Article (6)
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Jean-Gabriel Mattei, Anna Mukhtarov, Helene Fremont Lien HAL : https://hal.science/hal-04053545v1 Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm Auteur(s): Sandrine Lhostis, Bassel Ayoub, C. Sart, Stephane Moreau, Emeline Souchier, M. G. Gusmao Cacho, Emilie Deloffre, Sebastien Mermoz, C. Rey, F. Le Roux, E. Aybeke, S. Gallois-Garreignot, Helene Fremont, A. Tournier Lien HAL : https://hal.science/hal-04619894v1 In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration Auteur(s): Bassel Ayoub, Stéphane Moreau, Sandrine Lhostis, Hélène Frémont, Sébastien Mermoz, Emeline Souchier, Emilie Deloffre, Stéphanie Escoubas, Thomas W Cornelius, Olivier Thomas Lien HAL : https://hal.science/hal-03672631v1 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stephane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Hélène Frémont Lien HAL : https://hal.science/hal-03550481v1 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): S. Moreau, Joris Jourdon, S. Lhostis, D. Bouchu, Bassel Ayoub, L. Arnaud, Helene Fremont Lien HAL : https://hal.science/hal-03626780v1 (Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stéphane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Helene Fremont Lien HAL : https://hal.science/hal-03467419v1Poster communication (2)
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Faycal Houssaini, Helene Fremont, Thomas W. Cornelius, Olivier Thomas Lien HAL : https://hal.science/hal-03962892v1 Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction Auteur(s): Bassel Ayoub, Faycal Houssaini, Stephane Moreau, Sandrine Lhostis, Thomas W. Cornelius, Olivier Thomas, Helene Fremont Lien HAL : https://hal.science/hal-03962880v1Conference proceedings (5)
Sub 1 μm pitch achievement for Cu/SiO2 hybrid bonding Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Emeline Souchier, Emilie Deloffre, Sebastien Mermoz, Maria Gabriela Gusmao Cacho, Norah Szekely, Christelle Rey, Ece Aybeke, Victor Gredy, Patrick Lamontagne, Olivier Thomas, Helene Fremont Lien HAL : https://hal.science/hal-04080577v1 Recent advances on electromigration in Cu/SiO 2 to Cu/SiO 2 hybrid bonds for 3D integrated circuits Auteur(s): S. Moreau, D. Bouchu, J. Jourdon, B. Ayoub, S. Lhostis, H. Frémont, P. Lamontagne Lien HAL : https://cea.hal.science/cea-04760292v1 RC delay mitigation for sub 700 nm hybrid bonding pitch Auteur(s): Sandrine Lhostis, Bassel Ayoub, Hélène Frémont, Stéphane Moreau, Sebastien Mermoz, Emilie Deloffre, Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke, Patrick Lamontagne, Christelle Rey, Arnaud Tournier Lien HAL : https://hal.science/hal-04762470v1 New Method to Perform TDDB Tests for Hybrid Bonding Interconnects Auteur(s): Bassel Ayoub, S. Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Helene Fremont Lien HAL : https://hal.science/hal-03781358v1 Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects Auteur(s): B. Ayoub, S. Lhostis, S. Moreau, E. Leon Perez, J. Jourdon, P. Lamontagne, E. Deloffre, S. Mermoz, C. de Buttet, V. Balan, C. Euvard, Y. Exbrayat, H. Fremont Lien HAL : https://hal.science/hal-03203851v1Invited lectures (2)
Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs Auteur(s): Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont Lien HAL : https://hal.science/hal-04166906v1 Reliability of the hybrid bonding level using submicrometric bonding pads Auteur(s): Sandrine Lhostis, Bassel Ayoub, Helene Fremont, Stephane Moreau, Jean-Gabriel Mattei, Patrick Lamontagne, Arnaud Tournier Lien HAL : https://hal.science/hal-04273117v1Send a email to Bassel AYOUB :
