Hélène FREMONT

Professor

Research group : RELIABILITY

Team : RIAD,WBG

Tel : 0540002765

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Article (49)

Search for copper diffusion at hybrid bonding interface through chemical and electrical characterizations Auteur(s): Joris Jourdon, Sandrine Lhostis, Stéphane Moreau, Patrick Lamontagne, Hélène Frémont Lien HAL : https://hal.science/hal-03375909 In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration Auteur(s): Bassel Ayoub, Stéphane Moreau, Sandrine Lhostis, Hélène Frémont, Sébastien Mermoz, Emeline Souchier, Emilie Deloffre, Stéphanie Escoubas, Thomas W Cornelius, Olivier Thomas Lien HAL : https://hal.science/hal-03672631 Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Jean-Gabriel Mattei, Anna Mukhtarov, Helene Fremont Lien HAL : https://hal.science/hal-04053545 Moisture Diffusion Inside the BEOL of an FC-PBGA Package Auteur(s): Quentin Vandier, Helene Fremont, Dominique Drouin Lien HAL : https://hal.science/hal-03885127 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stephane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Hélène Frémont Lien HAL : https://hal.science/hal-03550481 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): S. Moreau, Joris Jourdon, S. Lhostis, D. Bouchu, Bassel Ayoub, L. Arnaud, Helene Fremont Lien HAL : https://hal.science/hal-03626780 Moisture diffusion in plasma-enhanced chemical vapor deposition dielectrics characterized with three techniques under clean room conditions Auteur(s): Vivien Cartailler, Grégory Imbert, Névine Rochat, Catherine Chaton, Du Vo-Thanh, Daniel Benoit, Geneviève Duchamp, Hélène Frémont Lien HAL : https://hal.science/hal-03489597 (Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stéphane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Helene Fremont Lien HAL : https://hal.science/hal-03467419 From electrical to physical-chemical characterization of the Cu/SiO2 Hybrid-Bonding Interface – A Cu2O-Layer as a Cu Diffusion Barrier? Auteur(s): Stephane Moreau, Herve Manzanarez, Nicolas Bernier, Joris Jourdon, Sandrine Lhostis, Helene Fremont Lien HAL : https://hal.science/hal-03203829 Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging Auteur(s): Pierre Roumanille, Emna Ben Romdhane, Samuel Pin, Patrick Nguyen, Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont Lien HAL : https://hal.science/hal-03375916 Source Separation Using Sensor’s Frequency Response: Theory and Practice on Carbon Nanotubes Sensors Auteur(s): Aurore Quelennec, Éric Duchesne, Hélène Fremont, Dominique A Drouin Lien HAL : https://hal.science/hal-02453566 Sequential combined thermal cycling and vibration test and simulation of printed circuit board Auteur(s): Faical Arabi, Alexandrine Gracia, Hélène Fremont, Jean-Yves Delétage Lien HAL : https://hal.science/hal-02516781 Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Auteur(s): S. Pin, A. Gracia, J.-Y. Delétage, H. Fremont Lien HAL : https://hal.science/hal-02515004 Creep measurement and choice of creep laws for BGA assemblies' reliability simulation Auteur(s): Samuel Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Fremont Lien HAL : https://hal.science/hal-02516790 Moisture diffusion in plasma-enhanced chemical vapor deposition (PECVD) dielectrics characterized with three techniques under clean room conditions Auteur(s): V. Cartailler, G. Imbert, N. Rochat, C. Chaton, D. Vo-Thanh, D. Benoit, G. Duchamp, H. Fremont Lien HAL : https://hal.science/hal-02515324 Evaluation of Hybrid Bonding Interface Quality by Contact Resistivity Measurement Auteur(s): Joris Jourdon, Sandrine Lhostis, Stéphane Moreau, Nicolas Bresson, Pascal Salomé, Hélène Fremont Lien HAL : https://hal.science/hal-02118046 ELLEIEC Project: A contribution to harmonise the European Higher Education Area Auteur(s): Hamed Yahoui, Olivier Bonnaud, Hélène Fremont, Anna Friesel, Samuel Nowakowski, Cristian Perra, Tony Ward Lien HAL : https://hal.science/hal-01991395 Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations Auteur(s): S. Pin, H. Fremont, A. Guédon-Gracia Lien HAL : https://hal.science/hal-01660890 A methodologic project to characterize and model COTS component reliability Auteur(s): André Durier, Alain Bensoussan, Moustafa Zerarka, Chaimae Ghfiri, Alexandre Boyer, Hélène Frémont Lien HAL : https://hal.science/hal-01582570 Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach Auteur(s): S. Hairoud-Airieau, G. Duchamp, Tristan Dubois, J.-Y. Delétage, A. Durier, H. Fremont Lien HAL : https://hal.science/hal-01659294 Editorial, Microelectronics Reliability, Volume 55, Issues 9–10, August–September 2015 Auteur(s): Marise Bafleur, Philippe Perdu, François Marc, Hélène Frémont, Nicolas Nolhier Lien HAL : https://hal.science/hal-01257965 Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications Auteur(s): M. Mickaël Pocheron,, J.-Y. Delétage, B. Plano, Alexandrine Gracia-Guedon, Hélène Fremont Lien HAL : https://hal.science/hal-01257918 Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps Auteur(s): L. Meinshausen, Hélène Frémont, Kirsten Weide-Zaage Lien HAL : https://hal.science/hal-01257984 Dynamical IMC-growth calculation. Auteur(s): L. Meinshausen, K. Weide-Zaage, Hélène Frémont Lien HAL : https://hal.science/hal-01257907 Virtual prototyping in a Design-for-Reliability approach Auteur(s): S. Barnat, A. Guédon-Gracia, Hélène Frémont Lien HAL : https://hal.science/hal-01257900 Qualification procedure for moisture in embedded capacitors Auteur(s): Hélène Frémont, Jörg Kludt, Massar Wade, Geneviève Duchamp, Kirsten Weide-Zaage, Isabelle Bord-Majek Lien HAL : https://hal.science/hal-01091487 Methodological approach for predictive reliability: practical case studies Auteur(s): Hélène Fremont, Geneviève Duchamp, Alexandrine Guedon-Gracia, Frédéric Verdier Lien HAL : https://hal.science/hal-00788556 Electro- and Thermomigration induced Failure Mechanisms in Package on Package Auteur(s): Hélène Fremont, Lutz Meinshausen, Kirsten Weide-Zaage Lien HAL : https://hal.science/hal-00788562 Pushing toward the limits of acceleration: Example on wire-bond assemblies Auteur(s): Jean-Baptiste Jullien, Bernard Plano, Hélène Fremont Lien HAL : https://hal.science/hal-00745987 Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength Auteur(s): S. Barnat, Hélène Fremont, Alexandrine Guedon-Gracia, Eric Cadalen Lien HAL : https://hal.science/hal-00745982 Migration induced IMC formation in SAC305 solder joints on cu, NiAu and NiP metal layers Auteur(s): Lutz Meinshausen, Hélène Fremont, Kisten Weide-Zaage Lien HAL : https://hal.science/hal-00745990 Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps Auteur(s): Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Fremont Lien HAL : https://hal.science/hal-00671262 Toward an International Curricula Network for exchanges and LifeLong Learning Auteur(s): Jean-Marc Thiriet, Fabrice Null Mériaudeau, Juan Carlos Burguillo, Hélène Fremont, Hamed Yahoui, Pierre de Fooz Lien HAL : https://hal.science/hal-00547953 Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage Auteur(s): M. Berthou, P. Retailleau, Hélène Frémont, A. Guédon-Gracia, C. Jéphos-Davennel Lien HAL : https://hal.science/hal-00477613 Wearout estimation using the Robustness Validation methodology for components in 150 °C ambient automotive applications Auteur(s): P. Lecuyer, H. Fremont, J.-P. Landesman, M.-A. Bahi Lien HAL : https://hal.science/hal-00549502 Analysis of 2 aging types for SAC solder joint: accelerated thermal cycling (ATC) and thermal storage Auteur(s): Berthou Matthieu, Pascal Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, Catherine Jéphos-Davennel Lien HAL : https://hal.science/hal-00415091 Functionnal localization in integrated circuits by Signal Selective Voltage Contrast in a scanning electron microscope Auteur(s): François Marc, Hélène Frémont, Paul Jounet, Yves Danto, Michel Barré Lien HAL : https://hal.science/hal-00326620 Quick and exhaustive descrambling methodology for high density static random access memories using voltage contrast Auteur(s): François Marc, Hélène Fremont, Paul Jounet, Yves Danto Lien HAL : https://hal.science/hal-00181886 Photoresist development Model for Linewidth Control in the fabrication of MCM and Customised ASICs Auteur(s): Emmanuel Saint-Christophe, Hélène Fremont, Mohammed Fathi, Yves Danto Lien HAL : https://hal.science/hal-00183962 How to study delamination in plastic encapsulated devices Auteur(s): Hélène Fremont, Jean-Yves Deletage, Kirsten Weide-Zaage, Yves Danto Lien HAL : https://hal.science/hal-00183958 Evaluation of stresses in packaged Ics by in situ measurements with an assembly test chip and simulation Auteur(s): Christine Ducos, Emmanuel Saint-Christophe, Hélène Fremont, Gilles N'Kaoua, Claude Pellet, Yves Danto Lien HAL : https://hal.science/hal-00183120 Improved physical understanding of intermittent failure in continuous monitoring method Auteur(s): Wilsoncarlos Maia-Filho, Michel Brizoux, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00160203 Applications of a theoretical model for Linewidth Control in photoresists sensitised by a laser beam Auteur(s): Emmanuel Saint-Christophe, Hélène Fremont, Gilles N'Kaoua, Yves Danto Lien HAL : https://hal.science/hal-00183961 Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system Auteur(s): Claude Pellet, Marc Lecouve, Hélène Fremont, A. Val Lien HAL : https://hal.science/hal-00183118 A general methodology using an electron beam tester applied to failure localization inside a logic integrated circuit Auteur(s): François Marc, Hélène Fremont, Paul Jounet, M. Barre, Yves Danto Lien HAL : https://hal.science/hal-00181885 Evaluation of the moisture sensitivity of molding compounds of IC's Packages. Auteur(s): Hélène Fremont, Jean-Yves Deletage, Alberto Pintus, Yves Danto Lien HAL : https://hal.science/hal-00183959 Dynamic void formation in a DD-copper-structure with different metallization geometry Auteur(s): Kisten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont Lien HAL : https://hal.science/hal-00160207 Moisture diffusion in Printed Circuit Boards : Measurements and Finite- Element- Simulations Auteur(s): Kirsten Weide-Zaage, Walter Horaud, Hélène Fremont Lien HAL : https://hal.science/hal-00183957 Reliability Evaluation of Adhesive bonded SMT Components in Industrial Applications Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00183960

Conference proceedings (88)

To avoid dropout: let student teach! Second act Auteur(s): Hélène Frémont, Florent Arnal Lien HAL : https://hal.science/hal-03736322 New Method to Perform TDDB Tests for Hybrid Bonding Interconnects Auteur(s): Bassel Ayoub, S. Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Helene Fremont Lien HAL : https://hal.science/hal-03781358 Evaluation of SAC solder joint thermomechanical fatigue in different types of components Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Lien HAL : https://hal.science/hal-03665823 2D Model for moisture diffusion in integrated Low-k dielectrics Auteur(s): Leo Mischler, Vivien Cartailler, Genevieve Duchamp, Helene Fremont, Gregory Imbert, J. Moulard, Olivier Kermarrec Lien HAL : https://hal.science/hal-03666398 Dynamics of the corrosion for SAC305 solder alloy in salt environment Auteur(s): K. Akoda, A. Guedon-Gracia, Éric Lebraud, J.-Y. Deletage, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-03665831 Epoxy Mold Compound Characterization for Modeling Packaging Reliability Auteur(s): Ariane Tomas, Benoit Lambert, Helene Fremont, Nathalie Malbert, Nathalie Labat Lien HAL : https://hal.science/hal-03666406 QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms Auteur(s): E. Ben Romdhane, P. Roumanille, Alexandrine Guedon-Gracia, S. Pin, P. Nguyen, Helene Fremont Lien HAL : https://hal.science/hal-03781126 Reliability of Fan-Out Wafer Level Packaging For III-V RF Power MMICs Auteur(s): Ariane Tomas, Laurent Marechal, Rodrigo Almeida, Mehdy Neffati, Nathalie Malbert, Helene Fremont, Nathalie Labat, Arnaud Garnier Lien HAL : https://hal.science/hal-03336953 Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects Auteur(s): B. Ayoub, S. Lhostis, S. Moreau, E. Leon Perez, J. Jourdon, P. Lamontagne, E. Deloffre, S. Mermoz, C. de Buttet, V. Balan, C. Euvard, Y. Exbrayat, H. Fremont Lien HAL : https://hal.science/hal-03203851 Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Lien HAL : https://hal.science/hal-03336972 To avoid dropout: let student teach! Auteur(s): Helene Fremont, Florent Arnal Lien HAL : https://hal.science/hal-03344467 Moisture diffusion in dense SiO2 and ultra low k integrated stacks Auteur(s): V. Cartailler, G. Imbert, V. Guyader, M. Juhel, P. Lamontagne, M. Rafik, D. Ney, D. Benoit, C. Chaton, J. B. Moulard, G. Duchamp, H. Fremont Lien HAL : https://hal.science/hal-02477172 Initiation à la recherche sur la Fiabilité en microélectronique par la physique :Mini-projets en laboratoire Auteur(s): J-y Deletage, T. Dubois, G. Duchamp, L. Theolier, J-M Vinassa, E. Woirgard, H. Fremont, O. Briat, A. Guédon-Gracia Lien HAL : https://hal.science/hal-02516984 Integration of carbon nanotube-based sensors to a flip-chip package for micro-strain detection in microelectronic package Auteur(s): Julien Pezard, Yosri Ayadi, A Elshaer, E Duchesne, Hélène Frémont, Dominique Drouin Lien HAL : https://hal.science/hal-02453585 Vibration test and simulation of printed circuit board Auteur(s): Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Fremont Lien HAL : https://hal.science/hal-02516844 Statistical study of SAC solder joints in QFN and BGA assemblies Auteur(s): A. Gracia, A. Badetz, F. Arabi, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-02477114 Moisture uptake of PECVD dielectrics at ambient and accelerated Test Conditions Auteur(s): V. Cartailler, G. Imbert, G. Duchamp, H. Fremont Lien HAL : https://hal.science/hal-02477098 Readout Circuit Implemented on PCB-Level for Embedded CNT Sensors Auteur(s): Quentin Vandier, Julien Pezard, Hélène Fremont, Eric Duchesne, Dominique Drouin Lien HAL : https://hal.science/hal-02895351 La carte à puce : du sable au silicium Auteur(s): Hélène Frémont Lien HAL : https://hal.science/hal-02517402 Electromigration Effects in Corroded BGA Auteur(s): Kirsten Weide-Zaage, Alexandrine Guedon-Gracia, Hélène Fremont Lien HAL : https://hal.science/hal-02516854 Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Auteur(s): Samuel Pin, Alexandrine Guedon-Gracia, Jean-Yves Delétage, Julie Fouquet, Hélène Fremont Lien HAL : https://hal.science/hal-02516819 A highly sensitive humidity sensor integrated to a flip-chip package for moisture detection in electronics package Auteur(s): A. Quelennec, U. Shafique, E Duchesne, H. Fremont, D. Drouin Lien HAL : https://hal.science/hal-02096949 Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness Auteur(s): J. Jourdon, S. Lhostis, S. Moreau, J. Chossat, M. Arnoux, C. Sart, Y. Henrion, P. Lamontagne, L. Arnaud, N. Bresson, V. Balan, C. Euvrard, Y. Exbrayat, D. Scevola, E. Deloffre, S. Mermoz, A. Martin, H. Bilgen, F. André, C. Charles, D. Bouchu, A. Farcy, S. Guillaumet, A. Jouve, H. Fremont, S. Cheramy Lien HAL : https://hal.science/hal-02118042 Smart Packaging: A micro-sensor array integrated to a flip-chip package to investigate the effect of humidity in microelectronics package Auteur(s): A. Quelennec, U. Shafique, E Duchesne, H. Fremont, D. Drouin Lien HAL : https://hal.science/hal-02097247 Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package Auteur(s): Aurore Quelennec, Yosri Ayadi, Quentin Vandier, Eric Duchesne, Hélène Fremont, Dominique A Drouin Lien HAL : https://hal.science/hal-02074111 Numerical study of thermomechanical fatigue influence of intermetallic compounds in a lead free solder joint Auteur(s): Samuel Pin, Hélène Frémont, Alexandra Gracia Lien HAL : https://hal.science/hal-01688091 Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package Auteur(s): Aurore Quelennec, Umar Shafique, Éric Duchesne, Hélène Frémont, Dominique Drouin Lien HAL : https://hal.science/hal-01660889 Lead free solder joints characterisation using single lap shear tests Auteur(s): Samuel Pin, Hélène Frémont, Alexandrine Guedon-Gracia Lien HAL : https://hal.science/hal-01660937 Measurement and Simulation of Electromagnetic Drift for Obsolescence Management in Electronics Auteur(s): Geneviève Duchamp, Tristan Dubois, Ala Ayed, Christian Marot, Hélène Fremont Lien HAL : https://hal.science/hal-01153333 Measurement and simulation of electromagnetic drift for obsolescence management in electronics Auteur(s): Geneviève Duchamp, Tristan Dubois, Ala Ayed, Christian Marot, Hélène Fremont Lien HAL : https://hal.science/hal-01180999 Simulations and Measurements to Predict EMC Characteristics in Electronic Assemblies: Obsolescence Management Auteur(s): Geneviève Duchamp, Tristan Dubois, Hélène Frémont Lien HAL : https://hal.science/hal-01153323 How SI/EMC and reliability issues could interact together in embedded electronic systems? Auteur(s): K. Weide-Zaage, A. Moujbani, G. Duchamp, Tristan Dubois, Frédéric Verdier, H. Fremont Lien HAL : https://hal.science/hal-01180993 Investigation of Chip-Package Interaction in 3D Integration Auteur(s): K. Weide-Zaage, Hélène Fremont, J. Kludt, Angélique Tételin Lien HAL : https://hal.science/hal-00931476 Electromigration Reliability of Cylindrical Cu Pillar SnAg3.0Cu0.5 Bumps Auteur(s): L. Meinshausen, K. Weide-Zaage, B. Goldbeck, A. Moujbania, J. Kludt, H. Fremont Lien HAL : https://hal.science/hal-00981795 Criteria of the EIE courses accessible to disabled students. Legibility of cursus and experiences sharing for generalizing good practices Auteur(s): François Demontoux, Hélène Fremont, Eric Woirgard Lien HAL : https://hal.science/hal-00853821 Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing Auteur(s): L. Meinshausen, K. Weide-Zaage, Hélène Fremont Lien HAL : https://hal.science/hal-00853811 Evaluation of Quasi-Hermetic Packaging Solutions for Active Microwave Devices and Space Applications Auteur(s): Ben Naceur W., N. Malbert, N. Labat, H. Fremont, J.L. Muraro, P. Monfraix Lien HAL : https://hal.science/hal-00799929 Amélioration de la lisibilité des formations de l'EEA accessibles aux étudiants en situation de handicap - Vers une mutualisation des expériences et une généralisation des bonnes pratiques Auteur(s): François Demontoux, Hélène Fremont, Eric Woirgard Lien HAL : https://hal.science/hal-00873510 Field return on a Chinese-French double graduation of an International Master in Microelectronics on the Base of the Bologna Process Auteur(s): Olivier Bonnaud, Lotfi Senhadji, Lei Wei, Limin Luo, Hélène Frémont, Huazhong Shu Lien HAL : https://hal.science/hal-00479107 International dimension to increase Lifelong Learning possibilities in Europe Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Olivier Bonnaud, A. Friesel, Hélène Fremont, Maria João Martins Lien HAL : https://hal.science/hal-00773156 Stage de microassemblage Pôle CNFM de Bordeaux / IMS Bordeaux : réalisation de circuits hybrides et capteurs Auteur(s): Hélène Debéda, Corinne Dejous, Hélène Frémont, Alexandrine Gracia, Isabelle Favre, Jean-Luc Lachaud, Bernard Plano, Jean Tomas Lien HAL : https://hal.science/hal-00744834 On the way of harmonization of PhD in Europe in Electrical and Information Engineering: status and recommendations Auteur(s): Olivier Bonnaud, Hélène Fremont, Jean-Marc Thiriet Lien HAL : https://hal.science/hal-00676189 Underfill and mold compound influence on PoP ageing under high current and high temperature stresses Auteur(s): L. Meinshausen, K. Weide-Zaage, H. Fremont Lien HAL : https://hal.science/hal-00716406 Obtenir un doctorat en EEA par la voie de la formation continue en Europe : les pistes Auteur(s): Olivier Bonnaud, Hélène Fremont, Jean-Marc Thiriet, Hamed Yahoui Lien HAL : https://hal.science/hal-00658623 International dimension to increase Lifelong Learning possibilities in Europe Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Hélène Fremont Lien HAL : https://hal.science/hal-00719906 Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards Auteur(s): Hassene Fridhi, Geneviève Duchamp, Valerie Vigneras, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Hélène Fremont, Tristan Dubois Lien HAL : https://hal.science/hal-00709116 Set-in LifeLong Learning for PhD students in Electrical and Information Engineering Auteur(s): Olivier Bonnaud, Jean-Marc Thiriet, Hélène Frémont Lien HAL : https://hal.science/hal-00617944 Evaluation des solutions de packaging quasi-hermétique sur composants actifs hyperfréquences Auteur(s): Walim Ben Naceur, Nathalie Malbert, Nathalie Labat, Hélène Fremont, Jean-Luc Muraro, Philippe Monfraix Lien HAL : https://hal.science/hal-00585624 Prediction of Electromigration Induced Void Formation in TSV and SAC Contacts Auteur(s): Kirsten Weide-Zaage, Lutz Meinshausen, Hélène Fremont Lien HAL : https://hal.science/hal-00639192 Active pedagogy: A practical experiment at the Institut Universitaire de Technologie Bordeaux Auteur(s): H. Fremont, G. Couturier, C. Pellet, L. Bechou Lien HAL : https://hal.science/hal-00577603 ELLEIEC implementation issues in EIE: State of advancement Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Olivier Bonnaud, A. Friesel, Hélène Frémont Lien HAL : https://hal.science/hal-00617945 Virtual prototyping of PoP interconnections regarding electrically activated mechanisms Auteur(s): Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont, Wei Feng Lien HAL : https://hal.science/hal-00477596 Toward an International Curricula Network for exchanges and LifeLong Learning Auteur(s): Jean-Marc Thiriet, Fabrice Null Mériaudeau, Juan Carlos Burguillo, Hélène Fremont, Hamed Yahoui, Pierre de Fooz Lien HAL : https://hal.science/hal-00529223 Die Attach Interface Property Characterization as Function of Temperature Using Cohesive Zone Modeling Method Auteur(s): Xiaosong Ma, G.Q. Zhang, Olaf van Der Sluis, Kaspar M.B. Jansen, Willem D van Driel, Leo J. Ernst, Charles Regard, Christian Gautier, Hélène Frémont Lien HAL : https://hal.science/hal-00477599 Mise en place d'une pédagogie d'apprentissage par problèmes au département GEII de l'IUT Bordeaux Auteur(s): Hélène Fremont, S. Moutault, I. Bord, B. Caillard, Francois Demontoux, Stéphane Grauby, P. Sentenac, M. Tarisien Lien HAL : https://hal.science/hal-00467949 Influence of PCB design and materials on chip solder joint reliability Auteur(s): Matthieu Berthou, Hélène Frémont, Alexandrine Gracia, Catherine Jéphos-Davennel Lien HAL : https://hal.science/hal-00477591 ELLEIEC Enhancing Lifelong Learning for the Electrical and Information Engineering Community Auteur(s): Hamed Yahoui, Olivier Bonnaud, Cyril Burkley, Hélène Frémont, Michael Hoffmann, Maria Joao Martins, Christian Perra, Jean-Marc Thiriet, Anthony E. Ward Lien HAL : https://hal.science/hal-00467961 Field return on a Chinese-French double graduation of an International Master in Electronics and Telecommunications on the Base of the Bologna Process Auteur(s): Olivier Bonnaud, Lotfi Senhadji, Hélène Fremont, Lei Wei, Huazhong Shu, Limin Luo Lien HAL : https://hal.science/hal-00506972 Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Auteur(s): Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen, Catherine Bunel, François Neuilly, Jean-René Tenailleau Lien HAL : https://hal.science/hal-00477594 Balance of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, Michel Robert, Maria Joao Martins, Anthony E. Ward, Daniel Pasquet, D. Deniz, Hamed Yahoui, Olivier Bonnaud, Michael Hoffmann, Hélène Fremont Lien HAL : https://hal.science/hal-00364333 Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires Auteur(s): Bahi M.A., P. Lecuyer, A. Gentil, H. Fremont, Jean-Pierre Landesman, Frédéric Christien Lien HAL : https://hal.science/hal-00400185 ELLEIEC Enhancing Lifelong Learning for the Electrical and Information Engineering Community Auteur(s): H. Yahoui, C. Burkley, H. Fremont, M. Hoffmann, M. J. Martins, C. Perra, Jean-Marc Thiriet, A. E. Ward Lien HAL : https://hal.science/hal-00400179 Results and dissemination of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, Anthony E. Ward, Maria Joao Martins, D. Deniz, Daniel Pasquet, Michael Hoffmann, Hélène Fremont, Hamed Yahoui, Olivier Bonnaud, Michel Robert, J. Barsics, José Vincente Benlloch-Dualde Lien HAL : https://hal.science/hal-00399569 Results and dissemination of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, E. Ward A., J. Martins M., D. Deniz, D. Pasquet, M. Hoffmann, H. Fremont, H. Yahoui, O. Bonnaud, M. Robert, J. Barsics, J.V. Benlloch-Dualde Lien HAL : https://hal.science/hal-00400182 Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging Auteur(s): Charles Regard, Christian Gautier, Hélène Fremont, Patrick Poirier Lien HAL : https://hal.science/hal-00323432 Solder fatigue of wafer level package assemblies. Comparison with flip chip BGA's Auteur(s): Charles Regard, Christian Gautier, Hélène Frémont, Alexandre Val, Frédéric Roullier, Patrick Schwindenhammer Lien HAL : https://hal.science/hal-00323406 A Survey of the Evolution of the Bologna Process in EIE in Europe Auteur(s): Maria Joao Martins, Jean-Marc Thiriet, Olivier Bonnaud, Michael Hoffmann, Michel Robert, José Vincente Benlloch-Dualde, Anthony E. Ward, Hamed Yahoui, Hélène Fremont Lien HAL : https://hal.science/hal-00318724 Analytical model for thermally-induced warpage of POP Auteur(s): Wei Feng, Hélène Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00326445 Moisture Diffusion Model Verification of Packaging Materials Auteur(s): Xiaosong Ma, Kaspar-M.B. Jansen, L.J. Ernst, Willelm-D van Driel, Olaf van Der Sluis, Kuchi Zhang, Charles Regard, Christian Gautier, Hélène Frémont Lien HAL : https://hal.science/hal-00323425 SiP vs SoC : An application-driven perspective Auteur(s): Geneviève Duchamp, Hélène Frémont, Alexandrine Guédon-Gracia, Frédéric Verdier Lien HAL : https://hal.science/hal-00327271 BJT avalanche breakdown voltage improvement by introduction of a floating P-layer in the epitaxial collector region Auteur(s): Thomas Zimmer, M. N?doye, Noelle Lewis, Jean Batiste Duluc, Helene Fremont, Jean Paul Dom Lien HAL : https://hal.science/hal-00189380 Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry Auteur(s): Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Fremont Lien HAL : https://hal.science/hal-00183966 Thermomechanical Behaviour of Adhesive Jointed SMT Components Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Davide Carboni, Hélène Fremont, Yves Danto, Christiane Faure Lien HAL : https://hal.science/hal-00183973 Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system Auteur(s): Claude Pellet, Marc Lecouve, Hélène Fremont, A. Val Lien HAL : https://hal.science/hal-00183144 Evolution of Reliability Assessment In PCB Assemblies Auteur(s): Yves Danto, Jean-Yves Deletage, Frédéric Verdier, Hélène Fremont Lien HAL : https://hal.science/hal-00183967 A fast VLSI SRAM mapping methodology using voltage contrast techniques on SEM Auteur(s): François Marc, Hélène Fremont, Paul Jounet, Andre Touboul, Yves Danto Lien HAL : https://hal.science/hal-00181911 Life prediction of BGA and CSP assemblies using an experimental degradation law and fem simulations Auteur(s): Jean-Yves Deletage, Hélène Fremont, Patrick Louis, Yves Danto, Bernard Plano, Bertrand Carbonne Lien HAL : https://hal.science/hal-00183968 Industrial use of conductive adhesives for SMT assemblie Auteur(s): Marie-Genevieve Perichaud, Hélène Fremont, Michel Salagoity, Christiane Faure, Yves Danto Lien HAL : https://hal.science/hal-00183971 approach of integrated circuits failure location by voltage contrast in a scanning electron microscope Auteur(s): François Marc, Hélène Fremont, Paul Jounet, Yves Danto, M. Barre, C. Nouet Lien HAL : https://hal.science/hal-00181909 Evaluation of stresses in packaged Ics by in situ measurements with an assembly test chip and simulation Auteur(s): Christine Ducos, Emmanuel Saint-Christophe, Hélène Fremont, Gilles N'Kaoua, Claude Pellet, Yves Danto Lien HAL : https://hal.science/hal-00183151 Some Mechanical and Metallurgical Aspects of the Degradation in Interconnects Auteur(s): Michel Ignat, Hélène Fremont, Jean-Yves Deletage, Yves Danto Lien HAL : https://hal.science/hal-00183965 Vieillissement par pénétration d humidité des résines d enrobage de circuits intégrés Auteur(s): Jean-Yves Deletage, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00183969 Report des composants CMS à l'aide d'une colle conductrice Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Yves Ousten, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00182921 Test chip for qualification of packaging assemblies Auteur(s): Jean-Yves Deletage, Hélène Fremont, Olivier Puig, Claude Pellet, Pascal Fouillat, Yves Danto Lien HAL : https://hal.science/hal-00183081 Optimisation of an Assembling Process of Passive Components reported with Conductive Adhesives Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Gilles N'Kaoua, Hélène Fremont, Yves Danto, Olivier Puig Lien HAL : https://hal.science/hal-00183972 Design for reliability - Impact of microvia technology and assembly process. Auteur(s): Walter Horaud, Hélène Fremont, Bernard Plano, Sylvain Leroux Lien HAL : https://hal.science/hal-00183963 Impact of the PCB Design on the Crack Risk of CSPs Assemblies Subjected to Temperature Cycling and Drop Tests Auteur(s): H. Fremont, M. Mura, W. Horaud, Y. Danto Lien HAL : https://hal.science/hal-00160699 Evaluation of conductive adhesives for industrial SMT assemblies Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto, Christiane Faure, Michel Salagoity Lien HAL : https://hal.science/hal-00183970

Invited lectures (16)

Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test Auteur(s): Komlan Elom Akoda, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Bernard Plano, Helene Fremont Lien HAL : https://hal.science/hal-04273292 Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs Auteur(s): Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont Lien HAL : https://hal.science/hal-04166906 Using X-ray imaging for the study of crack development in solder reliability testing Auteur(s): Pierre Roumanille, Julien Lesseur, Julien Uzanu, Hoa Le Trong, Emna Ben Romdhane, Alexandrine Guedon-Gracia, Helene Fremont Lien HAL : https://hal.science/hal-04273250 Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack Auteur(s): Leo Mischler, Vivien Cartailler, Gregory Imbert, Genevieve Duchamp, Helene Fremont Lien HAL : https://hal.science/hal-04273097 Moisture absorption and desorption in epoxy mould compounds: Characterization of Fickian and non-Fickian behaviours in complex packages Auteur(s): Ariane Tomas, Helene Fremont, Nathalie Malbert, Mehdy Neffati, Benoit Lambert Lien HAL : https://hal.science/hal-04273061 Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe Auteur(s): Louise Dumas, Christina Villeneuve-Faure, Francois Marc, Helene Fremont, Christophe Guerin, Guillaume Bascoul Lien HAL : https://hal.science/hal-04273084 Reliability of the hybrid bonding level using submicrometric bonding pads Auteur(s): Sandrine Lhostis, Bassel Ayoub, Helene Fremont, Stephane Moreau, Jean-Gabriel Mattei, Patrick Lamontagne, Arnaud Tournier Lien HAL : https://hal.science/hal-04273117 Etude de fiabilité en microélectronique : principes généraux et nouvelles approches Auteur(s): Hélène Frémont Lien HAL : https://hal.science/hal-02519525 Etude de fiabilité en microélectronique : principes généraux et nouvelles approches Auteur(s): Hélène Frémont Lien HAL : https://hal.science/hal-02517122 Fiabilité des assemblages micro et nano-électroniques ; approche par la physique des défaillances Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-01257994 Coordination and Alignment of Electrical and Information Engineering in European Higher Education Institutions Auteur(s): A. Friesel, Jean-Marc Thiriet, T. Wards, Hamed Yahoui, Olivier Bonnaud, Hélène Fremont, Joao Martins Maria Lien HAL : https://hal.science/hal-01102844 Parameter extraction for simulations: silicon strength after thinning process Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00950182 Thermo-mechanical reliability issues in complex microelectronic assemblies: methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00853814 Thermo-mechanical reliability issues in complex microelectronic assemblies: methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00780832 Thermal mechanical reliability issues in complex micro- and nano- electronic assemblies: a methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00853816 How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00477588

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