Micro/nano-assembled electronic and photonic devices

Devices

Based on a broad academic and industrial partnership and an electrical and optical characterization platform, our research focuses on the study of the impact of:

integration of new (nano)materials,

miniaturization, packaging and interconnection to operating environment,

severe environmental stresses

on the functionality of micro and nano-assembled electronic and photonic devices.

Electronic devices

Dielectric (nano)materials for capacitors: forming, electrical and physical characterizations

Passive devices and embedded technologies: assessment of electrical performances, durability, reliability

Advanced interconnections for packaging: FEM modeling, non-destructive imaging (Scanning Acoustic Microscopy)

Optoelectronic / Photonic devices (OpERaS platform)

LEDs, Laser diodes, photodetectors: Electro-optical characterizations, Physics of early failure, Packaging impact on performances (thermal/thermomechanical)

Luminescent (nano)materials for LED

Polymer-based integrated optics for optical sensing

Presentation of the waves research activities of the Devices team

Initially focused on the optical telecommunications industry, photonics has significantly expanded to encompass a wide range of fields, from light generation to detection, as well as the guiding or molding the flow of light. Photonics today has the potential to revolutionize various fields, notably lighting (ultra-bright LEDs, QLEDs), quantum computing, communication and sensing.

Fundamental and experimental research is being conducted to demonstrate the performance of low-cost visible photonic devices, and to identify the key design and production criteria for detecting water pollutants. In partnership with UMI LN2 (CRSNG funding) and LightTECH program, efforts are focused on the development of innovative photonic integrated circuits (MMI, MR, grating couplers, optical interconnects, …), aimed at environmental analysis.

Recent or on-going research projects and related applications :
– Full-SiON Multi-Mode Interference (MMI) coupler for aperture synthesis (R. Roblès, thesis)
– Multi-material 3D additive manufacturing for Photonic Integrated Circuits (R. Beyrouti, thesis)
– Optofluidic sensors for detecting pollutants in water (CaptO project, P. Girault)
– Fabrication of Microring Resonator (MR) operating in the visible range (T. Rouanet, thesis)
– Optical functions printing on complex 3D shapes for sensing applications (TranslightLTC project, P. Girault)
– Integrated plasmonic sensor (SPR, LSPR) for environmental analysis (M. Balini, thesis)

Reliability of optoelectronic components

The implementation of dedicated fine characterization methodologies and the modeling of the physical mechanisms of degradation of optical semiconductor components give the group excellent recognition with industrial partners in the field (3SP Technologies, Renault, CEA-LETI, III-V Lab, THALES, CNES, SUNNA Design, Amplitude Systems, ALPHANOV…).

The projects are carried out within the framework of various programs, addressing the development and assessment of the reliability of different optoelectronic technologies (LEDs, laser diodes, photodetectors). Let us mention the “IDE2aL” project co-financed by the regional council (2014-2017) dedicated among other things to the fine characterization in temperature of power laser diodes and the highlighting of particular effects linked to the presence of defects (microplasma) likely to affect the life of these components under operational conditions. This work has led to an optimized design of 980nm GaAs diodes by the company 3SP Technologies.

Innovative Microelectronics Packaging

Included in this area are microdevices for electronics incorporating hybrid materials. The collaboration set up in 2015 with the NSERC/IBM Smarter Microelectronics Packaging for Performance Scaling Chair in close collaboration with ICMCB made it possible to finance a thesis in joint supervision with the University of Sherbrooke, which enabled the development of a ‘low-cost’ manufacturing process for capacitors based on thin films (∼ 200 nm) incorporating Ba0.6Sr0.4TiO3 nanoparticles synthesized by supercritical fluid.

Capacitance densities close to the state of the art (1 to 2 uF.cm-2) have been obtained, demonstrating the promoting nature of this approach for the microelectronics industry. At the same time, on a European scale, the recognition of the group’s work in the field of the effects of packaging on the reliability of devices allows it to be involved in several European projects.

Integration of innovative materials

The goal is to develop and characterize durable materials in order to integrate them into electronic and photonic devices with a high degree of miniaturization and at low cost.

Integrated optical microsensor

Background work, both fundamental and experimental, is carried out, making it possible to show the performance of a low-cost ring micro-resonator (OMR), and to identify the main design and production criteria carrying out a detection of water pollutants. With regard to the state of the art, the discriminating scientific element lies in the homogeneous detection (without surface functionalization) in the visible by measuring the changes in intensity (related to absorption) and wavelength resonance (linked to the change in optical index). In partnership with UMI LN2 (CRSNG funding), work is underway on the modeling and specific development of innovative resonant structures in integrated optics (OMR integrating porous sheath), targeting the detection of water pollutants.

Partners

Collaborations and partners

For the various research projects underway, the IMS Bordeaux laboratory and its teams rely on strong partnerships and collaborations, which allow for the creation of a synergy of strengths and a sharing of technical and human resources