Conference proceedings (2)
Epoxy Mold Compound Characterization for Modeling Packaging Reliability Auteur(s): Ariane Tomas, Benoit Lambert, Helene Fremont, Nathalie Malbert, Nathalie Labat Lien HAL : https://hal.science/hal-03666406v1 Reliability of fan-out wafer level packaging For III-V RF power MMICs Auteur(s): Ariane Tomas, Laurent Marechal, Rodrigo Almeida, Mehdy Neffati, Nathalie Malbert, Helene Fremont, Nathalie Labat, Arnaud Garnier Lien HAL : https://hal.science/hal-03336953v1Send a email to Ariane TOMAS :