Briat Lien HAL : https://hal.science/hal-00161308 Characterization methods and modelling of ultracapacitors for use as peak power sources Auteur(s): Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Stéphane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00161305

Conference proceedings (92)

Multi-scale electro-thermo-mechanical simulation of a SiC MOSFET transitor during short-circuit Auteur(s): Florent Loche-Moinet, Loïc Théolier, Eric Woirgard Lien HAL : https://hal.science/hal-04263298 High Temperature Power Module Packaging Issues Auteur(s): W. Sabbah, E. Woirgard, S. Azzopardi, C. Buttay, Sombel Diaham, Marie-Laure Locatelli, J.P. Habas, V. Nassiet, O. Fichet, M. Charlas Lien HAL : https://hal.science/hal-03989429 Embedded set of sensors for power electronic modules Auteur(s): Paul-Etienne Vidal, Jean-Marc Diénot, Frédéric Rotella, Imane Sakhraoui, Baptiste Trajin, Guillaume Viné, Irène Zambettakis, Antoine Renaud, Eric Woirgard, Gautier Bayle, Samuel Behar, Philippe Lasserre, Jacques Favre Lien HAL : https://hal.science/hal-03657416 Increased Breakdown Voltage and robustness of Embedded power module Auteur(s): A. Tablati, N. Alayli, F. Arabi, K. El Boubakari, T. Youssef, L. Theolier, E. Woirgard Lien HAL : https://hal.science/hal-03665886 Conception de capteurs intégrés et logiciels pour des modules d'électronique de puissance Auteur(s): Paul-Etienne Vidal, Jean-Marc Diénot, Frédéric Rotella, Imane Sakhraoui, Baptiste Trajin, Guillaume Viné, Irène Zambettakis, Antoine Renaud, Eric Woirgard, Gautier Bayle, Samuel Behar, Philippe Lasserre, Jacques Favre Lien HAL : https://hal.science/hal-03657538 Apparent heat capacity model of the SiC MOSFET’s Aluminium top surface for short-circuits simulations Auteur(s): F. Loche-Moinet, L. Theolier, E. Woirgard Lien HAL : https://hal.science/hal-03665892 Initiation à la recherche sur la Fiabilité en microélectronique par la physique :Mini-projets en laboratoire Auteur(s): J-y Deletage, T. Dubois, G. Duchamp, L. Theolier, J-M Vinassa, E. Woirgard, H. Fremont, O. Briat, A. Guédon-Gracia Lien HAL : https://hal.science/hal-02516984 Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs Auteur(s): Omar Chihani, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard, Alain Bensoussan, André Durier Lien HAL : https://hal.science/hal-02500021 A muliphysics cosimulation for a wide band gap power module fatigue-related performance assessment Auteur(s): B. Boulbene, T. Youssef, D. Martineau, D. Balland, R. Meuret, E. Woirgard Lien HAL : https://hal.science/hal-02518718 Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire Auteur(s): O. Briat, J.-Y. Delétage, T. Dubois, G. Duchamp, H. Frémont, A. Guédon-Gracia, L. Theolier, J.-M. Vinassa, E. Woirgard Lien HAL : https://hal.science/hal-02518400 L'effet de la température et de la tension sur des vieillissements HTRB et HTGB pour des HEMTs GaN de puissance Auteur(s): Omar Chihani, Loïc Théolier, Alain Bensoussan, Pierre Bondue, Jean-Yves Deletage, André Durier, Eric Woirgard Lien HAL : https://hal.science/hal-02981877 Multi-physics modelling of thin films: Optimization for finite elements simulations tools Auteur(s): T. Youssef, E. Woirgard, S. Azzopardi, D Martineau Lien HAL : https://hal.science/hal-02518699 New simulation method for Deep Trench Termination diode (DT2) using mixed-mode TCAD sentaurus Auteur(s): F. Baccar, H. Arbess, L. Theolier, S. Azzopardi, E. Woirgard Lien HAL : https://hal.science/hal-02500152 Innovative embedded sensors for power electronic modules: CAPTIF – ANR research project Auteur(s): Paul-Etienne Vidal, Jean-Marc Diénot, Frédéric Rotella, Imane Sakhraoui, Baptiste Trajin, Guillaume Viné, Irène Zambettakis, Antoine Renaud, Eric Woirgard, Gautier Bayle, Samuel Behar, Philippe Lasserre, Jacques Favre Lien HAL : https://hal.science/hal-02111677 Effect of voids on crack propagation in AuSn die attach for high-temperature power modules Auteur(s): Faical Arabi, Loic Théolier, Toni Youssef, Mathieu Medina, Jean-Yves Deletage, Eric Woirgard Lien HAL : https://hal.science/hal-01662929 A multiphysics cosimulation for a wide band gap power module fatigue-related performance assessment Auteur(s): Benjamin Boulbene, Donatien Martineau, Eric Woirgard, Régis Meuret, Toni Youssef, Balland D Lien HAL : https://hal.science/hal-01671810 Silver sintered double-sided cooling power package process for controlled Si power semiconductor devices with aluminum top-metallization Auteur(s): Barriere Maxime, Stephane Azzopardi, Raphaël Roder, Isabelle Favre, Eric Woirgard, Serge Bontemps, François Le Henaff Lien HAL : https://hal.science/hal-01671837 Multi-physics Modelling of Thin Films: Optimization for Finite Elements Simulations Tools Auteur(s): Toni Youssef, Eric Woirgard, Stephane Azzopardi, Donatien Martineau, Régis Meuret Lien HAL : https://hal.science/hal-01671659 Failure mechanism study of gold-tin solder for attaching power electronic devices Auteur(s): Faical Arabi, Loïc Théolier, Donatien Martineau, Eric Woirgard Lien HAL : https://hal.science/hal-01663005 The use of co-simulation in order to study reliability of power modules under harsh environment Auteur(s): Toni Youssef, Eric Woirgard, Stephane Azzopardi, Donatien Martineau, Régis Meuret Lien HAL : https://hal.science/hal-01671683 Multi-physics Modelling of Thin Ni/Au layer in power modules Auteur(s): Toni Youssef, Eric Woirgard, Stephane Azzopardi, Donatien Martineau, Régis Meuret Lien HAL : https://hal.science/hal-01671645 Reliability in Power Modules Die Attach: A Comprehensive Evolution of the Nanocrystalline Silver Sintering Physical Properties Versus its Porosity Auteur(s): Toni Youssef, Wafaa Rmili, Eric Woirgard, Stephane Azzopardi, Nicolas Vivet, Donatien Martineau, Régis Meuret, Guenhael Le Quilliec, Caroline Richard Lien HAL : https://hal.science/hal-01333190 Etude thermomécanique de la dégradation des assemblages de puissance soumis à des vieillissements à haute température Auteur(s): Faical Arabi, Loïc Théolier, Martineau D., Jean-Yves Deletage, Eric Woirgard Lien HAL : https://hal.science/hal-01361692 Electrical Characteristics Evolution of the Deep Trench Termination Diode Based on a Finite Elements Simulation Approach Auteur(s): Fédia Baccar, François Le Henaff, Loïc Théolier, Stephane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-01017506 Fiabilité d'une diode DT2 reportée sur un substrat DBC par frittage de pâte d'argent Auteur(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-01017558 Adaptation d'un poste de travaux pratiques en électronique pour un étudiant tétraplégique Auteur(s): François Demontoux, Anne Dicky, Fabienne Eydon, Karine Verdeau, Eric Woirgard Lien HAL : https://hal.science/hal-01024135 Silver sintering wire-bonding less power module for high temperature applications Auteur(s): Francois Le Henaff, Stephane Azzopardi, Loïc Théolier, Jean-Yves Deletage, Eric Woirgard, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-01065293 Investigation of mechanical stress effect on electrical behavior of Trench Punch Through IGBT under short-circuit condition at low and high temperature Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00955754 Failure initiation of IGBT due to emitter contact degradation: a 2D finite elements electro-thermal multi-cell simulation approach under hard switching, short-circuit and avalanche operations Auteur(s): Kamal El Boubkari, Stephane Azzopardi, Loïc Théolier, Raphaël Roder, Eric Woirgard, Serge Bontemps Lien HAL : https://hal.science/hal-00955738 La télé participation aux enseignements. Un outil pour l'accès à tous les enseignements pour les étudiants handicapés Auteur(s): François Demontoux, Anne Dicky, Fabienne Eydon, Karine Verdeau, Eric Woirgard Lien HAL : https://hal.science/hal-01024131 Fiabilité d'une diode DT2 reportée sur un substrat DBC par frittage de pâte d'argent Auteur(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, Francois Le Henaff, Jean-Yves Deletage, Eric Woirgard Lien HAL : https://hal.science/hal-01065237 Feasibility and performances of BOOST converter in automotive application using silicon power transistors operating at 200°C Auteur(s): Raphaël Roder, Stephane Azzopardi, Loïc Théolier, Eric Woirgard, Serge Bontemps Lien HAL : https://hal.science/hal-01065131 First Assemblies Using Deep Trench Termination Diodes Auteur(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-01017522 Processing and characterization of a 100 % low-temperature Ag-sintered three-dimensional structure, European Conference on Power Electronics and Applications Auteur(s): Amandine Masson, Stéphane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-00955727 Intérêt de la simulation 2D multicellulaire par éléments-finis pour l'analyse d'un défaut lié un décollement de fil de câblage sur une puce de puissance IGBT Auteur(s): Kamal El Boubkari, Stéphane Azzopardi, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00955758 Thermal performance evaluation of SiC power devices packaging Auteur(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00788775 Development of high temperature packaging technologies for SiC power devices based on finite elements simulanation and experiments: thermal approach Auteur(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00795337 Criteria of the EIE courses accessible to disabled students. Legibility of cursus and experiences sharing for generalizing good practices Auteur(s): François Demontoux, Hélène Fremont, Eric Woirgard Lien HAL : https://hal.science/hal-00853821 Thermal performance evaluation of SiC power devices packaging Auteur(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00788331 Thermal performances evaluation of new high temperature power packages using SiC devices Auteur(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Eric Woirgard, Jean-Yves Delétage Lien HAL : https://hal.science/hal-00795339 Frittage de nano-pâte d'argent : impact de la métallisation du substrat sur la tenue à la fatigue thermique des assemblages de puissance Auteur(s): François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-00782838 Amélioration de la lisibilité des formations de l'EEA accessibles aux étudiants en situation de handicap - Vers une mutualisation des expériences et une généralisation des bonnes pratiques Auteur(s): François Demontoux, Hélène Fremont, Eric Woirgard Lien HAL : https://hal.science/hal-00873510 Development of high temperature packaging technologies for SiC power devices based on finite elements simulations and experiments: thermal approach Auteur(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00788759 2D finite elements electro-thermal modeling for IGBT: uni and multicellular approach Auteur(s): Kamal El Boubkari, Stephane Azzopardi, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00795341 La télé participation aux enseignements. Un outil pour l'accès à tous les enseignements pour les étudiants handicapés Auteur(s): François Demontoux, Anne Dicky, Karine Verdeau, Eric Woirgard Lien HAL : https://hal.science/hal-00670800 Evaluation of silver-sintering die attach Auteur(s): Wissam Sabbah, Raphaël Riva, Stanislas Hascoët, Cyril Buttay, Stephane Azzopardi, Eric Woirgard, Dominique Planson, Bruno Allard, Régis Meuret Lien HAL : https://hal.science/hal-00707733 Caractérisation électromécanique en puces " flottantes " d'IGBT à grille planaire Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Florence Capy, Eric Woirgard Lien HAL : https://hal.science/hal-00584114 A first approach on the failure mechanisms of IGBT inverters for aeronautical applications: effect of humidity-pressure combination Auteur(s): Hassan Abbad, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, P. Rollin, Karl Marchand, Tony Lhommeau, Michel Piton Lien HAL : https://hal.science/hal-00584142 Electromechanical Characterization of "Flying" Planar Gate Punch Through IGBT Bare Die Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Florence Capy, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00585061 A connection of thermo-mechanical finite elements tools with electro-thermal finite elements simulation: towards an electro-thermo-mechanical finite elements modeling for power semiconductor devices Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, Isabelle Favre Lien HAL : https://hal.science/hal-00585076 Assessment of uni-axial mechanical stress on Trench IGBT under severe operating conditions: a 2D physically-based simulation approach Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00585066 Thermo-mechanical simulations in double-sided heat transfer power assemblies Auteur(s): Eric Woirgard, Isabelle Favre, Jean-Yves Delétage, Stephane Azzopardi, Renan Léon, Guy Convenant, Zoubir Khatir Lien HAL : https://hal.science/hal-00584904 Evaluation of the performances of a novel Punch Through Trench IGBT using a Si(1-x)Ge(x) N+ buffer layer by using finite elements simulations Auteur(s): Stephane Azzopardi, Yassine Belmehdi, Florence Capy, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00584133 Does power device sensitivity to mechanical stress can be used as sensor for power assembly health monitoring? Auteur(s): Florence Capy, Stephane Azzopardi, Kama El Boubkari, Yassine Belmehdi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00591063 La télé participation aux enseignements de travaux pratiques. Application à l'accès à tous les enseignements pour les étudiants handicapés Auteur(s): François Demontoux, Elise Belliard, Anne Dicky, Karine Verdeau, Eric Woirgard Lien HAL : https://hal.science/hal-00511087 Thermal Transient Characterization of Electronic Assemblies by Infrared Thermography and DeltaVbemeter Methods Auteur(s): Philippe Dondon, Eric Woirgard, Christian Zardini Lien HAL : https://hal.science/hal-00350049 Programme EPO-Auto+ : Électronique de puissance pour l'automobile de demain: du module au système Auteur(s): Eric Woirgard, J. Razafiarivelo, Patrick Lagonotte, Zoubir Khatir Lien HAL : https://hal.science/hal-00418221 Ageing quantification of supercapacitors during calendar life and power cycling tests Auteur(s): Hassane El Brouji, Jean-Michel Vinassa, Olivier Briat, Nicolas Bertrand, Eric Woirgard Lien HAL : https://hal.science/hal-00416527 L'Enseignement de l'Electronique Accessible aux étudiants Handicapés Auteur(s): François Demontoux, Eric Woirgard, Elise Belliard, Karine Verdeau, Catherine Bernou Lien HAL : https://hal.science/hal-00345706 Parameters evolution of an ultracapacitor impedance model with ageing during power cycling tests Auteur(s): Hassane El Brouji, Jean-Michel Vinassa, Olivier Briat, Walid Lajnef, Nicolas Bertrand, Eric Woirgard Lien HAL : https://hal.science/hal-00317860 Proposition of IGBT modules assembling technologies for aeronautical applications Auteur(s): Adrien Zéanh, Olivier Dalverny, Moussa Karama, Eric Woirgard, Stephane Azzopardi, A. Bouzourene, J. Casutt, Michel Mermet-Guyennet Lien HAL : https://hal.science/hal-00324022 Ultracapacitor electrical modeling using temperature dependent parameters Auteur(s): Walid Lajnef, Olivier Briat, Stéphane Azzopardi, Jean-Michel Vinassa, Eric Woirgard Lien HAL : https://hal.science/hal-00339560 Reliability of the connections used in IGBT modules, in aeronautical environment Auteur(s): Adrien Zéanh, Olivier Dalverny, Moussa Karama, Eric Woirgard, Stephane Azzopardi, A. Bouzourene, J. Casutt, Michel Mermet-Guyennet Lien HAL : https://hal.science/hal-00324038 Fiabilité des substrats en AlN utilisés dans les modules IGBT en environnement aéronautique Auteur(s): Adrien Zéanh, Olivier Dalverny, Eric Woirgard, Stephane Azzopardi, Moussa Karama, A. Bouzourene, J. Casut, Michel Mermet-Guyennet Lien HAL : https://hal.science/hal-00324017 Ultracapacitors self discharge modelling using a physical description of porous electrode impedance Auteur(s): Hassane El Brouji, Jean-Michel Vinassa, Olivier Briat, Nicolas Bertrand, Eric Woirgard Lien HAL : https://hal.science/hal-00321871 Ageing quantification of ultracapacitors during calendar life and power cycling tests using a physically-based impedance model Auteur(s): Hassane El Brouji, Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Eric Woirgard Lien HAL : https://hal.science/hal-00339532 Improvement of the Reliability of Connections Used in IGBT Modules, in Aeronautical Environment Auteur(s): Adrien Zéanh, Olivier Dalverny, Moussa Karama, Eric Woirgard, Stephane Azzopardi, A. Bouzourene, J. Casutt, Michel Mermet-Guyennet Lien HAL : https://hal.science/hal-00324032 Thermomechanical Modelling and Reliability Study of an IGBT Module for an Aeronautical Application Auteur(s): Adrien Zéanh, Olivier Dalverny, Moussa Karama, Eric Woirgard, Stephane Azzopardi, A. Bouzourene, J. Casutt, Michel Mermet-Guyennet Lien HAL : https://hal.science/hal-00324035 Development of a physics-based impedance model of ultracapacitor Auteur(s): Nicolas Bertrand, Olivier Briat, Jean-Michel Vinassa, Hassane El Brouji, Eric Woirgard Lien HAL : https://hal.science/hal-00339539 Mécanisme de défaillance de l'IGBT Trench en mode court-circuit après ouverture Auteur(s): Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard Lien HAL : https://hal.science/hal-00180643 An Assessment of the Reliability of a new Soldering Process for Automotive Power Module Auteur(s): Mathieu Rizzi, Eric Woirgard, Stéphane Azzopardi Lien HAL : https://hal.science/hal-00185569 Electro-thermal characterization of ultracapacitors used as power source in hybrid electric vehicle Auteur(s): Whalid Lajnef, Jean-Michel Vinassa, Stéphane Azzopardi, Eric Woirgard, Christian Zardini Lien HAL : https://hal.science/hal-00185574 Cyclage de super-condensateurs utilisant des profils en courant impulsionnels Auteur(s): Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Eric Woirgard Lien HAL : https://hal.science/hal-00175226 Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly Auteur(s): Eric Woirgard, Jean-Yves Delétage, Isabelle Favre, Patrick Lagonotte, Gwenael Burban Lien HAL : https://hal.science/hal-00182176 Failure mechanisms of Trench IGBT under various short-circuit conditions Auteur(s): Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard Lien HAL : https://hal.science/hal-00180627 An assessment of the reliability of a new soldering process for automotive power module Auteur(s): Mathieu Rizzi, Eric Woirgard, Stephane Azzopardi Lien HAL : https://hal.science/hal-00180647 Hybrid power modules using a metal matrix composite baseplate : an evaluation Auteur(s): Stéphane Azzopardi, Eric Woirgard, Christian Zardini Lien HAL : https://hal.science/hal-00185561 Mécanisme de défaillance d un IGBT Trench en mode court-circuit après ouverture Auteur(s): Adel Benmansour, Stéphane Azzopardi, Jean-Christophe Martin, Eric Woirgard Lien HAL : https://hal.science/hal-00185571 Ultracapacitors characteristics changes during power cycling using specific current profiles Auteur(s): Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Eric Woirgard Lien HAL : https://hal.science/hal-00175223 Mécanisme de défaillance de l IGBT Trench en mode de court-circuit après ouverture Auteur(s): Adel Benmansour, Stéphane Azzopardi, Jean-Christophe Martin, Eric Woirgard Lien HAL : https://hal.science/hal-00185570 Ultracapacitors Modeling Improvement Using an Experimental Characterization Based on Step and Frequency Responses Auteur(s): Whalid Lajnef, Jean-Michel Vinassa, Stéphane Azzopardi, Olivier Briat, Eric Woirgard, Christian Zardini, Jean-Louis Aucouturier Lien HAL : https://hal.science/hal-00183580 Effect of the High Input Capacitance of 1200V Trench IGBT on the Switching Characteristics under Inductive Load Auteur(s): Stéphane Azzopardi, Adel Benmansour, Jean-Michel Vinassa, Olivier Briat, Eric Woirgard Lien HAL : https://hal.science/hal-00183577 Turn-off failure mechanism analysis of Trench IGBT under clamped inductive switching operation Auteur(s): Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard Lien HAL : https://hal.science/hal-00180637 Reliability Analysis of a New Soldering Process For Automotive Power Module Application Auteur(s): Mathieu Rizzi, Eric Woirgard, Stéphane Azzopardi Lien HAL : https://hal.science/hal-00185572 Reliability Analysis of a New Soldering Process For Automotive Power Module Application Auteur(s): Mathieu Rizzi, Eric Woirgard, Stephane Azzopardi Lien HAL : https://hal.science/hal-00180656 Switching performances comparison of 1200V punch-through and nonpunch-through IGBTs under hard-switching at high Temperature Auteur(s): Stéphane Azzopardi, Jean-Michel Vinassa, Eric Woirgard Lien HAL : https://hal.science/hal-00185562 What can be the optimum IGBT structure under UIS operation? Auteur(s): Stéphane Azzopardi, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini, Jean-Louis Aucouturier Lien HAL : https://hal.science/hal-00185576 Al/SiC base-plate hybrid power modules : evaluation of the thermo-mechanical performances Auteur(s): Stéphane Azzopardi, Eric Woirgard, Christian Zardini Lien HAL : https://hal.science/hal-00185560 Reliability Evaluation by Simulations and Experimentations of new Assembly Process for Automotive Power Application Auteur(s): Mathieu Rizzi, Eric Woirgard, Stephane Azzopardi Lien HAL : https://hal.science/hal-00180660 Local lifetime control IGBT structures : turn-off performances comparison for hard-and soft-switching between 1200V trench and new planar PT-IGBTs Auteur(s): Stéphane Azzopardi, A. Kawamura, H. Iwamoto, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini Lien HAL : https://hal.science/hal-00183587 Integration of an electromechanical power source in a test bench for hybrid electric vehicles Auteur(s): Olivier Briat, Stéphane Azzopardi, Jean-Michel Vinassa, Eric Woirgard, Jean-Louis Aucouturier Lien HAL : https://hal.science/hal-00183583 Method for ageing quantification of ultracapacitors during power cycling based on specific characterization tests Auteur(s): Walid Lajnef, Jean-Michel Vinassa, Olivier Briat, Eric Woirgard Lien HAL : https://hal.science/hal-00175220

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