Alexandrine GUEDON-GRACIA

Associate Professor

Research group : RELIABILITY

Team : REMI,RIAD

Tel : 0540003334

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Article (19)

Impact of temperature on the corrosion of lead-free solder alloy during salt spray test Auteur(s): K.E. Akoda, A. Guédon-Gracia, J.-Y. Delétage, B. Plano, H. Frémont Lien HAL : https://hal.science/hal-03375855 From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guédon-Gracia, S. Pin, P. Nguyen, H. Frémont Lien HAL : https://hal.science/hal-03375843 Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability Auteur(s): F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont Lien HAL : https://hal.science/hal-03011606 Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components Auteur(s): E. Ben Romdhane, A. Guédon-Gracia, S. Pin, P. Roumanille, H. Frémont Lien HAL : https://hal.science/hal-03011618 Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging Auteur(s): Pierre Roumanille, Emna Ben Romdhane, Samuel Pin, Patrick Nguyen, Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont Lien HAL : https://hal.science/hal-03375916 Les cartes d’extension PCBmod : conception et applications pédagogiques VHDL et micro-assemblage Auteur(s): Alexandrine Gracia, Hélène Debéda, Jean Tomas Lien HAL : https://hal.science/hal-02442408 Sequential combined thermal cycling and vibration test and simulation of printed circuit board Auteur(s): Faical Arabi, Alexandrine Gracia, Hélène Fremont, Jean-Yves Delétage Lien HAL : https://hal.science/hal-02516781 Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Auteur(s): S. Pin, A. Gracia, J.-Y. Delétage, H. Fremont Lien HAL : https://hal.science/hal-02515004 Creep measurement and choice of creep laws for BGA assemblies' reliability simulation Auteur(s): Samuel Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Fremont Lien HAL : https://hal.science/hal-02516790 Combined creep characterisation from single lap shear tests and 3D implementation for fatigue simulations Auteur(s): S. Pin, H. Fremont, A. Guédon-Gracia Lien HAL : https://hal.science/hal-01660890 High temperature ageing of microelectronics assemblies with SAC solder joints Auteur(s): Wissam Sabbah, Pierre Bondue, Oriol Aviño Salvado, Cyril Buttay, Héìène Frémont, Alexandrine Guédon-Gracia, Hervé Morel Lien HAL : https://hal.science/hal-01564755 Innovative conception of SiC MOSFET-Schottky 3D power inverter module with double side cooling and stacking using silver sintering Auteur(s): Barriere Maxime, Alexandrine Guédon-Gracia, Eric Woirgard, Serge Bontemps, Francois Le Henaff Lien HAL : https://hal.science/hal-01671865 Virtual prototyping in a Design-for-Reliability approach Auteur(s): S. Barnat, A. Guédon-Gracia, Hélène Frémont Lien HAL : https://hal.science/hal-01257900 Effects of salt spray test on lead-free solder alloy Auteur(s): A. Guédon-Gracia, H. Frémont, B. Plano, Y. Delétage J., K. Weide-Zaage Lien HAL : https://hal.science/hal-01400240 Methodological approach for predictive reliability: practical case studies Auteur(s): Hélène Fremont, Geneviève Duchamp, Alexandrine Guedon-Gracia, Frédéric Verdier Lien HAL : https://hal.science/hal-00788556 Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength Auteur(s): S. Barnat, Hélène Fremont, Alexandrine Guedon-Gracia, Eric Cadalen Lien HAL : https://hal.science/hal-00745982 Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage Auteur(s): M. Berthou, P. Retailleau, Hélène Frémont, A. Guédon-Gracia, C. Jéphos-Davennel Lien HAL : https://hal.science/hal-00477613 Analysis of 2 aging types for SAC solder joint: accelerated thermal cycling (ATC) and thermal storage Auteur(s): Berthou Matthieu, Pascal Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, Catherine Jéphos-Davennel Lien HAL : https://hal.science/hal-00415091 Reliability of Lead-Free BGA Assembly: Correlation Between Accelerated Ageing Tests and FE Simulations Auteur(s): Alexandrine Guédon-Gracia, Eric Woirgard, Christian Zardini Lien HAL : https://hal.science/hal-00403579

Conference proceedings (38)

Evaluation of SAC solder joint thermomechanical fatigue in different types of components Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Lien HAL : https://hal.science/hal-03665823 Dynamics of the corrosion for SAC305 solder alloy in salt environment Auteur(s): K. Akoda, A. Guedon-Gracia, Éric Lebraud, J.-Y. Deletage, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-03665831 QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms Auteur(s): E. Ben Romdhane, P. Roumanille, Alexandrine Guedon-Gracia, S. Pin, P. Nguyen, Helene Fremont Lien HAL : https://hal.science/hal-03781126 Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Lien HAL : https://hal.science/hal-03336972 Procédé de fabrication d’un circuit redresseur de puissance : de la fabrication de diodes Silicium à leur assemblage sur substrat métallisé d’alumine Auteur(s): Hélène Debéda, Alexandrine Gracia, Magali Dematos, Isabelle Favre, Bernard Plano, Jean Tomas, Reasmey Tan, C. Rouabhi, Marc Respaud Lien HAL : https://hal.science/hal-03500175 Initiation à la recherche sur la Fiabilité en microélectronique par la physique :Mini-projets en laboratoire Auteur(s): J-y Deletage, T. Dubois, G. Duchamp, L. Theolier, J-M Vinassa, E. Woirgard, H. Fremont, O. Briat, A. Guédon-Gracia Lien HAL : https://hal.science/hal-02516984 Vibration test and simulation of printed circuit board Auteur(s): Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Fremont Lien HAL : https://hal.science/hal-02516844 Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations Auteur(s): F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont Lien HAL : https://hal.science/hal-02517306 Statistical study of SAC solder joints in QFN and BGA assemblies Auteur(s): A. Gracia, A. Badetz, F. Arabi, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-02477114 Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire Auteur(s): O. Briat, J.-Y. Delétage, T. Dubois, G. Duchamp, H. Frémont, A. Guédon-Gracia, L. Theolier, J.-M. Vinassa, E. Woirgard Lien HAL : https://hal.science/hal-02518400 Etudes sans plomb au laboratoire IMS Auteur(s): Alexandrine Guedon-Gracia Lien HAL : https://hal.science/hal-02516896 Electromigration Effects in Corroded BGA Auteur(s): Kirsten Weide-Zaage, Alexandrine Guedon-Gracia, Hélène Fremont Lien HAL : https://hal.science/hal-02516854 Etude de la corrosion de brasure sans Pb en brouillard salin Auteur(s): Alexandrine Guedon-Gracia Lien HAL : https://hal.science/hal-02516893 Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Auteur(s): Samuel Pin, Alexandrine Guedon-Gracia, Jean-Yves Delétage, Julie Fouquet, Hélène Fremont Lien HAL : https://hal.science/hal-02516819 Study of corrosion in BGA solder balls Auteur(s): K. Weide-Zaage, H. Frémont, A. Guédon-Gracia, Y. Feng, A. Chen Lien HAL : https://hal.science/hal-01552830 Lead free solder joints characterisation using single lap shear tests Auteur(s): Samuel Pin, Hélène Frémont, Alexandrine Guedon-Gracia Lien HAL : https://hal.science/hal-01660937 Corrosion study on BGA assemblies Auteur(s): A. Guédon-Gracia, H. Frémont, J. Y. Delétage, K. Weide-Zaage Lien HAL : https://hal.science/hal-01400226 Harsh Marine Environment - Toward Corrosion Simulation Auteur(s): K. Weide-Zaage, A. Moujbani, H. Frémont, Alexandrine Guedon-Gracia Lien HAL : https://hal.science/hal-01153317 Thermal performance evaluation of SiC power devices packaging Auteur(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00788775 Development of high temperature packaging technologies for SiC power devices based on finite elements simulanation and experiments: thermal approach Auteur(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Jean-Yves Delétage, Eric Woirgard Lien HAL : https://hal.science/hal-00795337 Thermal performance evaluation of SiC power devices packaging Auteur(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00788331 Thermal performances evaluation of new high temperature power packages using SiC devices Auteur(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Eric Woirgard, Jean-Yves Delétage Lien HAL : https://hal.science/hal-00795339 A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability Auteur(s): H. Debéda, I. Favre, A. Guédon-Gracia, N. Labat, B. Plano, H. Frémont Lien HAL : https://hal.science/hal-00905901 Development of high temperature packaging technologies for SiC power devices based on finite elements simulations and experiments: thermal approach Auteur(s): Alexandrine Guédon-Gracia, Stephane Azzopardi, Eric Woirgard Lien HAL : https://hal.science/hal-00788759 Stage de microassemblage Pôle CNFM de Bordeaux / IMS Bordeaux : réalisation de circuits hybrides et capteurs Auteur(s): Hélène Debéda, Corinne Dejous, Hélène Frémont, Alexandrine Gracia, Isabelle Favre, Jean-Luc Lachaud, Bernard Plano, Jean Tomas Lien HAL : https://hal.science/hal-00744834 Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards Auteur(s): Hassene Fridhi, Geneviève Duchamp, Valerie Vigneras, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Hélène Fremont, Tristan Dubois Lien HAL : https://hal.science/hal-00709116 Vibration test durability on large BGA assemblies: Evaluation of reinforcement techniques, Auteur(s): M. Berthou, H. Lu, P. Retailleau, H. Frémont, A. Guédon-Gracia, C. Davennel, C. Bailey Lien HAL : https://hal.science/hal-00499499 Influence of PCB design and materials on chip solder joint reliability Auteur(s): Matthieu Berthou, Hélène Frémont, Alexandrine Gracia, Catherine Jéphos-Davennel Lien HAL : https://hal.science/hal-00477591 Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Auteur(s): Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen, Catherine Bunel, François Neuilly, Jean-René Tenailleau Lien HAL : https://hal.science/hal-00477594 Moisture induced effects in PoP Auteur(s): A. Guédon-Gracia, W. Feng, J.-Y. Delétage, F. Verdier, Hélène Null Fremont Lien HAL : https://hal.science/hal-00385358 Electrically driven matter transport effects in PoP interconnections Auteur(s): W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, Hélène Null Fremont Lien HAL : https://hal.science/hal-00385360 Etude de la fiabilité des assemblages PoP (Package-on-Package) Auteur(s): W. Feng, H. Frémont, A. Guédon-Gracia, F. Verdier, B. Plano Lien HAL : https://hal.science/hal-00403605 Virtual prototyping of a Wafer Level Chip Scale Package: Underfill role in die cracking Auteur(s): S. Barnat, S. Bellenger, H. Frémont, A. Guédon-Gracia, P. Talbot Lien HAL : https://hal.science/hal-00385369 Méthodes d'analyses et mécanisme de propagation des fissures des joints de brasure SAC (Sn-Ag-Cu) en fatigue thermomécanique Auteur(s): M. Berthou, P. Retailleau, H. Frémont, A. Guédon-Gracia, C. Jéphos-Davennel Lien HAL : https://hal.science/hal-00403608 High Density IC Packaging Reliability Auteur(s): Geneviève Duchamp, Hélène Null Fremont, Alexandrine Guedon-Gracia, Frédéric Verdier Lien HAL : https://hal.science/hal-00323388 Analytical Model for Thermally-induced Warpage of POP Auteur(s): Wei Feng, Hélène Null Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00323410 Analytical model for thermally-induced warpage of POP Auteur(s): Wei Feng, Hélène Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00326445 SiP vs SoC : An application-driven perspective Auteur(s): Geneviève Duchamp, Hélène Frémont, Alexandrine Guédon-Gracia, Frédéric Verdier Lien HAL : https://hal.science/hal-00327271

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