Hélène FREMONT

Poster communication (2)

Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Faycal Houssaini, Helene Fremont, Thomas W. Cornelius, Olivier Thomas Lien HAL : https://hal.science/hal-03962892v1 Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction Auteur(s): Bassel Ayoub, Faycal Houssaini, Stéphane Moreau, Sandrine Lhostis, Thomas W. Cornelius, Olivier Thomas, Hélène Frémont Lien HAL : https://hal.science/hal-03962880v1

Proceeding (1)

Microelectronics Reliability Volumes 76-77, Pages 1-724 Auteur(s): N. Labat, F. Marc, H. Fremont, M. Bafleur Lien HAL : https://hal.science/hal-02519752v1

Special issue (2)

Proceedings of the 32nd European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis Auteur(s): Nathalie Labat, François Marc, Hélène Frémont, Nicolas Nolhier Lien HAL : https://hal.science/hal-03408633v1 Proceedings of the 30th European Symposium on the reliability of electron devices, failure physics and analysis Auteur(s): Nicolas Nolhier, Nathalie Labat, Hélène Frémont, François Marc, Fabrice Caignet, Guillaume Bascoul Lien HAL : https://hal.science/hal-02884107v1

Book (2)

Microelectronics Reliability Special issue for EuroSime 2018 Auteur(s): W. Van Driel, H. Fremont Lien HAL : https://hal.science/hal-02517386v1 Microelectronics Reliability Volume 55, Issues 9–10 Auteur(s): Philippe Perdu, François Marc, Marise Bafleur, Hélène Fremont, Nicolas Nolhier Lien HAL : https://hal.science/hal-01257945v1

Patents (1)

Carbon nanotube-based multi-sensor Auteur(s): Eric Duchesne, Dominique Drouin, Hélène Frémont, Simon Landry, Aurore Quelennec, Umar Shafique, Patrick Rj Wilson Lien HAL : https://hal.science/hal-03683650v1

Other publication (4)

Mission Profile Analysis for Accelerated Test Definition Auteur(s): Maia Filho W. C., M. Brizoux, H. Fremont, Y. Danto Lien HAL : https://hal.science/hal-00399597v1 The alignment of generic, specific and language skills within the Electrical and Information Engineering discipline Auteur(s): Anthony- E. Ward, Jean-Marc Thiriet, Hélène Frémont Lien HAL : https://hal.science/hal-00399598v1 Mission Profile Analysis for Accelerated Test Definition Auteur(s): C. Maia Filho W., M. Brizoux, H. Fremont, Y. Danto Lien HAL : https://hal.science/hal-00402816v1 The Overview of the Bologna Process Implementation in Europe in Electrical and Information Engineering (Bachelor, Master, Doctoral studies) Auteur(s): Maria- J .Martins, Jean-Marc Thiriet, Hélène Frémont Lien HAL : https://hal.science/hal-00399599v1

Conference proceedings (112)

Sub 1 μm pitch achievement for Cu/SiO2 hybrid bonding Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Emeline Souchier, Emilie Deloffre, Sebastien Mermoz, Maria Gabriela Gusmao Cacho, Norah Szekely, Christelle Rey, Ece Aybeke, Victor Gredy, Patrick Lamontagne, Olivier Thomas, Helene Fremont Lien HAL : https://hal.science/hal-04080577v1 Investigation of different thermomechanical behaviours in one batch of QFN packages Auteur(s): Ariane Tomas, Helene Fremont, Nathalie Malbert, Nathalie Labat, Benoit Lambert, Bernard Plano Lien HAL : https://hal.science/hal-04976119v1 Comparative study of lead-free alloys submitted to thermomechanical ageing Auteur(s): Houda Friaa, Alexandrine Gracia, Helene Fremont, Laure Rocheron, Raphael Riva Lien HAL : https://hal.science/hal-05100833v1 Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid Auteur(s): Arsène Guédon, Nizar Bouguerra, Etienne Paradis, Eric Duchesne, Stephanie Allard, Hélène Frémont, Dominique Drouin Lien HAL : https://hal.science/hal-04654838v1 RC delay mitigation for sub 700 nm hybrid bonding pitch Auteur(s): Sandrine Lhostis, Bassel Ayoub, Hélène Frémont, Stéphane Moreau, Sebastien Mermoz, Emilie Deloffre, Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke, Patrick Lamontagne, Christelle Rey, Arnaud Tournier Lien HAL : https://hal.science/hal-04762470v1 New Method to Perform TDDB Tests for Hybrid Bonding Interconnects Auteur(s): Bassel Ayoub, S. Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Helene Fremont Lien HAL : https://hal.science/hal-03781358v1 To avoid dropout: let student teach! Second act Auteur(s): Hélène Frémont, Florent Arnal Lien HAL : https://hal.science/hal-03736322v1 Dynamics of the corrosion for SAC305 solder alloy in salt environment Auteur(s): K. Akoda, A. Guedon-Gracia, Éric Lebraud, J.-Y. Deletage, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-03665831v1 Evaluation of SAC solder joint thermomechanical fatigue in different types of components Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Lien HAL : https://hal.science/hal-03665823v1 2D Model for moisture diffusion in integrated Low-k dielectrics Auteur(s): Leo Mischler, Vivien Cartailler, Genevieve Duchamp, Helene Fremont, Gregory Imbert, J. Moulard, Olivier Kermarrec Lien HAL : https://hal.science/hal-03666398v1 Epoxy Mold Compound Characterization for Modeling Packaging Reliability Auteur(s): Ariane Tomas, Benoit Lambert, Helene Fremont, Nathalie Malbert, Nathalie Labat Lien HAL : https://hal.science/hal-03666406v1 QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms Auteur(s): E. Ben Romdhane, P. Roumanille, Alexandrine Guedon-Gracia, S. Pin, P. Nguyen, Helene Fremont Lien HAL : https://hal.science/hal-03781126v1 Reliability of fan-out wafer level packaging For III-V RF power MMICs Auteur(s): Ariane Tomas, Laurent Marechal, Rodrigo Almeida, Mehdy Neffati, Nathalie Malbert, Helene Fremont, Nathalie Labat, Arnaud Garnier Lien HAL : https://hal.science/hal-03336953v1 Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects Auteur(s): B. Ayoub, S. Lhostis, S. Moreau, E. Leon Perez, J. Jourdon, P. Lamontagne, E. Deloffre, S. Mermoz, C. de Buttet, V. Balan, C. Euvard, Y. Exbrayat, H. Fremont Lien HAL : https://hal.science/hal-03203851v1 Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Lien HAL : https://hal.science/hal-03336972v1 To avoid dropout: let student teach! Auteur(s): Helene Fremont, Florent Arnal Lien HAL : https://hal.science/hal-03344467v1 Moisture diffusion in dense SiO2 and ultra low k integrated stacks Auteur(s): V. Cartailler, G. Imbert, V. Guyader, M. Juhel, P. Lamontagne, M. Rafik, D. Ney, D. Benoit, C. Chaton, J. B. Moulard, G. Duchamp, H. Fremont Lien HAL : https://hal.science/hal-02477172v1 Initiation à la recherche sur la Fiabilité en microélectronique par la physique :Mini-projets en laboratoire Auteur(s): J-y Deletage, T. Dubois, G. Duchamp, L. Theolier, J-M Vinassa, E. Woirgard, H. Fremont, O. Briat, A. Guédon-Gracia Lien HAL : https://hal.science/hal-02516984v1 La carte à puce : du sable au silicium Auteur(s): Hélène Frémont Lien HAL : https://hal.science/hal-02517402v1 Integration of carbon nanotube-based sensors to a flip-chip package for micro-strain detection in microelectronic package Auteur(s): Julien Pezard, Yosri Ayadi, A Elshaer, E Duchesne, Hélène Frémont, Dominique Drouin Lien HAL : https://hal.science/hal-02453585v1 Vibration test and simulation of printed circuit board Auteur(s): Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Fremont Lien HAL : https://hal.science/hal-02516844v1 Readout Circuit Implemented on PCB-Level for Embedded CNT Sensors Auteur(s): Quentin Vandier, Julien Pezard, Hélène Fremont, Eric Duchesne, Dominique Drouin Lien HAL : https://hal.science/hal-02895351v1 Moisture uptake of PECVD dielectrics at ambient and accelerated Test Conditions Auteur(s): V. Cartailler, G. Imbert, G. Duchamp, H. Fremont Lien HAL : https://hal.science/hal-02477098v1 Statistical study of SAC solder joints in QFN and BGA assemblies Auteur(s): A. Gracia, A. Badetz, F. Arabi, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-02477114v1 Electromigration Effects in Corroded BGA Auteur(s): Kirsten Weide-Zaage, Alexandrine Guedon-Gracia, Hélène Fremont Lien HAL : https://hal.science/hal-02516854v1 Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Auteur(s): Samuel Pin, Alexandrine Guedon-Gracia, Jean-Yves Delétage, Julie Fouquet, Hélène Fremont Lien HAL : https://hal.science/hal-02516819v1 A highly sensitive humidity sensor integrated to a flip-chip package for moisture detection in electronics package Auteur(s): A. Quelennec, U. Shafique, E Duchesne, H. Fremont, D. Drouin Lien HAL : https://hal.science/hal-02096949v1 Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package Auteur(s): Aurore Quelennec, Umar Shafique, Eric Duchesne, Hélène Fremont, Dominique A Drouin Lien HAL : https://hal.science/hal-02074222v1 Hybrid bonding for 3D stacked image sensors: impact of pitch shrinkage on interconnect robustness Auteur(s): J. Jourdon, S. Lhostis, S. Moreau, J. Chossat, M. Arnoux, C. Sart, Y. Henrion, P. Lamontagne, L. Arnaud, N. Bresson, V. Balan, C. Euvrard, Y. Exbrayat, D. Scevola, E. Deloffre, S. Mermoz, A. Martin, H. Bilgen, F. André, C. Charles, D. Bouchu, A. Farcy, S. Guillaumet, A. Jouve, H. Fremont, S. Cheramy Lien HAL : https://hal.science/hal-02118042v1 Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package Auteur(s): Aurore Quelennec, Yosri Ayadi, Quentin Vandier, Eric Duchesne, Hélène Fremont, Dominique A Drouin Lien HAL : https://hal.science/hal-02074111v1 Numerical study of thermomechanical fatigue influence of intermetallic compounds in a lead free solder joint Auteur(s): Samuel Pin, Hélène Frémont, Alexandra Gracia Lien HAL : https://hal.science/hal-01688091v1 Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package Auteur(s): Aurore Quelennec, Umar Shafique, Éric Duchesne, Hélène Frémont, Dominique Drouin Lien HAL : https://hal.science/hal-01660889v1 Lead free solder joints characterisation using single lap shear tests Auteur(s): Samuel Pin, Hélène Frémont, Alexandrine Guedon-Gracia Lien HAL : https://hal.science/hal-01660937v1 Measurement and simulation of electromagnetic drift for obsolescence management in electronics Auteur(s): Geneviève Duchamp, Tristan Dubois, Ala Ayed, Christian Marot, Hélène Fremont Lien HAL : https://hal.science/hal-01180999v1 Measurement and Simulation of Electromagnetic Drift for Obsolescence Management in Electronics Auteur(s): Geneviève Duchamp, Tristan Dubois, Ala Ayed, Christian Marot, Hélène Fremont Lien HAL : https://hal.science/hal-01153333v1 Simulations and Measurements to Predict EMC Characteristics in Electronic Assemblies: Obsolescence Management Auteur(s): Geneviève Duchamp, Tristan Dubois, Hélène Frémont Lien HAL : https://hal.science/hal-01153323v1 How SI/EMC and reliability issues could interact together in embedded electronic systems? Auteur(s): K. Weide-Zaage, A. Moujbani, G. Duchamp, Tristan Dubois, Frédéric Verdier, H. Fremont Lien HAL : https://hal.science/hal-01180993v1 Investigation of Chip-Package Interaction in 3D Integration Auteur(s): K. Weide-Zaage, Hélène Fremont, J. Kludt, Angélique Tételin Lien HAL : https://hal.science/hal-00931476v1 Electromigration Reliability of Cylindrical Cu Pillar SnAg3.0Cu0.5 Bumps Auteur(s): L. Meinshausen, K. Weide-Zaage, B. Goldbeck, A. Moujbania, J. Kludt, H. Fremont Lien HAL : https://hal.science/hal-00981795v1 Criteria of the EIE courses accessible to disabled students. Legibility of cursus and experiences sharing for generalizing good practices Auteur(s): François Demontoux, Hélène Fremont, Eric Woirgard Lien HAL : https://hal.science/hal-00853821v1 Evaluation of Quasi-Hermetic Packaging Solutions for Active Microwave Devices and Space Applications Auteur(s): Ben Naceur W., N. Malbert, N. Labat, H. Fremont, J.L. Muraro, P. Monfraix Lien HAL : https://hal.science/hal-00799929v1 Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing Auteur(s): L. Meinshausen, K. Weide-Zaage, Hélène Fremont Lien HAL : https://hal.science/hal-00853811v1 Amélioration de la lisibilité des formations de l'EEA accessibles aux étudiants en situation de handicap - Vers une mutualisation des expériences et une généralisation des bonnes pratiques Auteur(s): François Demontoux, Hélène Fremont, Eric Woirgard Lien HAL : https://hal.science/hal-00873510v1 Field return on a Chinese-French double graduation of an International Master in Microelectronics on the Base of the Bologna Process Auteur(s): Olivier Bonnaud, Lotfi Senhadji, Lei Wei, Limin Luo, Hélène Frémont, Huazhong Shu Lien HAL : https://hal.science/hal-00479107v1 International dimension to increase Lifelong Learning possibilities in Europe Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Olivier Bonnaud, A. Friesel, Hélène Fremont, Maria João Martins Lien HAL : https://hal.science/hal-00773156v1 Stage de microassemblage Pôle CNFM de Bordeaux / IMS Bordeaux : réalisation de circuits hybrides et capteurs Auteur(s): Hélène Debéda, Corinne Dejous, Hélène Frémont, Alexandrine Gracia, Isabelle Favre, Jean-Luc Lachaud, Bernard Plano, Jean Tomas Lien HAL : https://hal.science/hal-00744834v1 On the way of harmonization of PhD in Europe in Electrical and Information Engineering: status and recommendations Auteur(s): Olivier Bonnaud, Hélène Fremont, Jean-Marc Thiriet Lien HAL : https://hal.science/hal-00676189v1 Underfill and mold compound influence on PoP ageing under high current and high temperature stresses Auteur(s): L. Meinshausen, K. Weide-Zaage, H. Fremont Lien HAL : https://hal.science/hal-00716406v1 Obtenir un doctorat en EEA par la voie de la formation continue en Europe : les pistes Auteur(s): Olivier Bonnaud, Hélène Fremont, Jean-Marc Thiriet, Hamed Yahoui Lien HAL : https://hal.science/hal-00658623v1 International dimension to increase Lifelong Learning possibilities in Europe Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Hélène Fremont Lien HAL : https://hal.science/hal-00719906v1 Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards Auteur(s): Hassene Fridhi, Geneviève Duchamp, Valerie Vigneras, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Hélène Fremont, Tristan Dubois Lien HAL : https://hal.science/hal-00709116v1 Set-in LifeLong Learning for PhD students in Electrical and Information Engineering Auteur(s): Olivier Bonnaud, Jean-Marc Thiriet, Hélène Frémont Lien HAL : https://hal.science/hal-00617944v1 Evaluation des solutions de packaging quasi-hermétique sur composants actifs hyperfréquences Auteur(s): Walim Ben Naceur, Nathalie Malbert, Nathalie Labat, Hélène Fremont, Jean-Luc Muraro, Philippe Monfraix Lien HAL : https://hal.science/hal-00585624v1 Prediction of Electromigration Induced Void Formation in TSV and SAC Contacts Auteur(s): Kirsten Weide-Zaage, Lutz Meinshausen, Hélène Fremont Lien HAL : https://hal.science/hal-00639192v1 ELLEIEC implementation issues in EIE: State of advancement Auteur(s): Jean-Marc Thiriet, Hamed Yahoui, Olivier Bonnaud, A. Friesel, Hélène Frémont Lien HAL : https://hal.science/hal-00617945v1 Active pedagogy: A practical experiment at the Institut Universitaire de Technologie Bordeaux Auteur(s): H. Fremont, G. Couturier, C. Pellet, L. Bechou Lien HAL : https://hal.science/hal-00577603v1 Virtual prototyping of PoP interconnections regarding electrically activated mechanisms Auteur(s): Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont, Wei Feng Lien HAL : https://hal.science/hal-00477596v1 Toward an International Curricula Network for exchanges and LifeLong Learning Auteur(s): Jean-Marc Thiriet, Fabrice Null Mériaudeau, Juan Carlos Burguillo, Hélène Fremont, Hamed Yahoui, Pierre de Fooz Lien HAL : https://hal.science/hal-00529223v1 Die Attach Interface Property Characterization as Function of Temperature Using Cohesive Zone Modeling Method Auteur(s): Xiaosong Ma, G.Q. Zhang, Olaf van Der Sluis, Kaspar M.B. Jansen, Willem D van Driel, Leo J. Ernst, Charles Regard, Christian Gautier, Hélène Frémont Lien HAL : https://hal.science/hal-00477599v1 Mise en place d'une pédagogie d'apprentissage par problèmes au département GEII de l'IUT Bordeaux Auteur(s): Hélène Fremont, S. Moutault, I. Bord, B. Caillard, Francois Demontoux, Stéphane Grauby, P. Sentenac, M. Tarisien Lien HAL : https://hal.science/hal-00467949v1 Influence of PCB design and materials on chip solder joint reliability Auteur(s): Matthieu Berthou, Hélène Frémont, Alexandrine Gracia, Catherine Jéphos-Davennel Lien HAL : https://hal.science/hal-00477591v1 Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Auteur(s): Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen, Catherine Bunel, François Neuilly, Jean-René Tenailleau Lien HAL : https://hal.science/hal-00477594v1 ELLEIEC Enhancing Lifelong Learning for the Electrical and Information Engineering Community Auteur(s): Hamed Yahoui, Olivier Bonnaud, Cyril Burkley, Hélène Frémont, Michael Hoffmann, Maria Joao Martins, Christian Perra, Jean-Marc Thiriet, Anthony E. Ward Lien HAL : https://hal.science/hal-00467961v1 Field return on a Chinese-French double graduation of an International Master in Electronics and Telecommunications on the Base of the Bologna Process Auteur(s): Olivier Bonnaud, Lotfi Senhadji, Hélène Fremont, Lei Wei, Huazhong Shu, Limin Luo Lien HAL : https://hal.science/hal-00506972v1 Moisture induced effects in PoP Auteur(s): A. Guédon-Gracia, W. Feng, J.-Y. Delétage, F. Verdier, Hélène Frémont Lien HAL : https://hal.science/hal-00385358v1 Balance of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, Michel Robert, Maria Joao Martins, Anthony E. Ward, Daniel Pasquet, D. Deniz, Hamed Yahoui, Olivier Bonnaud, Michael Hoffmann, Hélène Fremont Lien HAL : https://hal.science/hal-00364333v1 Electrically driven matter transport effects in PoP interconnections Auteur(s): W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, Hélène Frémont Lien HAL : https://hal.science/hal-00385360v1 Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires Auteur(s): Bahi M.A., P. Lecuyer, A. Gentil, H. Fremont, Jean-Pierre Landesman, Frédéric Christien Lien HAL : https://hal.science/hal-00400185v1 Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires Auteur(s): Bahi M.A., P. Lecuyer, Hélène Frémont, A. Gentil, Jean-Pierre Landesman, Frédéric Christien Lien HAL : https://hal.science/hal-00399566v1 Results and dissemination of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, E. Ward A., J. Martins M., D. Deniz, D. Pasquet, M. Hoffmann, H. Fremont, H. Yahoui, O. Bonnaud, M. Robert, J. Barsics, J.V. Benlloch-Dualde Lien HAL : https://hal.science/hal-00400182v1 Results and dissemination of the EIE-Surveyor thematic network Auteur(s): Jean-Marc Thiriet, Anthony E. Ward, Maria Joao Martins, D. Deniz, Daniel Pasquet, Michael Hoffmann, Hélène Fremont, Hamed Yahoui, Olivier Bonnaud, Michel Robert, J. Barsics, José Vincente Benlloch-Dualde Lien HAL : https://hal.science/hal-00399569v1 ELLEIEC Enhancing Lifelong Learning for the Electrical and Information Engineering Community Auteur(s): H. Yahoui, C. Burkley, H. Fremont, M. Hoffmann, M. J. Martins, C. Perra, Jean-Marc Thiriet, A. E. Ward Lien HAL : https://hal.science/hal-00400179v1 Puces assemblées en flip-chip : comparaison normes « drop-test ». Auteur(s): Hélène Frémont, Stéphane Forster, Yassine Bentata Lien HAL : https://hal.science/hal-00323441v1 Observatory of the Bologna-process in EIE: an aid for the enhancement of mobility Auteur(s): Jean-Marc Thiriet, Maria-J. Martins, Hamed Yahoui, Michel Robert, Hélène Frémont Lien HAL : https://hal.science/hal-00321973v1 Study of JEDEC B-condition JESD22-B111 Standard for Drop Test Reliability of Chip Scale Packages Auteur(s): Yassine Bentata, Stéphane Forster, K. Y. Goh, Hélène Frémont Lien HAL : https://hal.science/hal-00323417v1 Solder fatigue of wafer level package assemblies. Comparison with flip chip BGA's Auteur(s): Charles Regard, Christian Gautier, Hélène Frémont, Alexandre Val, Frédéric Roullier, Patrick Schwindenhammer Lien HAL : https://hal.science/hal-00323406v1 Analytical Model for Thermally-induced Warpage of POP Auteur(s): Wei Feng, Helene Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00323410v1 Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging Auteur(s): Charles Regard, Christian Gautier, Hélène Fremont, Patrick Poirier Lien HAL : https://hal.science/hal-00323432v1 High Density IC Packaging Reliability Auteur(s): Geneviève Duchamp, Alexandrine Guedon-Gracia, Frédéric Verdier, Hélène Frémont Lien HAL : https://hal.science/hal-00323388v1 Existing and new Tools to improve student mobility at university level in Electrical and information engineering Auteur(s): Yahoui Hamed, Ligus Jan, Jean-Marc Thiriet, Genon-Catalot Denis, Hélène Frémont Lien HAL : https://hal.science/hal-00321970v1 Experiences with Personal Professional Project (PPP) Auteur(s): Hélène Dufau, Hélène Frémont, Florent Richard Lien HAL : https://hal.science/hal-00323374v1 Development of an HMI Based on the OPC Standard Auteur(s): Serge Bouter, Rachid Malti, Hélène Frémont Lien HAL : https://hal.science/hal-00323382v1 Simple Analytical Model for Thermally-induced Warpage of POP Auteur(s): Wei Feng, Hélène Frémont, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00323385v1 Life time prediction of BGA assemblies with experimental torsion test and finite element analysis Auteur(s): Wilson-Carlos Maia Filho, Hélène Frémont, Michel Brizoux, Yves Danto Lien HAL : https://hal.science/hal-00323420v1 A Survey of the Evolution of the Bologna Process in EIE in Europe Auteur(s): Maria Joao Martins, Jean-Marc Thiriet, Olivier Bonnaud, Michael Hoffmann, Michel Robert, José Vincente Benlloch-Dualde, Anthony E. Ward, Hamed Yahoui, Hélène Fremont Lien HAL : https://hal.science/hal-00318724v1 Analytical model for thermally-induced warpage of POP Auteur(s): Wei Feng, Hélène Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00326445v1 Moisture Diffusion Model Verification of Packaging Materials Auteur(s): Xiaosong Ma, Kaspar-M.B. Jansen, L.J. Ernst, Willelm-D van Driel, Olaf van Der Sluis, Kuchi Zhang, Charles Regard, Christian Gautier, Hélène Frémont Lien HAL : https://hal.science/hal-00323425v1 Effect of packaging materials aging properties on die surface cracking of a SiP carrier Auteur(s): Xiaosong Ma, Kaspar-M.B. Jansen, L.J. Ernst, Willelm-D van Driel, Olaf van Der Sluis, Kuchi Zhang, Charles Regard, Christian Gauthier, Hélène Frémont Lien HAL : https://hal.science/hal-00323423v1 SiP vs SoC : An application-driven perspective Auteur(s): Geneviève Duchamp, Hélène Frémont, Alexandrine Guédon-Gracia, Frédéric Verdier Lien HAL : https://hal.science/hal-00327271v1 New Results for the EIE-Surveyor Project 19th EAEEIE conference Auteur(s): Jean-Marc Thiriet, Michel Robert, Maria-J. Martins, Anthony- E. Ward, Olivier Bonnaud, Michael Hoffmann, Hamed Yahoui, Hélène Frémont Lien HAL : https://hal.science/hal-00323380v1 EIE-Surveyor : un programme européen pour favoriser les échanges et la reconnaissance des diplômes au niveau européen Auteur(s): Olivier Bonnaud, Hélène Frémont, Maria- J .Martins, Daniel Pasquet, Michel Robert, Jean-Marc Thiriet, Hamed Yahoui Lien HAL : https://hal.science/hal-00323375v1 Le projet professionnel personnel au département Geii de l'Université Bordeaux 1 Auteur(s): Hélène Frémont, Hélène Dufau, Hervé Lévi, Florent Richard Lien HAL : https://hal.science/hal-00323377v1 Simulation of Migration effects in PoP Auteur(s): Kirsten Weide-Zaage, Li Wang, Hélène Frémont Lien HAL : https://hal.science/hal-00323415v1 Thermomechanical Behaviour of Adhesive Jointed SMT Components Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Davide Carboni, Hélène Fremont, Yves Danto, Christiane Faure Lien HAL : https://hal.science/hal-00183973v1 BJT avalanche breakdown voltage improvement by introduction of a floating P-layer in the epitaxial collector region Auteur(s): Thomas Zimmer, M. N?doye, Noelle Lewis, Jean Batiste Duluc, Helene Fremont, Jean Paul Dom Lien HAL : https://hal.science/hal-00189380v1 Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry Auteur(s): Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Fremont Lien HAL : https://hal.science/hal-00183966v1 approach of integrated circuits failure location by voltage contrast in a scanning electron microscope Auteur(s): François Marc, Hélène Fremont, Paul Jounet, Yves Danto, M. Barre, C. Nouet Lien HAL : https://hal.science/hal-00181909v1 Industrial use of conductive adhesives for SMT assemblie Auteur(s): Marie-Genevieve Perichaud, Hélène Fremont, Michel Salagoity, Christiane Faure, Yves Danto Lien HAL : https://hal.science/hal-00183971v1 Life prediction of BGA and CSP assemblies using an experimental degradation law and fem simulations Auteur(s): Jean-Yves Deletage, Hélène Fremont, Patrick Louis, Yves Danto, Bernard Plano, Bertrand Carbonne Lien HAL : https://hal.science/hal-00183968v1 Evolution of Reliability Assessment In PCB Assemblies Auteur(s): Yves Danto, Jean-Yves Deletage, Frédéric Verdier, Hélène Fremont Lien HAL : https://hal.science/hal-00183967v1 Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system Auteur(s): Claude Pellet, Marc Lecouve, Hélène Fremont, A. Val Lien HAL : https://hal.science/hal-00183144v1 A fast VLSI SRAM mapping methodology using voltage contrast techniques on SEM Auteur(s): François Marc, Hélène Fremont, Paul Jounet, Andre Touboul, Yves Danto Lien HAL : https://hal.science/hal-00181911v1 Report des composants CMS à l'aide d'une colle conductrice Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Yves Ousten, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00182921v1 Vieillissement par pénétration d humidité des résines d enrobage de circuits intégrés Auteur(s): Jean-Yves Deletage, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00183969v1 Evaluation of stresses in packaged Ics by in situ measurements with an assembly test chip and simulation Auteur(s): Christine Ducos, Emmanuel Saint-Christophe, Hélène Fremont, Gilles N'Kaoua, Claude Pellet, Yves Danto Lien HAL : https://hal.science/hal-00183151v1 Some Mechanical and Metallurgical Aspects of the Degradation in Interconnects Auteur(s): Michel Ignat, Hélène Fremont, Jean-Yves Deletage, Yves Danto Lien HAL : https://hal.science/hal-00183965v1 Test chip for qualification of packaging assemblies Auteur(s): Jean-Yves Deletage, Hélène Fremont, Olivier Puig, Claude Pellet, Pascal Fouillat, Yves Danto Lien HAL : https://hal.science/hal-00183081v1 Design for reliability - Impact of microvia technology and assembly process. Auteur(s): Walter Horaud, Hélène Fremont, Bernard Plano, Sylvain Leroux Lien HAL : https://hal.science/hal-00183963v1 Impact of the PCB Design on the Crack Risk of CSPs Assemblies Subjected to Temperature Cycling and Drop Tests Auteur(s): H. Fremont, M. Mura, W. Horaud, Y. Danto Lien HAL : https://hal.science/hal-00160699v1 Optimisation of an Assembling Process of Passive Components reported with Conductive Adhesives Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Gilles N'Kaoua, Hélène Fremont, Yves Danto, Olivier Puig Lien HAL : https://hal.science/hal-00183972v1 Evaluation of conductive adhesives for industrial SMT assemblies Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto, Christiane Faure, Michel Salagoity Lien HAL : https://hal.science/hal-00183970v1 Fiabilité des assemblages microélectroniques complexes Auteur(s): Frédéric Verdier, Geneviève Duchamp, Hélène Frémont Lien HAL : https://hal.science/hal-00167725v1

Invited lectures (19)

Towards measurements of global coefficient of thermal expansion of QFN Auteur(s): Vincent Sisomseun, Olivier Maire, Pascal Retailleau, Catherine Jephos, Helene Fremont, Alexandrine Guedon-Gracia Lien HAL : https://hal.science/hal-04965121v1 Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test Auteur(s): Komlan Elom Akoda, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Bernard Plano, Helene Fremont Lien HAL : https://hal.science/hal-04273292v1 Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack Auteur(s): Leo Mischler, Vivien Cartailler, Gregory Imbert, Genevieve Duchamp, Helene Fremont Lien HAL : https://hal.science/hal-04273097v1 Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs Auteur(s): Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont Lien HAL : https://hal.science/hal-04166906v1 Using X-ray imaging for the study of crack development in solder reliability testing Auteur(s): Pierre Roumanille, Julien Lesseur, Julien Uzanu, Hoa Le Trong, Emna Ben Romdhane, Alexandrine Guedon-Gracia, Helene Fremont Lien HAL : https://hal.science/hal-04273250v1 Moisture absorption and desorption in epoxy mould compounds: Characterization of Fickian and non-Fickian behaviours in complex packages Auteur(s): Ariane Tomas, Helene Fremont, Nathalie Malbert, Mehdy Neffati, Benoit Lambert Lien HAL : https://hal.science/hal-04273061v1 Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe Auteur(s): Louise Dumas, Christina Villeneuve-Faure, Francois Marc, Helene Fremont, Christophe Guerin, Guillaume Bascoul Lien HAL : https://hal.science/hal-04273084v1 Reliability of the hybrid bonding level using submicrometric bonding pads Auteur(s): Sandrine Lhostis, Bassel Ayoub, Helene Fremont, Stephane Moreau, Jean-Gabriel Mattei, Patrick Lamontagne, Arnaud Tournier Lien HAL : https://hal.science/hal-04273117v1 Etude de fiabilité en microélectronique : principes généraux et nouvelles approches Auteur(s): Hélène Frémont Lien HAL : https://hal.science/hal-02519525v1 Etude de fiabilité en microélectronique : principes généraux et nouvelles approches Auteur(s): Hélène Frémont Lien HAL : https://hal.science/hal-02517122v1 Fiabilité des assemblages micro et nano-électroniques ; approche par la physique des défaillances Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-01257994v1 Coordination and Alignment of Electrical and Information Engineering in European Higher Education Institutions Auteur(s): A. Friesel, Jean-Marc Thiriet, T. Wards, Hamed Yahoui, Olivier Bonnaud, Hélène Fremont, Joao Martins Maria Lien HAL : https://hal.science/hal-01102844v1 Parameter extraction for simulations: silicon strength after thinning process Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00950182v1 Thermo-mechanical reliability issues in complex microelectronic assemblies: methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00780832v1 Thermo-mechanical reliability issues in complex microelectronic assemblies: methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00853814v1 Thermal mechanical reliability issues in complex micro- and nano- electronic assemblies: a methodological approach Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00853816v1 How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies Auteur(s): Hélène Fremont Lien HAL : https://hal.science/hal-00477588v1 Reliability test method overview to characterize second level interconnects Auteur(s): Wilson Carlos Maia Filho, Hélène Frémont, M. Brizoux, Yves Danto Lien HAL : https://hal.science/hal-00167712v1 Improved physical understanding of intermittent failure in continuous monitoring method Auteur(s): Wilson Carlos Maia Filho, Hélène Frémont, Michel Brizoux, Yves Danto Lien HAL : https://hal.science/hal-00167714v1