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Monfraix Lien HAL : https://hal.science/hal-00799929v1 Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing Auteur(s): L. Meinshausen, K. Weide-Zaage, Hélène Fremont Lien HAL : https://hal.science/hal-00853811v1 Amélioration de la lisibilité des formations de l'EEA accessibles aux étudiants en situation de handicap - Vers une mutualisation des expériences et une généralisation des bonnes pratiques Auteur(s): François Demontoux, Hélène Fremont, Eric Woirgard Lien HAL : https://hal.science/hal-00873510v1 Field return on a Chinese-French double graduation of an International Master in Microelectronics on the Base of the Bologna Process Auteur(s): Olivier Bonnaud, Lotfi Senhadji, Lei Wei, Limin Luo, Hélène Frémont, Huazhong Shu Lien HAL : https://hal.science/hal-00479107v1 International dimension to increase Lifelong Learning possibilities in Europe Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Olivier Bonnaud, A. Friesel, Hélène Fremont, Maria João Martins Lien HAL : https://hal.science/hal-00773156v1 Stage de microassemblage Pôle CNFM de Bordeaux / IMS Bordeaux : réalisation de circuits hybrides et capteurs Auteur(s): Hélène Debéda, Corinne Dejous, Hélène Frémont, Alexandrine Gracia, Isabelle Favre, Jean-Luc Lachaud, Bernard Plano, Jean Tomas Lien HAL : https://hal.science/hal-00744834v1 On the way of harmonization of PhD in Europe in Electrical and Information Engineering: status and recommendations Auteur(s): Olivier Bonnaud, Hélène Fremont, Jean-Marc Thiriet Lien HAL : https://hal.science/hal-00676189v1 Underfill and mold compound influence on PoP ageing under high current and high temperature stresses Auteur(s): L. Meinshausen, K. Weide-Zaage, H. Fremont Lien HAL : https://hal.science/hal-00716406v1 Obtenir un doctorat en EEA par la voie de la formation continue en Europe : les pistes Auteur(s): Olivier Bonnaud, Hélène Fremont, Jean-Marc Thiriet, Hamed Yahoui Lien HAL : https://hal.science/hal-00658623v1 International dimension to increase Lifelong Learning possibilities in Europe Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Hélène Fremont Lien HAL : https://hal.science/hal-00719906v1 Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards Auteur(s): Hassene Fridhi, Geneviève Duchamp, Valerie Vigneras, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Hélène Fremont, Tristan Dubois Lien HAL : https://hal.science/hal-00709116v1 Set-in LifeLong Learning for PhD students in Electrical and Information Engineering Auteur(s): Olivier Bonnaud, Jean-Marc Thiriet, Hélène Frémont Lien HAL : https://hal.science/hal-00617944v1 Evaluation des solutions de packaging quasi-hermétique sur composants actifs hyperfréquences Auteur(s): Walim Ben Naceur, Nathalie Malbert, Nathalie Labat, Hélène Fremont, Jean-Luc Muraro, Philippe Monfraix Lien HAL : https://hal.science/hal-00585624v1 Prediction of Electromigration Induced Void Formation in TSV and SAC Contacts Auteur(s): Kirsten Weide-Zaage, Lutz Meinshausen, Hélène Fremont Lien HAL : https://hal.science/hal-00639192v1 ELLEIEC implementation issues in EIE: State of advancement Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Olivier Bonnaud, A. Friesel, Hélène Frémont Lien HAL : https://hal.science/hal-00617945v1 Active pedagogy: A practical experiment at the Institut Universitaire de Technologie Bordeaux Auteur(s): H. Fremont, G. Couturier, C. Pellet, L. Bechou Lien HAL : https://hal.science/hal-00577603v1 Virtual prototyping of PoP interconnections regarding electrically activated mechanisms Auteur(s): Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont, Wei Feng Lien HAL : https://hal.science/hal-00477596v1 Toward an International Curricula Network for exchanges and LifeLong Learning Auteur(s): Jean-Marc Thiriet, Fabrice Null Mériaudeau, Juan Carlos Burguillo, Hélène Fremont, Hamed Yahoui, Pierre de Fooz Lien HAL : https://hal.science/hal-00529223v1 Die Attach Interface Property Characterization as Function of Temperature Using Cohesive Zone Modeling Method Auteur(s): Xiaosong Ma, G.Q. Zhang, Olaf van Der Sluis, Kaspar M.B. Jansen, Willem D van Driel, Leo J. Ernst, Charles Regard, Christian Gautier, Hélène Frémont Lien HAL : https://hal.science/hal-00477599v1 Mise en place d'une pédagogie d'apprentissage par problèmes au département GEII de l'IUT Bordeaux Auteur(s): Hélène Fremont, S. Moutault, I. Bord, B. Caillard, Francois Demontoux, Stéphane Grauby, P. Sentenac, M. Tarisien Lien HAL : https://hal.science/hal-00467949v1 Influence of PCB design and materials on chip solder joint reliability Auteur(s): Matthieu Berthou, Hélène Frémont, Alexandrine Gracia, Catherine Jéphos-Davennel Lien HAL : https://hal.science/hal-00477591v1 Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Auteur(s): Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen, Catherine Bunel, François Neuilly, Jean-René Tenailleau Lien HAL : https://hal.science/hal-00477594v1 ELLEIEC Enhancing Lifelong Learning for the Electrical and Information Engineering Community Auteur(s): Hamed Yahoui, Olivier Bonnaud, Cyril Burkley, Hélène Frémont, Michael Hoffmann, Maria Joao Martins, Christian Perra, Jean-Marc Thiriet, Anthony E. Ward Lien HAL : https://hal.science/hal-00467961v1 Field return on a Chinese-French double graduation of an International Master in Electronics and Telecommunications on the Base of the Bologna Process Auteur(s): Olivier Bonnaud, Lotfi Senhadji, Hélène Fremont, Lei Wei, Huazhong Shu, Limin Luo Lien HAL : https://hal.science/hal-00506972v1 Moisture induced effects in PoP Auteur(s): A. Guédon-Gracia, W. Feng, J.-Y. Delétage, F. Verdier, Hélène Frémont Lien HAL : https://hal.science/hal-00385358v1 Balance of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, Michel Robert, Maria Joao Martins, Anthony E. Ward, Daniel Pasquet, D. Deniz, Hamed Yahoui, Olivier Bonnaud, Michael Hoffmann, Hélène Fremont Lien HAL : https://hal.science/hal-00364333v1 Electrically driven matter transport effects in PoP interconnections Auteur(s): W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, Hélène Frémont Lien HAL : https://hal.science/hal-00385360v1 Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires Auteur(s): Bahi M.A., P. Lecuyer, A. Gentil, H. Fremont, Jean-Pierre Landesman, Frédéric Christien Lien HAL : https://hal.science/hal-00400185v1 Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires Auteur(s): Bahi M.A., P. Lecuyer, Hélène Frémont, A. Gentil, Jean-Pierre Landesman, Frédéric Christien Lien HAL : https://hal.science/hal-00399566v1 Results and dissemination of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, E. Ward A., J. Martins M., D. Deniz, D. Pasquet, M. Hoffmann, H. Fremont, H. Yahoui, O. Bonnaud, M. Robert, J. Barsics, J.V. Benlloch-Dualde Lien HAL : https://hal.science/hal-00400182v1 Results and dissemination of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, Anthony E. Ward, Maria Joao Martins, D. Deniz, Daniel Pasquet, Michael Hoffmann, Hélène Fremont, Hamed Yahoui, Olivier Bonnaud, Michel Robert, J. Barsics, José Vincente Benlloch-Dualde Lien HAL : https://hal.science/hal-00399569v1 ELLEIEC Enhancing Lifelong Learning for the Electrical and Information Engineering Community Auteur(s): H. Yahoui, C. Burkley, H. Fremont, M. Hoffmann, M. J. Martins, C. Perra, Jean-Marc Thiriet, A. E. Ward Lien HAL : https://hal.science/hal-00400179v1 Puces assemblées en flip-chip : comparaison normes « drop-test ». Auteur(s): Hélène Frémont, Stéphane Forster, Yassine Bentata Lien HAL : https://hal.science/hal-00323441v1 Observatory of the Bologna-process in EIE: an aid for the enhancement of mobility Auteur(s): Jean-Marc Thiriet, Maria-J. Martins, Hamed Yahoui, Michel Robert, Hélène Frémont Lien HAL : https://hal.science/hal-00321973v1 Study of JEDEC B-condition JESD22-B111 Standard for Drop Test Reliability of Chip Scale Packages Auteur(s): Yassine Bentata, Stéphane Forster, K. Y. Goh, Hélène Frémont Lien HAL : https://hal.science/hal-00323417v1 Solder fatigue of wafer level package assemblies. Comparison with flip chip BGA's Auteur(s): Charles Regard, Christian Gautier, Hélène Frémont, Alexandre Val, Frédéric Roullier, Patrick Schwindenhammer Lien HAL : https://hal.science/hal-00323406v1 Analytical Model for Thermally-induced Warpage of POP Auteur(s): Wei Feng, Helene Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00323410v1 Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging Auteur(s): Charles Regard, Christian Gautier, Hélène Fremont, Patrick Poirier Lien HAL : https://hal.science/hal-00323432v1 High Density IC Packaging Reliability Auteur(s): Geneviève Duchamp, Alexandrine Guedon-Gracia, Frédéric Verdier, Hélène Frémont Lien HAL : https://hal.science/hal-00323388v1 Existing and new Tools to improve student mobility at university level in Electrical and information engineering Auteur(s): Yahoui Hamed, Ligus Jan, Jean-Marc Thiriet, Genon-Catalot Denis, Hélène Frémont Lien HAL : https://hal.science/hal-00321970v1 Experiences with Personal Professional Project (PPP) Auteur(s): Hélène Dufau, Hélène Frémont, Florent Richard Lien HAL : https://hal.science/hal-00323374v1 Development of an HMI Based on the OPC Standard Auteur(s): Serge Bouter, Rachid Malti, Hélène Frémont Lien HAL : https://hal.science/hal-00323382v1 Simple Analytical Model for Thermally-induced Warpage of POP Auteur(s): Wei Feng, Hélène Frémont, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00323385v1 Life time prediction of BGA assemblies with experimental torsion test and finite element analysis Auteur(s): Wilson-Carlos Maia Filho, Hélène Frémont, Michel Brizoux, Yves Danto Lien HAL : https://hal.science/hal-00323420v1 A Survey of the Evolution of the Bologna Process in EIE in Europe Auteur(s): Maria Joao Martins, Jean-Marc Thiriet, Olivier Bonnaud, Michael Hoffmann, Michel Robert, José Vincente Benlloch-Dualde, Anthony E. Ward, Hamed Yahoui, Hélène Fremont Lien HAL : https://hal.science/hal-00318724v1 Analytical model for thermally-induced warpage of POP Auteur(s): Wei Feng, Hélène Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00326445v1 Moisture Diffusion Model Verification of Packaging Materials Auteur(s): Xiaosong Ma, Kaspar-M.B. Jansen, L.J. Ernst, Willelm-D van Driel, Olaf van Der Sluis, Kuchi Zhang, Charles Regard, Christian Gautier, Hélène Frémont Lien HAL : https://hal.science/hal-00323425v1 Effect of packaging materials aging properties on die surface cracking of a SiP carrier Auteur(s): Xiaosong Ma, Kaspar-M.B. Jansen, L.J. Ernst, Willelm-D van Driel, Olaf van Der Sluis, Kuchi Zhang, Charles Regard, Christian Gauthier, Hélène Frémont Lien HAL : https://hal.science/hal-00323423v1 SiP vs SoC : An application-driven perspective Auteur(s): Geneviève Duchamp, Hélène Frémont, Alexandrine Guédon-Gracia, Frédéric Verdier Lien HAL : https://hal.science/hal-00327271v1 New Results for the EIE-Surveyor Project 19th EAEEIE conference Auteur(s): Jean-Marc Thiriet, Michel Robert, Maria-J. Martins, Anthony- E. Ward, Olivier Bonnaud, Michael Hoffmann, Hamed Yahoui, Hélène Frémont Lien HAL : https://hal.science/hal-00323380v1 EIE-Surveyor : un programme européen pour favoriser les échanges et la reconnaissance des diplômes au niveau européen Auteur(s): Olivier Bonnaud, Hélène Frémont, Maria- J .Martins, Daniel Pasquet, Michel Robert, Jean-Marc Thiriet, Hamed Yahoui Lien HAL : https://hal.science/hal-00323375v1 Le projet professionnel personnel au département Geii de l'Université Bordeaux 1 Auteur(s): Hélène Frémont, Hélène Dufau, Hervé Lévi, Florent Richard Lien HAL : https://hal.science/hal-00323377v1 Simulation of Migration effects in PoP Auteur(s): Kirsten Weide-Zaage, Li Wang, Hélène Frémont Lien HAL : https://hal.science/hal-00323415v1 Thermomechanical Behaviour of Adhesive Jointed SMT Components Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Davide Carboni, Hélène Fremont, Yves Danto, Christiane Faure Lien HAL : https://hal.science/hal-00183973v1 BJT avalanche breakdown voltage improvement by introduction of a floating P-layer in the epitaxial collector region Auteur(s): Thomas Zimmer, M. N?doye, Noelle Lewis, Jean Batiste Duluc, Helene Fremont, Jean Paul Dom Lien HAL : https://hal.science/hal-00189380v1 Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry Auteur(s): Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Fremont Lien HAL : https://hal.science/hal-00183966v1 approach of integrated circuits failure location by voltage contrast in a scanning electron microscope Auteur(s): François Marc, Hélène Fremont, Paul Jounet, Yves Danto, M. Barre, C. Nouet Lien HAL : https://hal.science/hal-00181909v1 Industrial use of conductive adhesives for SMT assemblie Auteur(s): Marie-Genevieve Perichaud, Hélène Fremont, Michel Salagoity, Christiane Faure, Yves Danto Lien HAL : https://hal.science/hal-00183971v1 Life prediction of BGA and CSP assemblies using an experimental degradation law and fem simulations Auteur(s): Jean-Yves Deletage, Hélène Fremont, Patrick Louis, Yves Danto, Bernard Plano, Bertrand Carbonne Lien HAL : https://hal.science/hal-00183968v1 Evolution of Reliability Assessment In PCB Assemblies Auteur(s): Yves Danto, Jean-Yves Deletage, Frédéric Verdier, Hélène Fremont Lien HAL : https://hal.science/hal-00183967v1 Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system Auteur(s): Claude Pellet, Marc Lecouve, Hélène Fremont, A. Val Lien HAL : https://hal.science/hal-00183144v1 A fast VLSI SRAM mapping methodology using voltage contrast techniques on SEM Auteur(s): François Marc, Hélène Fremont, Paul Jounet, Andre Touboul, Yves Danto Lien HAL : https://hal.science/hal-00181911v1 Report des composants CMS à l'aide d'une colle conductrice Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Yves Ousten, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00182921v1 Vieillissement par pénétration d humidité des résines d enrobage de circuits intégrés Auteur(s): Jean-Yves Deletage, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00183969v1 Evaluation of stresses in packaged Ics by in situ measurements with an assembly test chip and simulation Auteur(s): Christine Ducos, Emmanuel Saint-Christophe, Hélène Fremont, Gilles N'Kaoua, Claude Pellet, Yves Danto Lien HAL : https://hal.science/hal-00183151v1 Some Mechanical and Metallurgical Aspects of the Degradation in Interconnects Auteur(s): Michel Ignat, Hélène Fremont, Jean-Yves Deletage, Yves Danto Lien HAL : https://hal.science/hal-00183965v1 Test chip for qualification of packaging assemblies Auteur(s): Jean-Yves Deletage, Hélène Fremont, Olivier Puig, Claude Pellet, Pascal Fouillat, Yves Danto Lien HAL : https://hal.science/hal-00183081v1 Design for reliability - Impact of microvia technology and assembly process. Auteur(s): Walter Horaud, Hélène Fremont, Bernard Plano, Sylvain Leroux Lien HAL : https://hal.science/hal-00183963v1 Impact of the PCB Design on the Crack Risk of CSPs Assemblies Subjected to Temperature Cycling and Drop Tests Auteur(s): H. Fremont, M. Mura, W. Horaud, Y. Danto Lien HAL : https://hal.science/hal-00160699v1 Optimisation of an Assembling Process of Passive Components reported with Conductive Adhesives Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Gilles N'Kaoua, Hélène Fremont, Yves Danto, Olivier Puig Lien HAL : https://hal.science/hal-00183972v1 Evaluation of conductive adhesives for industrial SMT assemblies Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto, Christiane Faure, Michel Salagoity Lien HAL : https://hal.science/hal-00183970v1 Fiabilité des assemblages microélectroniques complexes Auteur(s): Frédéric Verdier, Geneviève Duchamp, Hélène Frémont Lien HAL : https://hal.science/hal-00167725v1Invited lectures (19)
Towards measurements of global coefficient of thermal expansion of QFN Auteur(s): Vincent Sisomseun, Olivier Maire, Pascal Retailleau, Catherine Jephos, Helene Fremont, Alexandrine Guedon-Gracia Lien HAL : https://hal.science/hal-04965121v1 Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test Auteur(s): Komlan Elom Akoda, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Bernard Plano, Helene Fremont Lien HAL : https://hal.science/hal-04273292v1 Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack Auteur(s): Leo Mischler, Vivien Cartailler, Gregory Imbert, Genevieve Duchamp, Helene Fremont Lien HAL : https://hal.science/hal-04273097v1 Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs Auteur(s): Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont Lien HAL : https://hal.science/hal-04166906v1 Using X-ray imaging for the study of crack development in solder reliability testing Auteur(s): Pierre Roumanille, Julien Lesseur, Julien Uzanu, Hoa Le Trong, Emna Ben Romdhane, Alexandrine Guedon-Gracia, Helene Fremont Lien HAL : https://hal.science/hal-04273250v1 Moisture absorption and desorption in epoxy mould compounds: Characterization of Fickian and non-Fickian behaviours in complex packages Auteur(s): Ariane Tomas, Helene Fremont, Nathalie Malbert, Mehdy Neffati, Benoit Lambert Lien HAL : https://hal.science/hal-04273061v1 Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe Auteur(s): Louise Dumas, Christina Villeneuve-Faure, Francois Marc, Helene Fremont, Christophe Guerin, Guillaume Bascoul Lien HAL : https://hal.science/hal-04273084v1 Reliability of the hybrid bonding level using submicrometric bonding pads Auteur(s): Sandrine Lhostis, Bassel Ayoub, Helene Fremont, Stephane Moreau, Jean-Gabriel Mattei, Patrick Lamontagne, Arnaud Tournier Lien HAL : https://hal.science/hal-04273117v1 Etude de fiabilité en microélectronique : principes généraux et nouvelles approches Auteur(s): Hélène Frémont Lien HAL : https://hal.science/hal-02519525v1 Etude de fiabilité en microélectronique : principes généraux et nouvelles approches Auteur(s): Hélène Frémont Lien HAL : https://hal.science/hal-02517122v1 Fiabilité des assemblages micro et nano-électroniques ; approche par la physique des défaillances Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-01257994v1 Coordination and Alignment of Electrical and Information Engineering in European Higher Education Institutions Auteur(s): A. Friesel, Jean-Marc Thiriet, T. Wards, Hamed Yahoui, Olivier Bonnaud, Hélène Fremont, Joao Martins Maria Lien HAL : https://hal.science/hal-01102844v1 Parameter extraction for simulations: silicon strength after thinning process Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00950182v1 Thermo-mechanical reliability issues in complex microelectronic assemblies: methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00780832v1 Thermo-mechanical reliability issues in complex microelectronic assemblies: methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00853814v1 Thermal mechanical reliability issues in complex micro- and nano- electronic assemblies: a methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00853816v1 How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00477588v1 Reliability test method overview to characterize second level interconnects Auteur(s): Wilson Carlos Maia Filho, Hélène Frémont, M. Brizoux, Yves Danto Lien HAL : https://hal.science/hal-00167712v1 Improved physical understanding of intermittent failure in continuous monitoring method Auteur(s): Wilson Carlos Maia Filho, Hélène Frémont, Michel Brizoux, Yves Danto Lien HAL : https://hal.science/hal-00167714v1Send a email to Hélène FREMONT :