Ariane TOMAS

Postdoctoral Researcher

Research group : RELIABILITY

Team : RIAD

Tel : 0540006540

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Thesis (1)

Contribution à l’évaluation de la fiabilité des assemblages QFN et WLP : études thermo- et hygro-mécaniques des résines d’encapsulation Auteur(s): Ariane Tomas Lien HAL : https://theses.hal.science/tel-04484032v1

Conference proceedings (3)

Investigation of different thermomechanical behaviours in one batch of QFN packages Auteur(s): Ariane Tomas, Helene Fremont, Nathalie Malbert, Nathalie Labat, Benoit Lambert, Bernard Plano Lien HAL : https://hal.science/hal-04976119v1 Epoxy Mold Compound Characterization for Modeling Packaging Reliability Auteur(s): Ariane Tomas, Benoit Lambert, Helene Fremont, Nathalie Malbert, Nathalie Labat Lien HAL : https://hal.science/hal-03666406v1 Reliability of fan-out wafer level packaging For III-V RF power MMICs Auteur(s): Ariane Tomas, Laurent Marechal, Rodrigo Almeida, Mehdy Neffati, Nathalie Malbert, Helene Fremont, Nathalie Labat, Arnaud Garnier Lien HAL : https://hal.science/hal-03336953v1

Invited lectures (1)

Moisture absorption and desorption in epoxy mould compounds: Characterization of Fickian and non-Fickian behaviours in complex packages Auteur(s): Ariane Tomas, Helene Fremont, Nathalie Malbert, Mehdy Neffati, Benoit Lambert Lien HAL : https://hal.science/hal-04273061v1

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