Article (6)
Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Jean-Gabriel Mattei, Anna Mukhtarov, Helene Fremont Année de publication: 2025 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2023.114934 Lien HAL: https://hal.science/hal-04053545v1 Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm Auteur(s): Sandrine Lhostis, Bassel Ayoub, C. Sart, Stephane Moreau, Emeline Souchier, M. G. Gusmao Cacho, Emilie Deloffre, Sebastien Mermoz, C. Rey, F. Le Roux, E. Aybeke, S. Gallois-Garreignot, Helene Fremont, A. Tournier Année de publication: 2024 Journal: Journal of Electronic Materials DOI: 10.1007/s11664-024-11138-1 Lien HAL: https://hal.science/hal-04619894v1 In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration Auteur(s): Bassel Ayoub, Stéphane Moreau, Sandrine Lhostis, Hélène Frémont, Sébastien Mermoz, Emeline Souchier, Emilie Deloffre, Stéphanie Escoubas, Thomas W Cornelius, Olivier Thomas Année de publication: 2023 Journal: Microelectronic Engineering DOI: 10.1016/j.mee.2022.111809 Lien HAL: https://hal.science/hal-03672631v1 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stephane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Hélène Frémont Année de publication: 2022 Journal: ECS Journal of Solid State Science and Technology DOI: 10.1149/2162-8777/ac4ffe Lien HAL: https://hal.science/hal-03550481v1 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): S. Moreau, Joris Jourdon, S. Lhostis, D. Bouchu, Bassel Ayoub, L. Arnaud, Helene Fremont Année de publication: 2022 Journal: ECS Journal of Solid State Science and Technology DOI: Lien HAL: https://hal.science/hal-03626780v1 (Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stéphane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Helene Fremont Année de publication: 2021 Journal: ECS Meeting Abstracts DOI: 10.1149/MA2021-0214662mtgabs Lien HAL: https://hal.science/hal-03467419v1Conference proceedings (5)
Sub 1 μm pitch achievement for Cu/SiO2 hybrid bonding Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Emeline Souchier, Emilie Deloffre, Sebastien Mermoz, Maria Gabriela Gusmao Cacho, Norah Szekely, Christelle Rey, Ece Aybeke, Victor Gredy, Patrick Lamontagne, Olivier Thomas, Helene Fremont Année de publication: 2025 Journal: DOI: 10.1109/eptc56328.2022.10013180 Lien HAL: https://hal.science/hal-04080577v1 Recent advances on electromigration in Cu/SiO 2 to Cu/SiO 2 hybrid bonds for 3D integrated circuits Auteur(s): S. Moreau, D. Bouchu, J. Jourdon, B. Ayoub, S. Lhostis, H. Frémont, P. Lamontagne Année de publication: 2024 Journal: DOI: 10.1109/IRPS48203.2023.10118173 Lien HAL: https://cea.hal.science/cea-04760292v1 RC delay mitigation for sub 700 nm hybrid bonding pitch Auteur(s): Sandrine Lhostis, Bassel Ayoub, Hélène Frémont, Stéphane Moreau, Sebastien Mermoz, Emilie Deloffre, Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke, Patrick Lamontagne, Christelle Rey, Arnaud Tournier Année de publication: 2024 Journal: DOI: 10.1109/EPTC59621.2023.10457882 Lien HAL: https://hal.science/hal-04762470v1 New Method to Perform TDDB Tests for Hybrid Bonding Interconnects Auteur(s): Bassel Ayoub, S. Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Helene Fremont Année de publication: 2022 Journal: DOI: 10.1109/irps48227.2022.9764446 Lien HAL: https://hal.science/hal-03781358v1 Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects Auteur(s): B. Ayoub, S. Lhostis, S. Moreau, E. Leon Perez, J. Jourdon, P. Lamontagne, E. Deloffre, S. Mermoz, C. de Buttet, V. Balan, C. Euvard, Y. Exbrayat, H. Fremont Année de publication: 2021 Journal: DOI: 10.1109/EPTC50525.2020.9315028 Lien HAL: https://hal.science/hal-03203851v1Invited lectures (2)
Reliability of the hybrid bonding level using submicrometric bonding pads Auteur(s): Sandrine Lhostis, Bassel Ayoub, Helene Fremont, Stephane Moreau, Jean-Gabriel Mattei, Patrick Lamontagne, Arnaud Tournier Année de publication: 2023 Journal: DOI: 10.1016/j.microrel.2023.115189 Lien HAL: https://hal.science/hal-04273117v1 Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs Auteur(s): Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont Année de publication: 2023 Journal: DOI: Lien HAL: https://hal.science/hal-04166906v1Send a email to Bassel AYOUB :
