This thesis, conducted in partnership with the IMS laboratory and Thales Research & Technology, focuses on electronic packaging. It is structured around two main research axes and deals with the implementation and evaluation of novel protection solutions based on additive manufacturing.
The first axis aims to evaluate the electromagnetic shielding performance of two of these processes. The objective is to understand the underlying physical phenomena, first at the isolated material level, and then within a complete system. This approach, combining experimental characterization and finite element simulation, integrates the influence of the printed circuit board design on the overall performance. It also offers a comparison of several characterization methods to identify the most relevant ones depending on the usage scenarios.
The second axis investigates the moisture uptake of plastic packages. Water absorption within these encapsulating resins is initially characterized through gravimetric analysis. A novel in-situ measurement method, employing embedded sensors, was subsequently developed and correlated with the gravimetric results. This original methodology made it possible to evaluate the influence of atomic layer deposition on the absorption capabilities of these packages
