Yves OUSTEN

Professor

Research group : WAVES

Team : DEVICES

Tel : 0540006540

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Article (42)

Comparing results of a power prediction tool with measured data from a series of 35 boats Auteur(s): Charles Dumortier, Jean-François Bonnet, Nicolas Régnier, Yves Ousten Lien HAL : https://hal.science/hal-02120784 Highlighting two integration technologies based on vias: Through silicon vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability Auteur(s): M. Balmont, I. Bord Majek, B. Poupard, L. Bechou, Y. Ousten Lien HAL : https://hal.science/hal-01885226 Liquid Crystal Polymer for QFN packaging: Predicted thermo-mechanical fatigue and Design for Reliability Auteur(s): W. Chenniki, I. Bord-Majek, M. Louarn, V. Gaud, Jl. Diot, K. Wongtimnoi, Y. Ousten Lien HAL : https://hal.science/hal-01255459 Photothermal activated failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage Auteur(s): Raphael Baillot, Yannick Deshayes, Yves Ousten, Laurent Béchou Lien HAL : https://hal.science/hal-01213954 Inorganic/organic nanocomposites: Reaching a high filler content without increasing viscosity using core-shell structured nanoparticles Auteur(s): Warda Benhadjala, Morgane Gravoueille, Isabelle Bord-Majek, Laurent Bechou, Ephraim Suhir, Matthieu Buet, Mélanie Louarn, M Weiss, Fabien Rougé, Vincent Gaud, Yves Ousten Lien HAL : https://hal.science/hal-01240791 Overview on sustainability, robustness and reliability of GaN single chip LED devices Auteur(s): Yannick Deshayes, Raphael Baillot, Simon Joly, Yves Ousten, Laurent Béchou Lien HAL : https://hal.science/hal-01221533 Power MOSFET active power cycling for medical system reliability assessment Auteur(s): Amadou Sow, Sinivassane Somaya, Yves Ousten, Jean-Michel Vinassa, Fanny Patoureaux Lien HAL : https://hal.science/hal-00950594 High-power diode laser bars and shear strain Auteur(s): Daniel T. Cassidy, O. Rehioui, Chadwick K. Hall, L. Bechou, Y. Deshayes, A. Kohl, T. Fillardet, Y. Ousten Lien HAL : https://hal.science/hal-00979994 Crack Propagation Modeling in Silicon: A Comprehensive Thermomechanical Finite-Element Model Approach for Power Devices Auteur(s): Damien Calvez, Fabrice Roqueta, Sébastien Jacques, Laurent Bechou, Yves Ousten, Samuel Ducret Lien HAL : https://hal.science/hal-01061431 Starck effects model used to highlight selective activation of failure mechanisms in MQW InGaN/GaN light emitting diodes Auteur(s): Yannick Deshayes, Laurent Bechou, Yves Ousten Lien HAL : https://hal.science/hal-00979617 Effects of silicon coating degradation on GaN MQW LEDs performances using physical and chemical analyses Auteur(s): Raphael Baillot, Yannick Deshayes, Laurent Bechou, T. Buffeteau, I. Pianet, C. Armand, F. Voillot, S. Sorieul, Yves Ousten Lien HAL : https://hal.science/hal-00979970 Improved performances of polymer-based dielectric by using inorganic/organic core-shell nanoparticles Auteur(s): Warda Benhadjala, Isabelle Bord-Majek, Laurent Béchou, Ephraim Suhir, Matthieu Buet, Fabien Rougé, Vincent Gaud, Bernard Plano, Yves Ousten Lien HAL : https://hal.science/hal-00765215 An original DoE-based tool for silicon photodetectors EoL estimation in space environments Auteur(s): P. Spezzigu, L. Bechou, Gianandrea Quadri, O. Gilard, Y. Ousten, M. Vanzi Lien HAL : https://hal.science/hal-00673537 Failure Mechanisms in Packaged Light-Emitting Diodes Under Gamma Radiations: Piezoelectric Model Based on Stark Effect Auteur(s): Y. Deshayes, R. Baillot, O. Rehioui, L. Béchou, O. Gilard, Yves Ousten Lien HAL : https://hal.science/hal-00673553 Implementation of a Design of Experiments Methodology for the Prediction of Phototransistor Degradation in a Space Environment Auteur(s): Piero Spezzigu, C. Caddeo, Gianandrea Quadri, O. Gilard, Laurent Bechou, Yves Ousten, M. Vanzi Lien HAL : https://hal.science/hal-00584333 OPERATIONAL PERFORMANCES DEMONSTRATION OF POLYMER-CERAMIC EMBEDDED CAPACITORS FOR MMIC APPLICATIONS Auteur(s): Isabelle Bord-Majek, Philippe Kertesz, Julie Mazeau, Daniel Caban-Chastas, Bruno Levrier, Laurent Bechou, Yves Ousten Lien HAL : https://hal.science/hal-00641070 Thermomechanical Stresses and Optical Misalignment in 1550 nm Emissive Optoelectronic Modules Using FEM and Process Dispersions Auteur(s): Yannick Deshayes, Laurent Bechou, Frederic Verdier, Yves Ousten, Dominique Laffitte, Jean-Luc Goudard Lien HAL : https://hal.science/hal-00402624 Defect detection in multilayer ceramic capacitors Auteur(s): V. Krieger, W. Wondrak, A. Dehbi, W. Bartel, Y. Ousten, B. Levrier Lien HAL : https://hal.science/hal-00334736 Thermal characteristics measurement of packaged double-heterostructure light emitting diodes for space applications using spontaneous optical spectrum properties Auteur(s): L. Bechou, O. Rehioui, Y. Deshayes, O. Gilard, Gianandrea Quadri, Y. Ousten Lien HAL : https://hal.science/hal-00266383 Selective activation of failure mechanisms in packaged double-heterostructure light emitting diodes using controlled neutron energy irradiation Auteur(s): Yannick Deshayes, Isabelle Bord, Gérard Barreau, Mourad Aiche, Philippe Moretto, Laurent Béchou, A.C. Roherig, Yves Ousten Lien HAL : https://hal.science/hal-00326851 Reliability investigations of 850 nm silicon photodiodes under proton irradiation for space applications Auteur(s): M.L. Bourqui, L. Bechou, O. Gilard, Y. Deshayes, P. del Vecchio, L.S. How, F. Rosala, Y. Ousten, A. Touboul Lien HAL : https://hal.science/hal-00334728 Use of signal processing imaging for the study of a 3D package in harsh environment Auteur(s): J. Augereau, Y. Ousten, B. Levrier, L. Bechou Lien HAL : https://hal.science/hal-00334732 Reliability assessment: New tools for the next generation of packages Auteur(s): Isabelle Bord, Bruno Lévrier, Yannick Deshayes, Laurent Béchou, Yves Ousten Lien HAL : https://hal.science/hal-00313790 Ultrasonic images interpretation improvement for microassembling technologies characterization Auteur(s): L. Bechou, B. Tregon, Y. Ousten, F. Marc, Y. Danto, Ph. Kertesz, R. Even Lien HAL : https://hal.science/hal-00164920 Localization of defects in die-attach assembly by continuous wavelet transform using scanning acoustic microscopy Auteur(s): Laurent Bechou, Léopoldo Angrisani, Yves Ousten, Dominique Dallet, Hervé Levi, Yves Danto, Pasquale Daponte Lien HAL : https://hal.science/hal-00180223 Reliability of Low-Cost PCB Interconnections for Telecommunication Applications Auteur(s): Geneviève Duchamp, Frédéric Verdier, Yannick Deshayes, François Marc, Yves Ousten, Yves Danto Lien HAL : https://hal.science/hal-00181802 Scanning laser ultrasonics experiments for in-situ non-destructive analysis of integrated circuits Auteur(s): Grégory Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Bernard Plano, Yves Danto Lien HAL : https://hal.science/hal-00181926 Comparison between piezoelectric method and ultrasonic signal analysis for multilayer ceramic capacitors type II crack detection Auteur(s): Yves Ousten, Laurent Bechou, Bernard Tregon, Yves Danto Lien HAL : https://hal.science/hal-00181936 The Use Impedance Spectroscopy, SEM and SAM Imaging for Early Detection of Failure in SMT Assemblies Auteur(s): Y. Ousten, S. Medji, A. Fenech, J. Y. Deletage, L. Bechou, M.G. Perichaud, Y. Danto Lien HAL : https://hal.science/hal-00164931 Vibration lifetime modelling of PCB assemblies using steinberg model Auteur(s): A. Dehbi, Yves Ousten, Yves Danto, W. Wondrak Lien HAL : https://hal.science/hal-00181927 Evaluation of a micropackaging analysis technique by highfrequency microwaves Auteur(s): Geneviève Duchamp, Yves Ousten, Yves Danto Lien HAL : https://hal.science/hal-00181934 Failure mechanisms and qualification testing of passive components Auteur(s): Ha Post, P. Letullier, T. Briolat, R. Humke, R. Schuhmann, K. Saarinen, W. Werner, Yves Ousten, G. Lekens, A. Dehbi, W. Wondrak Lien HAL : https://hal.science/hal-00181925 Comparison between piezoelectric method and ultrasonic signal analysis for MLCC crack detection Auteur(s): Y. Ousten, S. Mejdi, L. Bechou, B. Tregon, Y. Danto Lien HAL : https://hal.science/hal-00164925 Comparison between piezoelectric method and ultrasonic signal analysis for crack detection in type II multilayer ceramic capacitors Auteur(s): Yves Ousten, Said Mejdi, Laurent Bechou, Bernard Tregon, Yves Danto Lien HAL : https://hal.science/hal-00181935 Ultrasonic characterisation improvement of microassembling technologies using Time-Frequency analysis Auteur(s): Laurent Bechou, Yves Ousten, Yves Danto Lien HAL : https://hal.science/hal-00181937 Behavioral studyof passive components and coating materials under isostatic pressure and temperature stress conditions Auteur(s): Bernard Tregon, Yves Ousten, Yves Danto, Laurent Bechou, B. Parmentier Lien HAL : https://hal.science/hal-00181931 Simulation of assembly generated constraints during SMT processing and size optimisation of the capacitors by design of experiments Auteur(s): Y. Ousten, L. Bechou, N. Xiong Lien HAL : https://hal.science/hal-00164908 Detection and location of defects in electronic devices by means of scanning ultrasonic microscopy and the wavelet Transform Auteur(s): Léopoldo Angrisani, Laurent Bechou, Dominique Dallet, Pasquale Daponte, Yves Ousten Lien HAL : https://hal.science/hal-00180545 Nondestructive defect detection in multilayer ceramic chip capacitors using piezoelectric analysis and acoustic microscopy Auteur(s): L. Bechou, S. Mejdi, Y. Ousten, Y. Danto Lien HAL : https://hal.science/hal-00164912 Acoustic analysis of an assembly : Structural identification by signal processing (wavelets) Auteur(s): Jean Augereau, Yves Ousten, Laurent Bechou, Yves Danto Lien HAL : https://hal.science/hal-00181930 Nondestructive detection and localization of defects in multilayer ceramic chip capacitors using electromechanical resonances Auteur(s): L. Bechou, S. Mejdi, Y. Ousten, Y. Danto Lien HAL : https://hal.science/hal-00164916 An improved method for automatic detection and location of defects in electronics components using scanning ultrasonic microscopy Auteur(s): Laurent Bechou, Dominique Dallet, Yves Danto, Pasquale Daponte, Yves Ousten, Sergio Rapuano Lien HAL : https://hal.science/hal-00180554

Conference proceedings (84)

Développement d’un nouveau type de condensateur ajustable amagnétique RF haute tension pour l’IRM Auteur(s): Zaineb Jebri, Isabelle Bord Majek, Céline Delafosse, Christophe Pasquet, Yves Ousten Lien HAL : https://hal.science/hal-01655253 Components and packaging based on polymer for future automotive applications Auteur(s): Yves Ousten, Isabelle Bord Majek Lien HAL : https://hal.science/hal-03194659 A new non-magnetic trimmer for the magnetic resonance imaging system Auteur(s): Zaineb Jebri, Isabelle Bord Majek, Céline Delafosse, Christophe Pasquet, Yves Ousten Lien HAL : https://hal.science/hal-01906463 Scanning acoustic microscopy and shear wave imaging mode performances for failure detection in high-density microassembling technologies Auteur(s): Z. Remili, Y. Ousten, B. Levrier, E. Suhir, L. Bechou Lien HAL : https://hal.science/hal-01719760 Electrical modeling approach and manufacturing of a new adjustable capacitor for medical applications Auteur(s): Zaineb Jebri, Isabelle Bord Majek, Céline Delafosse, Yves Ousten Lien HAL : https://hal.science/hal-01957028 Highlighting two integration technologies based on vias: Through Silicon Vias and embedded components into PCB. Strengths and weaknesses for manufacturing and reliability Auteur(s): Mickaël Balmont, Isabelle Bord Majek, B. Poupard, Laurent Bechou, Yves Ousten Lien HAL : https://hal.science/hal-01957288 Ultra-thin actives for embedded components: halfway between thin film technology and embedded Surface Mounted Device. Auteur(s): Mickaël Balmont, Isabelle Bord Majek, Yves Ousten Lien HAL : https://hal.science/hal-01957025 Comparative FEM thermo-mechanical simulations for built-in reliability: surface mounted technology versus embedded technology for silicon dies Auteur(s): Mickaël Balmont, Isabelle Bord Majek, Yves Ousten Lien HAL : https://hal.science/hal-01593354 Fiabilité des composants enfouis dans un circuit électronique dans le secteur de l’automobile Auteur(s): Mickaël Balmont, Isabelle Bord Majek, Yves Ousten Lien HAL : https://hal.science/hal-01655291 Monte-carlo computations for predicted degradation of photonic devices in space environment Auteur(s): Laurent Bechou, Yannick Deshayes, Yves Ousten, Olivier Gilard, Gianandrea Quadri, L.S. How Lien HAL : https://hal.science/hal-01219189 Reduction of mechanical anisotropy in liquid crystal polymer based composite by functionalized silica nano-particles Auteur(s): Walide Chenniki, Isabelle Bord-Majek, Mélanie Louarn, Vincent Gaud, Jean-Luc Diot, Komkrisd Wongtimnoi, R Brunel, Yves Ousten Lien HAL : https://hal.science/hal-01188923 Photothermal activated pellicular failure mechanism in polymer-based packaging of low power InGaN/GaN MQW LED under active storage Auteur(s): Raphael Baillot, Yannick Deshayes, Laurent Béchou, Yves Ousten Lien HAL : https://hal.science/hal-01219195 Thermomechanical stress analysis of copper/silicon interface in Through Silicon Vias using FEM simulations and experimental analysis Auteur(s): Z. Remili, Y. Ousten, B. Levrier, D. Mercier, E. Suhir, L. Bechou Lien HAL : https://hal.science/hal-01067621 Predictive reliability using FEA simulations of power stacked ceramic capacitors for aeronautical applications Auteur(s): Warda Benhadjala, Bruno Levrier, Isabelle Bord-Majek, Laurent Béchou, Ephraim Suhir, Yves Ousten Lien HAL : https://hal.science/hal-00979156 Dispersion of functionalized SiO2 particles into a Liquid Crystal Polymer matrix for a reliable HF package Auteur(s): Walide Chenniki, Isabelle Bord-Majek, Mélanie Louarn, Vincent Gaud, Jean-Luc Diot, Bruno Levrier, Virginie Verriere, Thomas Frank, Komkrisd Wongtimnoi, Yves Ousten Lien HAL : https://hal.science/hal-00934255 Improvement of Stacked High Power Laser Diodes bars by Individual Emitter Characterization Auteur(s): O. Rehioui, L. Bechou, Y. Ousten, A. Kohl, T. Fillardet Lien HAL : https://hal.science/hal-01022734 FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint Auteur(s): W. Chenniki, I. Bord-Majek, B. Levrier, K. Wongtimnoi, Jl. Diot, Y. Ousten Lien HAL : https://hal.science/hal-01020090 FEM simulations for built-in reliability of innovative Liquid Crystal Polymer-based QFN packaging and Sn96.5Ag3Cu0.5 solder joint Auteur(s): Walide Chenniki, Isabelle Bord-Majek, Bruno Levrier, Komkrisd Wongtimnoi, Jean-Luc Diot, Yves Ousten Lien HAL : https://hal.science/hal-00979149 Degradation analysis of individual emitters in 808nm QCW Laser diode array for space applications Auteur(s): O. Rehioui, L. Bechou, Y. Ousten, A. Kohl, T. Fillardet, G. Volluet Lien HAL : https://hal.science/hal-01019447 Long term in-vacuum reliability testing of 980nm Laser Diode Pump Modules for Space Applications Auteur(s): G. Pedroza, L. Bechou, Y. Ousten, Ls. How, O. Gilard, Jl Goudard, F. Laruelle Lien HAL : https://hal.science/hal-01022862 Effect of Processing Factors on Dielectric Properties of BaTiO3/Hyperbranched Polyester Core-Shell Nanoparticles Auteur(s): Warda Benhadjala, Isabelle Bord, Laurent Béchou, Ephraim Suhir, Matthieu Buet, Fabien Rougé, Vincent Gaud, Yves Ousten Lien HAL : https://hal.science/hal-00858671 Proton irradiation effects on InGaAs/InP Photodiodes for Space Applications Auteur(s): G. Pedroza, M. Boutillier, L.S. How, L. Bechou, T. Nuns, P. Arnolda, Y. Ousten Lien HAL : https://hal.science/hal-00798135 Boîtier QFN en LCP : simulation thermo-mécanique 3D Auteur(s): Walide Chenniki, Isabelle Bord-Majek, Yves Ousten Lien HAL : https://hal.science/hal-00859289 Overview of thermal studies on photonics devices for reliability, robustness and new design Auteur(s): Y. Deshayes, A. Royon, R. Baillot, L. Bechou, L. Canioni, Y. Petit, Th. Cardinal, I. Bord, B. Levrier, Y. Ousten Lien HAL : https://hal.science/hal-00786204 Intégration de la fiabilité dès la conception du composant : Application aux approches Top-down et Bottom-up Auteur(s): L. Bechou, F. Verdier, Y. Ousten Lien HAL : https://hal.science/hal-00786235 BaTiO3/polymer hybrid nanoparticles for embedded capacitor applications Auteur(s): Warda Benhadjala, Isabelle Bord-Majek, Matthieu Buet, Fabien Rougé, Laurent Béchou, Yves Ousten Lien HAL : https://hal.science/hal-00714031 Novel Core-Shell Nanocomposite for RF Embedded Capacitors: Processing and Characterization Auteur(s): Warda Benhadjala, Isabelle Bord, Laurent Bechou, Ephraïm Suhir, Matthieu Buet, Fabien Rougé, Yves Ousten Lien HAL : https://hal.science/hal-00713850 A simplified and meaningful crack propagation model in silicon for microelectronic power devices Auteur(s): Damien Calvez, Fabrice Roqueta, Sébastien Jacques, Samuel Ducret, Laurent Bechou, Yves Ousten Lien HAL : https://hal.science/hal-00766150 Modèle prédictif Simplifié de Propagation de Fissure dans les Puces en Silicium de Composants de Puissance Auteur(s): Damien Calvez, Fabrice Roqueta, Sébastien Jacques, Samuel Ducret, Laurent Bechou, Yves Ousten Lien HAL : https://hal.science/hal-00766157 Thermo-mechanical simulation of cavity QFN package based on Liquid Cristal Polymer for reliability study Auteur(s): Walide Chenniki, Isabelle Bord-Majek, Jean-Luc Diot, Bruno Levrier, Yves Ousten, Eddy Romain-Latu, Virginie Verriere, Julien Vittu Lien HAL : https://hal.science/hal-00714005 OpERaS : un nouveau consortium pour l'évaluation de la fiabilité de dispositifs optoélectroniques et photoniques dédiés à l'environnement spatial Auteur(s): L. Bechou, L.S. How, F. Rosala, G. Guibaud, O. Gilard, Gianandrea Quadri, Y. Ousten Lien HAL : https://hal.science/hal-00673559 Optical performances degradation of InGaN/GaN MQW LEDs related to fluorescence shift of copolymer-based silicone coating Auteur(s): R. Baillot, L. Béchou, C. Belin, T. Buffeteau, I. Pianet, C. Absalon, O. Babot, Y. Deshayes, Y. Ousten Lien HAL : https://hal.science/hal-00673972 An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy Auteur(s): Dominique Dallet, Laurent Bechou, Yves Danto, Pasquale Daponte, Yves Ousten, Sergio Rapuano Lien HAL : https://hal.science/hal-00568039 Dielectric properties of core-shell hyperbranched polyester/barium titanate nanocomposites for embedded capacitor applications Auteur(s): Warda Benhadjala, Isabelle Bord-Majek, Matthieu Buet, Fabien Rougé, Yves Ousten Lien HAL : https://hal.science/hal-00600614 Environmental conditions influence on embedded capacitors - Comparison with discrete capacitors Auteur(s): Yves Ousten, Isabelle Bord, Cyril Blot, Bruno Levrier, Laurent Bechou, Philippe Kertesz Lien HAL : https://hal.science/hal-00600734 OpERaS : "OptoElectronic Reliability applied to Space environment" Un nouveau consortium pour l'évaluation de la fiabilité de dispositifs optoélectroniques et photoniques dédiés à l'environnement spatial Auteur(s): Laurent Bechou, F. Rosala, Gérald Guibaud, Yves Ousten Lien HAL : https://hal.science/hal-00584317 Effects of silicone coating degradation on GaN MQW LEDs performances using physical and chemical analyses Auteur(s): R. Baillot, Y. Deshayes, L. Bechou, T. Buffeteau, I. Pianet, C. Armand, F. Voillot, S. Sorieul, Y. Ousten Lien HAL : https://hal.in2p3.fr/in2p3-00532869 Benefits of individual emitter electro-optical characterizations in packaged high power Laser diode bars for space applications Auteur(s): Othman Rehioui, Laurent Bechou, Thierry Fillardet, Andreas Kohl, Daniel T. Cassidy, Yannick Deshayes, Yves Ousten, Gérard Volluet Lien HAL : https://hal.science/hal-00402617 Etude en basse fréquence de condensateurs à base de matériaux organiques enterrés dans les circuits imprimés Auteur(s): Cyril Blot, Isabelle Bord, Yves Ousten Lien HAL : https://hal.science/hal-00402727 Evaluation of static and dynamic performances of silicon-based bipolar phototransistors under radiation Auteur(s): Gianandrea Quadri, O. Gilard, J. L. Roux, Piero Spezzigu, Laurent Bechou, M. Vanzi, Yves Ousten, D. Gibard Lien HAL : https://hal.science/hal-00402614 Embedded passive components to increase the reliability of high frequency electronic circuits Auteur(s): Yves Ousten, Bruno Levrier, Geneviève Duchamp, Philippe Kertesz Lien HAL : https://hal.science/hal-00400482 Electro-optical Characterizations at the Emitter Level in Stacked Laser Diodes Bars for Space Applications Auteur(s): Othman Rehioui, Laurent Bechou, Thierry Fillardet, Andreas Kohl, Yves Ousten, E. Brousse, Gérard Volluet Lien HAL : https://hal.science/hal-00402236 Silicon phototransistor reliability assessment and new selection strategies for space applications Auteur(s): Piero Spezzigu, Laurent Bechou, Yannick Deshayes, Yves Ousten, Gianandrea Quadri, Olivier Gilard, Massimo Vanzi Lien HAL : https://hal.science/hal-00402616 Trapped mobile charges effects on electro-optical performances in silicon phototransistors for space applications Auteur(s): Piero Spezzigu, Gianandrea Quadri, Olivier Gilard, Laurent Bechou, Yves Ousten, Massimo Vanzi Lien HAL : https://hal.science/hal-00403233 Méthodologie d'analyse physique pour l'évaluation de la fiabilité de Diodes Electroluminescentes InGaN/GaN Auteur(s): Raphaël Baillot, Yannick Deshayes, Yves Ousten, Laurent Bechou Lien HAL : https://hal.science/hal-00402734 Thermomechanical behaviour of ceramic ball grid array based on FEM simulations and experimentations Auteur(s): Jean-Yves Delétage, Alain Fenech, Laurent Bechou, Yves Ousten, Yves Danto, Michel Salagoity, Christiane Faure, S. Rao Lien HAL : https://hal.science/hal-00385312 EURELNET (European Reliability Network) Auteur(s): Y. Ousten, Xavier Chapeleau Lien HAL : https://hal.science/hal-00334749 MEMS Reliability Challenges in EURELNET Auteur(s): Y. Ousten, Xavier Chapeleau Lien HAL : https://hal.science/hal-00334753 TEAD : Time Environment Analysis Device Auteur(s): Yves Ousten, Isabelle Bord Lien HAL : https://hal.science/hal-00305677 Analyse de quartz soumis à une forte température Auteur(s): B. Lévrier, Y. Ousten Lien HAL : https://hal.science/hal-00334751 Condensateurs enterrés dans les PCB Auteur(s): Y. Ousten, B. Lévrier Lien HAL : https://hal.science/hal-00334750 Different Approaches to Packaging Reliability Auteur(s): Yves Ousten, Laurent Bechou, Frederic Verdier, Yannick Deshayes, Bruno Levrier, Isabelle Bord, Bertrand Carbonne Lien HAL : https://hal.science/hal-00335551 Characterization and reliability of quartz resonators submitted to high temperature Auteur(s): Yves Ousten, Bruno Levrier, Grégory Andriamonje Lien HAL : https://hal.science/hal-00182900 Caractérisation des condensateurs enterrés pour des applications hyperfréquences Auteur(s): Geneviève Duchamp, Yves Ousten, Philippe Kertesz, Steven Heytens Lien HAL : https://hal.science/hal-00182904 Impedance spectroscopy on aluminium and tantalum capacitors after more than 10 years in uses at EDF Auteur(s): Gilles Guffroy, Grégory Simon, Yves Ousten, Yves Danto Lien HAL : https://hal.science/hal-00182911 Reliability Analysis of Tantalum Capacitors for High Temperature Application Auteur(s): A. Dehbi, W. Wondrak, Yves Ousten, Yves Danto Lien HAL : https://hal.science/hal-00182913 Dissipation thermique dans les dispositifs à fortes densités de puissance. Cas des TBHs sur GaAs et évaluation de deux techniques de report Auteur(s): Laurent Bechou, Yves Ousten Lien HAL : https://hal.science/hal-00182914 Analyse nondestructive par microscopie ultrasonore et laminographie X d assemblages CBGA soumis à des cyclages thermiques Auteur(s): Laurent Bechou, Dominique Navarro, Yves Ousten, Yves Danto, Christian Zardini, Jean-Louis Aucouturier, Michel Salagoity Lien HAL : https://hal.science/hal-00182916 Study of Time-Frequency methods for multilayer structures characterization Auteur(s): Dominique Dallet, Laurent Bechou, Yannick Berthoumieu, Yves Ousten Lien HAL : https://hal.science/hal-00182922 Reliability analysis of ceramic capacitors under 200C Auteur(s): Yves Ousten, Bruno Levrier, Frédéric Verdier Lien HAL : https://hal.science/hal-00182907 Improvement of ultrasonic images on Microassemblies using adapted signal processing techniques Auteur(s): Laurent Bechou, Yves Ousten, Bernard Tregon, Yves Danto, Sylvain Allano, Michel Salagoity Lien HAL : https://hal.science/hal-00182919 Eurelnet (EUropean RE Liability NETwork) Auteur(s): Yves Ousten, Jean-Yves Deletage Lien HAL : https://hal.science/hal-00182906 New industrial application in 3D interconnection Auteur(s): C. Val, O. Lignier, N. Chandler, A. Pizzato, Jean-Yves Deletage, Yves Ousten, A. Val Lien HAL : https://hal.science/hal-00182865 Applications de l acoustique picoseconde à l analyse non destructive de circuits intégrés Auteur(s): J. M. Rampnoux, Y. Ezzahri, S. Dilhaire, S. Grauby, W. Claeys, C. Rossignol, Bertrand Audoin, Grégory Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis Lien HAL : https://hal.science/hal-00182903 VIGOR European Project New industrial applications in 3D interconnection Auteur(s): A. Val, J. Delmas, O. Lignier, Y. Ousten, N. Chandler, A. Pizzato, Y. Deshayes Lien HAL : https://hal.science/hal-00162374 Caractérisation d interfaces Cu/Al2O3 par un système d analyse ultrasonore Auteur(s): Laurent Bechou, Yves Ousten, Yves Danto, Omar Rachidi, Claude Lucat Lien HAL : https://hal.science/hal-00182873 Extraction of the MLCC Matrix of Compliance Used for Reliability Auteur(s): Yves Ousten, Bruno Levrier, Jean Augereau, Laurent Bechou Lien HAL : https://hal.science/hal-00182910 The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies Auteur(s): Yves Ousten, Said Mejdi, Alain Fenech, Jean-Yves Deletage, Laurent Bechou, Marie-Genevieve Perichaud, Yves Danto Lien HAL : https://hal.science/hal-00182923 Study of Degradations in PCB Interconnections for High Frequency Applications Auteur(s): Geneviève Duchamp, Frédéric Verdier, Bruno Levrier, François Marc, Yves Ousten, Yves Danto Lien HAL : https://hal.science/hal-00181898 VIGOR European Project New industrial applications in 3D interconnection Auteur(s): A. Val, J. Delmas, O. Lignier, Yves Ousten, N. Chandler, A. Pizzato, Yannick Deshayes Lien HAL : https://hal.science/hal-00182864 Analyse de défaillances dans les condensateurs céramique par signature piézoélectrique Auteur(s): Yves Ousten, Said Mejdi, Yves Danto Lien HAL : https://hal.science/hal-00182874 Structural Analysis of Integrated Circuits Using Scanning Laser Ultrasonics Auteur(s): Grégory Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Bernard Plano, Yves Danto Lien HAL : https://hal.science/hal-00182908 Structural Analysis of Integrated Circuits Using Scanning Laser Ultrasonics Auteur(s): Grégory Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Bernard Plano, Yves Danto Lien HAL : https://hal.science/hal-00182909 Improving Reliability Evaluation of Electronic Assemblies Using Early Physical and Electrical Indicators Auteur(s): Yves Ousten, S. Ponomarenko, Laurent Bechou, Yves Danto, Said Mejdi, A. Hijazi Lien HAL : https://hal.science/hal-00182920 Report des composants CMS à l'aide d'une colle conductrice Auteur(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Yves Ousten, Hélène Fremont, Yves Danto Lien HAL : https://hal.science/hal-00182921 Ultrasonic images interpretation improvement for microassembling technologies characterization Auteur(s): Laurent Bechou, Yves Ousten, Bernard Tregon, François Marc, Yves Danto, Philippe Kertesz Lien HAL : https://hal.science/hal-00181907 Projet Européen VIGOR: Indusrialisation et dissipation thermique de modules 3D Auteur(s): A. Val, F. Golot, P. Couderc, Yves Ousten, Bruno Levrier Lien HAL : https://hal.science/hal-00182902 MLCC Type II tested by resonant sound Auteur(s): Yves Ousten, Laurent Bechou, Yves Danto Lien HAL : https://hal.science/hal-00182917 Comparison between piezoelectric method and ultrasonic signal analysis for multilayer ceramic capacitors type II crack detection Auteur(s): Yves Ousten, Laurent Bechou, Bernard Tregon, Yves Danto Lien HAL : https://hal.science/hal-00182918 Time frequency methods for multilayer structures characterization Auteur(s): Laurent Bechou, Dominique Dallet, Yannick Berthoumieu, Yves Ousten Lien HAL : https://hal.science/hal-00182872 Intra-IC Inspection and Metrology with Picosecond Laser Ultrasonics Auteur(s): Grégory Andriamonje, Vincent Pouget, Yves Ousten, Dean Lewis, Pascal Fouillat, Yves Danto Lien HAL : https://hal.science/hal-00182901 Embedded Passive Design for High Speed Circuits Auteur(s): Geneviève Duchamp, Bruno Levrier, Yves Ousten, Philippe Kertesz, Steven Heytens Lien HAL : https://hal.science/hal-00182905 Acoustic analysis of an assembly : Structural identification by signal processing (wavelets) Auteur(s): Jean Augereau, Yves Ousten, Laurent Bechou, Yves Danto Lien HAL : https://hal.science/hal-00182912 New Methods for Scanning Ultrasonic Microscopy - Applications for Failure Analysis of Microassembling Technologies Auteur(s): Laurent Bechou, Yves Ousten, Yves Danto Lien HAL : https://hal.science/hal-00182915

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