Article (37)
Impact of temperature on the corrosion of lead-free solder alloy during salt spray test Auteur(s): K.E. Akoda, A. Guédon-Gracia, J.-Y. Delétage, B. Plano, H. Frémont Lien HAL : https://hal.science/hal-03375855 Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability Auteur(s): F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont Lien HAL : https://hal.science/hal-03011606 Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application Auteur(s): M. Maures, A. Capitaine, J.-Y. Delétage, J.-M. Vinassa, O. Briat Lien HAL : https://hal.science/hal-03493060 An Incremental Capacity Parametric Model Based on Logistic Equations for Battery State Estimation and Monitoring Auteur(s): Matthieu Maures, Romain Mathieu, Armande Capitaine, Jean-Yves Delétage, Jean-Michel Vinassa, Olivier Briat Lien HAL : https://hal.science/hal-03722553 Impact of temperature on calendar ageing of Lithium-ion battery using incremental capacity analysis Auteur(s): Matthieu Maures, Yuanci Zhang, Cyril Martin, Jean-Yves Deletage, Jean-Michel Vinassa, Olivier Briat Lien HAL : https://hal.science/hal-02506186 Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging Auteur(s): Pierre Roumanille, Emna Ben Romdhane, Samuel Pin, Patrick Nguyen, Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont Lien HAL : https://hal.science/hal-03375916 Non-isothermal Ragone plots of Li-ion cells from datasheet and galvanostatic discharge tests Auteur(s): Yuanci Zhang, Olivier Briat, Loïc Boulon, Jean-Yves Delétage, Cyril Martin, Fabio Coccetti, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-02117604 Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses Auteur(s): Omar Chihani, Loïc Théolier, Alain Bensoussan, Jean-Yves Delétage, André Durier, Eric Woirgard Lien HAL : https://hal.science/hal-02499971 Sequential combined thermal cycling and vibration test and simulation of printed circuit board Auteur(s): Faical Arabi, Alexandrine Gracia, Hélène Fremont, Jean-Yves Delétage Lien HAL : https://hal.science/hal-02516781 Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Auteur(s): S. Pin, A. Gracia, J.-Y. Delétage, H. Fremont Lien HAL : https://hal.science/hal-02515004 Creep measurement and choice of creep laws for BGA assemblies' reliability simulation Auteur(s): Samuel Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Fremont Lien HAL : https://hal.science/hal-02516790 Efficient state of health estimation of Li-ion battery under several ageing types for aeronautic applications Auteur(s): Yuanci Zhang, Olivier Briat, Jean-Yves Delétage, Cyril Martin, Nicolas Chadourne, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-01892422 Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach Auteur(s): S. Hairoud-Airieau, G. Duchamp, Tristan Dubois, J.-Y. Delétage, A. Durier, H. Fremont Lien HAL : https://hal.science/hal-01659294 Thermo-Mechanical Reliability Assessment of AlN Power Substrates Subjected to Severe Aging Tests Auteur(s): Faical Arabi, Loic Theolier, Donatien Martineau, J.-Y. Delétage, Mathieu Médina, Eric Woirgard Lien HAL : https://hal.science/hal-01662917 Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices Auteur(s): Faical Arabi, Loic Theolier, Donatien Martineau, J.-Y. Delétage, Mathieu Médina, Eric Woirgard Lien HAL : https://hal.science/hal-01662946 Chemical rate phenomenon approach applied to lithium battery capacity fade estimation Auteur(s): Issam Baghdadi, Olivier Briat, Jean-Yves Delétage, Philippe Gyan, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-01657455 Lithium battery aging model based on Dakin’s degradation approach Auteur(s): Issam Baghdadi, Olivier Briat, Jean-Yves Delétage, Philippe Gyan, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-01657446 Effects of salt spray test on lead-free solder alloy Auteur(s): A. Guédon-Gracia, H. Frémont, B. Plano, Y. Delétage J., K. Weide-Zaage Lien HAL : https://hal.science/hal-01400240 Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications Auteur(s): M. Mickaël Pocheron,, J.-Y. Delétage, B. Plano, Alexandrine Gracia-Guedon, Hélène Fremont Lien HAL : https://hal.science/hal-01257918 Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach Auteur(s): Fédia Baccar, Stéphane Azzopardi, Loïc Théolier, Kamal El Boubkari, Jean-Yves Deletage, Eric Woirgard Lien HAL : https://hal.science/hal-00955719 Conductive adhesive joint for extreme temperature applications. Auteur(s): J. B. Jullien, H. Frémont, J. Y. Deletage Lien HAL : https://hal.science/hal-00905894 A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization Auteur(s): François Le Henaff, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-00795345 Behavior and State-of-Health Monitoring of Li-ion Batteries Using Impedance Spectroscopy and Recurrent Neural Networks Auteur(s): Akram Eddahech, Olivier Briat, Nicolas Bertrand, Jean-Yves Delétage, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00709570 Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00584164 Ageing monitoring of lithium-ion cell during power cycling tests Auteur(s): Akram Eddahech, Olivier Briat, Hervé Henry, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00641829 How supercapacitors reach end of life criteria during calendar life and power cycling tests Auteur(s): Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00641859 Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling Auteur(s): Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Hassane El Brouji, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00527080 Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Adel Benmansour, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00414779 Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly. Auteur(s): J.-Y. Delétage, E. Woirgard, I. Favre, P. Lagonotte, G. Burban Lien HAL : https://hal.science/hal-00380410 Challenges and potential of new approaches for reliability assessment of nanotechnologies Auteur(s): L. Bechou, Y. Danto, J.Y. Deletage, F. Verdier, Y. Deshayes, S. Fregonese, C. Maneux, T. Zimmer, D. Laffitte Lien HAL : https://hal.science/hal-00266387 Reliability Evaluation of Adhesive bonded SMT Components in Industrial Applications Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00183960 Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations Auteur(s): Jean-Yves Deletage, Frédéric Verdier, Bernard Plano, Yannick Deshayes, Laurent Bechou, Yves Danto Lien HAL : https://hal.science/hal-00183949 Moisture Diffusion in BCB Resins used for MEMS Packaging Auteur(s): Angélique Tetelin, Claude Pellet, Jean-Yves Deletage, Bertrand Carbonne, Yves Danto Lien HAL : https://hal.science/hal-00183113 The Use Impedance Spectroscopy, SEM and SAM Imaging for Early Detection of Failure in SMT Assemblies Auteur(s): Y. Ousten, S. Medji, A. Fenech, J. Y. Deletage, L. Bechou, M.G. Perichaud, Y. Danto Lien HAL : https://hal.science/hal-00164931 How to study delamination in plastic encapsulated devices Auteur(s): Hélène Fremont, Jean-Yves Deletage, Kirsten Weide-Zaage, Yves Danto Lien HAL : https://hal.science/hal-00183958 Humidity Sensors for a Pulmonary Function Diagnostic Microsystem Auteur(s): Céline Laville, Jean-Yves Deletage, Claude Pellet Lien HAL : https://hal.science/hal-00183117 Evaluation of the moisture sensitivity of molding compounds of IC's Packages. Auteur(s): Hélène Fremont, Jean-Yves Deletage, Alberto Pintus, Yves Danto Lien HAL : https://hal.science/hal-00183959Book sections (1)
Thermal Capability of Components Auteur(s): Christian Zardini, Jean-Yves Delétage Lien HAL : https://hal.science/hal-00988736Conference proceedings (54)
Dynamics of the corrosion for SAC305 solder alloy in salt environment Auteur(s): K. Akoda, A. Guedon-Gracia, Éric Lebraud, J.-Y. Deletage, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-03665831 Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Auteur(s): Samuel Pin, Alexandrine Guedon-Gracia, Jean-Yves Delétage, Julie Fouquet, Hélène Fremont Lien HAL : https://hal.science/hal-02516819 Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations Auteur(s): F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont Lien HAL : https://hal.science/hal-02517306 Vibration test and simulation of printed circuit board Auteur(s): Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Fremont Lien HAL : https://hal.science/hal-02516844 Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire Auteur(s): O. Briat, J.-Y. Delétage, T. Dubois, G. Duchamp, H. Frémont, A. Guédon-Gracia, L. Theolier, J.-M. Vinassa, E. Woirgard Lien HAL : https://hal.science/hal-02518400 Initiation à la recherche sur la Fiabilité en microélectronique par la physique :Mini-projets en laboratoire Auteur(s): J-y Deletage, T. Dubois, G. Duchamp, L. Theolier, J-M Vinassa, E. Woirgard, H. Fremont, O. Briat, A. Guédon-Gracia Lien HAL : https://hal.science/hal-02516984 Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs Auteur(s): Omar Chihani, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard, Alain Bensoussan, André Durier Lien HAL : https://hal.science/hal-02500021 L'effet de la température et de la tension sur des vieillissements HTRB et HTGB pour des HEMTs GaN de puissance Auteur(s): Omar Chihani, Loïc Théolier, Alain Bensoussan, Pierre Bondue, Jean-Yves Deletage, André Durier, Eric Woirgard Lien HAL : https://hal.science/hal-02981877 Characterization of external pressure effects on lithium-ion pouch cell Auteur(s): Yuanci Zhang, Olivier Briat, Jean-Yves Delétage, Cyril Martin, Guillaume Gager, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-01892433 Performance quantification of last generation Li-ion batteries in wide temperature range Auteur(s): Yuanci Zhang, Olivier Briat, Cyril Martin, Jean-Yves Delétage, Guillaume Gager, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-01657701 Effect of voids on crack propagation in AuSn die attach for high-temperature power modules Auteur(s): Faical Arabi, Loic Théolier, Toni Youssef, Mathieu Medina, Jean-Yves Deletage, Eric Woirgard Lien HAL : https://hal.science/hal-01662929 Etude thermomécanique de la dégradation des assemblages de puissance soumis à des vieillissements à haute température Auteur(s): Faical Arabi, Loïc Théolier, Martineau D., Jean-Yves Deletage, Eric Woirgard Lien HAL : https://hal.science/hal-01361692 Dynamic battery aging model: representation of reversible capacity losses using first order model approach Auteur(s): Issam Baghdadi, Olivier Briat, Jean-Yves Delétage, Philippe Gyan, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-01308647 Intérêt de la simulation 2D multicellulaire par éléments-finis pour l'analyse d'un défaut lié un décollement de fil de câblage sur une puce de puissance IGBT Auteur(s): Kamal El Boubkari, Stéphane Azzopardi, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00955758 Processing and characterization of a 100 % low-temperature Ag-sintered three-dimensional structure, European Conference on Power Electronics and Applications Auteur(s): Amandine Masson, Stéphane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-00955727 Fiabilité d'une diode DT2 reportée sur un substrat DBC par frittage de pâte d'argent Auteur(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-01017558 Investigation of mechanical stress effect on electrical behavior of Trench Punch Through IGBT under short-circuit condition at low and high temperature Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00955754 Silver sintering wire-bonding less power module for high temperature applications Auteur(s): Francois Le Henaff, Stephane Azzopardi, Loïc Théolier, Jean-Yves Deletage, Eric Woirgard, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-01065293 Fiabilité d'une diode DT2 reportée sur un substrat DBC par frittage de pâte d'argent Auteur(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, Francois Le Henaff, Jean-Yves Deletage, Eric Woirgard Lien HAL : https://hal.science/hal-01065237 First Assemblies Using Deep Trench Termination Diodes Auteur(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-01017522 2D finite elements electro-thermal modeling for IGBT: uni and multicellular approach Auteur(s): Kamal El Boubkari, Stephane Azzopardi, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00795341 Development of high temperature packaging technologies for SiC power devices based on finite elements simulanation and experiments: thermal approach Auteur(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00795337 Thermal performances evaluation of new high temperature power packages using SiC devices Auteur(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Eric Woirgard, Jean-Yves Delétage Lien HAL : https://hal.science/hal-00795339 Frittage de nano-pâte d'argent : impact de la métallisation du substrat sur la tenue à la fatigue thermique des assemblages de puissance Auteur(s): François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet Lien HAL : https://hal.science/hal-00782838 Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards Auteur(s): Hassene Fridhi, Geneviève Duchamp, Valerie Vigneras, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Hélène Fremont, Tristan Dubois Lien HAL : https://hal.science/hal-00709116 Transistor thermal fractional modeling for junction temperature estimation Auteur(s): Jocelyn Sabatier, Christophe Farges, H.C. Nguyen, Xavier Moreau, Jean-Yves Delétage Lien HAL : https://hal.science/hal-00668926 Performances regeneration of supercapacitors during accelerated ageing tests in power cycling Auteur(s): Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00641852 Electromechanical Characterization of "Flying" Planar Gate Punch Through IGBT Bare Die Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Florence Capy, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00585061 A connection of thermo-mechanical finite elements tools with electro-thermal finite elements simulation: towards an electro-thermo-mechanical finite elements modeling for power semiconductor devices Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, Isabelle Favre Lien HAL : https://hal.science/hal-00585076 Caractérisation électromécanique en puces " flottantes " d'IGBT à grille planaire Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Florence Capy, Eric Woirgard Lien HAL : https://hal.science/hal-00584114 A first approach on the failure mechanisms of IGBT inverters for aeronautical applications: effect of humidity-pressure combination Auteur(s): Hassan Abbad, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, P. Rollin, Karl Marchand, Tony Lhommeau, Michel Piton Lien HAL : https://hal.science/hal-00584142 Thermo-mechanical simulations in double-sided heat transfer power assemblies Auteur(s): Eric Woirgard, Isabelle Favre, Jean-Yves Delétage, Stephane Azzopardi, Renan Léon, Guy Convenant, Zoubir Khatir Lien HAL : https://hal.science/hal-00584904 Assessment of uni-axial mechanical stress on Trench IGBT under severe operating conditions: a 2D physically-based simulation approach Auteur(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00585066 Evaluation of the performances of a novel Punch Through Trench IGBT using a Si(1-x)Ge(x) N+ buffer layer by using finite elements simulations Auteur(s): Stephane Azzopardi, Yassine Belmehdi, Florence Capy, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00584133 Ageing quantification of supercapacitors during power cycling using online and periodic characterization tests Auteur(s): Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Richard Lallemand, Juliette Kauv, Gérard Coquery, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00641857 Does power device sensitivity to mechanical stress can be used as sensor for power assembly health monitoring? Auteur(s): Florence Capy, Stephane Azzopardi, Kama El Boubkari, Yassine Belmehdi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00591063 Impact of temperature and voltage on the evolution of performance of supercapacitor in the calendar ageing Auteur(s): Ramzi Chaari, Nicolas Bertrand, Olivier Briat, Hassane El Brouji, Jean-Yves Delétage, Jean-Michel Vinassa Lien HAL : https://hal.science/hal-00584822 Thermomechanical behaviour of ceramic ball grid array based on FEM simulations and experimentations Auteur(s): Jean-Yves Delétage, Alain Fenech, Laurent Bechou, Yves Ousten, Yves Danto, Michel Salagoity, Christiane Faure, S. Rao Lien HAL : https://hal.science/hal-00385312 Thermo-mechanical optimization of heat spreader geometry for an automotive power assembly Auteur(s): J.-Y. Delétage, E. Woigard, I. Favre, P. Lagonotte, G. Burban Lien HAL : https://hal.science/hal-00380428 Moisture induced effects in PoP Auteur(s): A. Guédon-Gracia, W. Feng, J.-Y. Delétage, F. Verdier, Hélène Null Fremont Lien HAL : https://hal.science/hal-00385358 Evaluation of conductive adhesives for industrial SMT assemblies Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto, Christiane Faure, Michel Salagoity Lien HAL : https://hal.science/hal-00183970 Evolution of Reliability Assessment In PCB Assemblies Auteur(s): Yves Danto, Jean-Yves Deletage, Frédéric Verdier, Hélène Fremont Lien HAL : https://hal.science/hal-00183967 The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies Auteur(s): Yves Ousten, Said Mejdi, Alain Fenech, Jean-Yves Deletage, Laurent Bechou, Marie-Genevieve Perichaud, Yves Danto Lien HAL : https://hal.science/hal-00182923 Life prediction of BGA and CSP assemblies using an experimental degradation law and fem simulations Auteur(s): Jean-Yves Deletage, Hélène Fremont, Patrick Louis, Yves Danto, Bernard Plano, Bertrand Carbonne Lien HAL : https://hal.science/hal-00183968 New industrial application in 3D interconnection Auteur(s): C. Val, O. Lignier, N. Chandler, A. Pizzato, Jean-Yves Deletage, Yves Ousten, A. Val Lien HAL : https://hal.science/hal-00182865 Eurelnet (EUropean RE Liability NETwork) Auteur(s): Yves Ousten, Jean-Yves Deletage Lien HAL : https://hal.science/hal-00182906 Thermomechanical Behaviour of Adhesive Jointed SMT Components Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Davide Carboni, Hélène Fremont, Yves Danto, Christiane Faure Lien HAL : https://hal.science/hal-00183973 Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly Auteur(s): Eric Woirgard, Jean-Yves Delétage, Isabelle Favre, Patrick Lagonotte, Gwenael Burban Lien HAL : https://hal.science/hal-00182176 Vieillissement par pénétration d humidité des résines d enrobage de circuits intégrés Auteur(s): Jean-Yves Deletage, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00183969 Some Mechanical and Metallurgical Aspects of the Degradation in Interconnects Auteur(s): Michel Ignat, Hélène Fremont, Jean-Yves Deletage, Yves Danto Lien HAL : https://hal.science/hal-00183965 Humidity Sensors for a Pulmonary Function Diagnostic Microsystem Auteur(s): Céline Laville, Jean-Yves Deletage, Claude Pellet Lien HAL : https://hal.science/hal-00183136 Report des composants CMS à l'aide d'une colle conductrice Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Yves Ousten, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00182921 Test chip for qualification of packaging assemblies Auteur(s): Jean-Yves Deletage, Hélène Fremont, Olivier Puig, Claude Pellet, Pascal Fouillat, Yves Danto Lien HAL : https://hal.science/hal-00183081 Optimisation of an Assembling Process of Passive Components reported with Conductive Adhesives Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Gilles N'Kaoua, Hélène Fremont, Yves Danto, Olivier Puig Lien HAL : https://hal.science/hal-00183972Invited lectures (2)
Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test Auteur(s): Komlan Elom Akoda, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Bernard Plano, Helene Fremont Lien HAL : https://hal.science/hal-04273292 Nouveaux indicateurs de suivi de vieillissement des assemblages de puissance : impact des contraintes mécaniques sur les caractéristiques électriques des composants de puissance silicium Auteur(s): Stephane Azzopardi, Yassine Belmehdi, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00585071Send a email to Jean-Yves DELETAGE :
