Bernard PLANO

Research Engineer

Research group : COMMON SUPPORT SERVICES

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Tel : 0540006553

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Article (20)

Impact of temperature on the corrosion of lead-free solder alloy during salt spray test Auteur(s): K.E. Akoda, A. Guédon-Gracia, J.-Y. Delétage, B. Plano, H. Frémont Lien HAL : https://hal.science/hal-03375855 Low temperature spark plasma sintering of efficient (K,Na)NbO3 ceramics Auteur(s): Christopher Castro Chavarría, Hélène Debéda, Bernard Plano, Lionel Teule-gay, Dominique Michau, Sébastien Fourcade, Mario Maglione, U-Chan Chung, Catherine Elissalde Lien HAL : https://hal.science/hal-04425784 Investigation of critical parameters in power supplies components failure due to electric pulse Auteur(s): L. Curos, T. Dubois, G. Mejecaze, F. Puybaret, B. Plano, J.-M. Vinassa Lien HAL : https://hal.science/hal-03493510 Synthesis of imprinted hydrogel microbeads by inverse Pickering emulsion to controlled release of adenosine 5′‑monophosphate Auteur(s): Mohamed Ayari, Porkodi Kadhirvel, Patrick Favetta, Bernard Plano, Corinne Dejous, Benjamin Carbonnier, Luigi Agrofoglio Lien HAL : https://hal.science/hal-02299722 Importance and Requirement of frequency band specific RF probes EM Models in sub-THz and THz Measurements up to 500 GHz Auteur(s): Chandan Yadav, Marina Deng, Sebastien Fregonese, Marco Cabbia, Magali de Matos, Bernard Plano, Thomas Zimmer Lien HAL : https://hal.science/hal-02884144 Generation of metal composition gradients by means of bipolar electrodeposition Auteur(s): Gwendoline Tisserant, Zahra Fattah, Cédric Ayela, Jérôme Roche, Bernard Plano, Dodzi Zigah, Bertrand Goudeau, Alexander Kuhn, Laurent Bouffier Lien HAL : https://hal.science/hal-02049662 Comparison of on-wafer TRL calibration to ISS SOLT calibration with open-short de-embedding up to 500 GHz Auteur(s): Sebastien Fregonese, Marina Deng, Magali de Matos, Chandan Yadav, Christian Raya, Bertrand Ardouin, Simon Joly, Bernard Plano, Thomas Zimmer Lien HAL : https://hal.science/hal-01985495 A quantitative thermal and thermomechanical analysis for design optimization and robustness assessment of microassembled high power Yb:CaF2 thin-disk Laser Auteur(s): S. Joly, M-A. Lemesre, B. Lévrier, C. Lyszyk, B. Plano, A. Courjaud, T. Taira, L. Bechou Lien HAL : https://hal.science/hal-02273406 Site Selective Generation of Sol–Gel Deposits in Layered Bimetallic Macroporous Electrode Architectures Auteur(s): Hélène Lalo, Yémima Bon-Saint-Côme, Bernard Plano, Mathieu Etienne, Alain Walcarius, Alexander Kuhn Lien HAL : https://hal.univ-lorraine.fr/hal-01941835 Electro-Mechanical properties of Inkjet-Printed graphene oxide nanosheets Auteur(s): Ioannis Nikolaou, Hamida Hallil, Véronique Conédéra, Bernard Plano, Ollivier Tamarin, Jean-Luc Lachaud, David Talaga, Sébastien Bonhommeau, Corinne Dejous, Dominique Rebière Lien HAL : https://hal.science/hal-01487662 Effects of salt spray test on lead-free solder alloy Auteur(s): A. Guédon-Gracia, H. Frémont, B. Plano, Y. Delétage J., K. Weide-Zaage Lien HAL : https://hal.science/hal-01400240 Love Acoustic Wave-Based Devices and Molecularly-Imprinted Polymers as Versatile Sensors for Electronic Nose or Tongue for Cancer Monitoring Auteur(s): Corinne Dejous, Hamida Hallil, Vincent Raimbault, Jean-Luc Lachaud, Bernard Plano, Raphaël Delépée, Patrick Favetta, Luigi Agrofoglio, Dominique Rebière Lien HAL : https://hal.science/hal-01356195 Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications Auteur(s): M. Mickaël Pocheron,, J.-Y. Delétage, B. Plano, Alexandrine Gracia-Guedon, Hélène Fremont Lien HAL : https://hal.science/hal-01257918 Love Wave Sensor Based on Thin Film Molecularly Imprinted Polymer: Study of VOCs Adsorption Auteur(s): Hamida Hallil, Nima Omar-Aouled, Bernard Plano, Raphaël Delépée, Luigi A. Agrofoglio, Corinne Dejous, Dominique Rebiere Lien HAL : https://hal.science/hal-01241891 Nucleosides analogs recognition by Molecularly Imprinted Polymer- coated Love wave sensor Auteur(s): Naïma Lebal, Hamida Hallil, Corinne Dejous, B. Plano, Aleksandra Krstulja, Raphaël Delépée, Luigi A. Agrofoglio, Dominique Rebière Lien HAL : https://hal.science/hal-00847369 Electro-and thermomigration-induced IMC formation in SnAg3.0Cu0.5 solder joints on nickel gold pads Auteur(s): L. Meinshausen, H. Frémont, K. Weide-Zaage, B. Plano Lien HAL : https://hal.science/hal-00905898 Improved performances of polymer-based dielectric by using inorganic/organic core-shell nanoparticles Auteur(s): Warda Benhadjala, Isabelle Bord-Majek, Laurent Béchou, Ephraim Suhir, Matthieu Buet, Fabien Rougé, Vincent Gaud, Bernard Plano, Yves Ousten Lien HAL : https://hal.science/hal-00765215 Pushing toward the limits of acceleration: Example on wire-bond assemblies Auteur(s): Jean-Baptiste Jullien, Bernard Plano, Hélène Fremont Lien HAL : https://hal.science/hal-00745987 Scanning laser ultrasonics experiments for in-situ non-destructive analysis of integrated circuits Auteur(s): Grégory Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Bernard Plano, Yves Danto Lien HAL : https://hal.science/hal-00181926 Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations Auteur(s): Jean-Yves Deletage, Frédéric Verdier, Bernard Plano, Yannick Deshayes, Laurent Bechou, Yves Danto Lien HAL : https://hal.science/hal-00183949

Conference proceedings (20)

Dynamics of the corrosion for SAC305 solder alloy in salt environment Auteur(s): K. Akoda, A. Guedon-Gracia, Éric Lebraud, J.-Y. Deletage, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-03665831 Procédé de fabrication d’un circuit redresseur de puissance : de la fabrication de diodes Silicium à leur assemblage sur substrat métallisé d’alumine Auteur(s): Hélène Debéda, Alexandrine Gracia, Magali Dematos, Isabelle Favre, Bernard Plano, Jean Tomas, Reasmey Tan, C. Rouabhi, Marc Respaud Lien HAL : https://hal.science/hal-03500175 Statistical study of SAC solder joints in QFN and BGA assemblies Auteur(s): A. Gracia, A. Badetz, F. Arabi, B. Plano, H. Fremont Lien HAL : https://hal.science/hal-02477114 Impact of on-Silicon De-Embedding Test Structures and RF Probes Design in the Sub-THz Range Auteur(s): Chandan Yadav, Marina Deng, Sebastien Fregonese, Magali de Matos, Bernard Plano, Thomas Zimmer Lien HAL : https://hal.science/hal-01985501 Nucleosides analogs recognition by Molecularly Imprinted Polymer- coated Love wave sensor Auteur(s): Naïma Lebal, Hamida Hallil, Corinne Dejous, Bernard Plano, Raphaël Delépée, Luigi A. Agrofoglio, Dominique Rebière Lien HAL : https://hal.science/hal-00938251 Love wave sensor based on thin film molecularly imprinted polymer : MIP layer morphology and nucleosides analogs detection Auteur(s): Nima Omar-Aouled, Hamida Hallil, Bernard Plano, Raphaël Delépée, Luigi A. Agrofoglio, Corinne Dejous, Dominique Rebière Lien HAL : https://hal.science/hal-00938274 SH-SAW Sensing System based on thin film molecularly imprinted polymer: Study of Volatile organic compounds adsorption Auteur(s): Hamida Hallil, Nima Omar-Aouled, Bernard Plano, Raphaël Delépée, Luigi A. Agrofoglio, Corinne Dejous, Dominique Rebière Lien HAL : https://hal.science/hal-00938255 A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability Auteur(s): H. Debéda, I. Favre, A. Guédon-Gracia, N. Labat, B. Plano, H. Frémont Lien HAL : https://hal.science/hal-00905901 Stage de microassemblage Pôle CNFM de Bordeaux / IMS Bordeaux : réalisation de circuits hybrides et capteurs Auteur(s): Hélène Debéda, Corinne Dejous, Hélène Frémont, Alexandrine Gracia, Isabelle Favre, Jean-Luc Lachaud, Bernard Plano, Jean Tomas Lien HAL : https://hal.science/hal-00744834 Simple and rapid method to fabricate organic microcantilevers based on a sacrificial layer technique Auteur(s): Georges Dubourg, Ludivine Fadel-Taris, Isabelle Dufour, Bernard Plano, Karsten Haupt, Claude Pellet, Cédric Ayela Lien HAL : https://hal.science/hal-00507538 Electrically driven matter transport effects in PoP interconnections Auteur(s): W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, Hélène Null Fremont Lien HAL : https://hal.science/hal-00385360 Etude de la fiabilité des assemblages PoP (Package-on-Package) Auteur(s): W. Feng, H. Frémont, A. Guédon-Gracia, F. Verdier, B. Plano Lien HAL : https://hal.science/hal-00403605 Analytical Model for Thermally-induced Warpage of POP Auteur(s): Wei Feng, Hélène Null Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00323410 Stage de Microassemblage CNFM / IMS Bordeaux : réalisation de circuits hybrides et capteurs Auteur(s): Hélène Debéda, Corinne Dejous, Jean-Luc Lachaud, Magalie Dematos, Bernard Plano, Alexandrine Gracia-Guedon Lien HAL : https://hal.science/hal-00204870 Simple Analytical Model for Thermally-induced Warpage of POP Auteur(s): Wei Feng, Hélène Null Fremont, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00323385 Analytical model for thermally-induced warpage of POP Auteur(s): Wei Feng, Hélène Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Lien HAL : https://hal.science/hal-00326445 Life prediction of BGA and CSP assemblies using an experimental degradation law and fem simulations Auteur(s): Jean-Yves Deletage, Hélène Fremont, Patrick Louis, Yves Danto, Bernard Plano, Bertrand Carbonne Lien HAL : https://hal.science/hal-00183968 Structural Analysis of Integrated Circuits Using Scanning Laser Ultrasonics Auteur(s): Grégory Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Bernard Plano, Yves Danto Lien HAL : https://hal.science/hal-00182908 Structural Analysis of Integrated Circuits Using Scanning Laser Ultrasonics Auteur(s): Grégory Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Bernard Plano, Yves Danto Lien HAL : https://hal.science/hal-00182909 Design for reliability - Impact of microvia technology and assembly process. Auteur(s): Walter Horaud, Hélène Fremont, Bernard Plano, Sylvain Leroux Lien HAL : https://hal.science/hal-00183963

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