Article (6)
Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm Auteur(s): Sandrine Lhostis, Bassel Ayoub, C. Sart, Stephane Moreau, Emeline Souchier, M. G. Gusmao Cacho, Emilie Deloffre, Sebastien Mermoz, C. Rey, F. Le Roux, E. Aybeke, S. Gallois-Garreignot, Helene Fremont, A. Tournier Lien HAL : https://hal.science/hal-04619894v1 In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration Auteur(s): Bassel Ayoub, Stéphane Moreau, Sandrine Lhostis, Hélène Frémont, Sébastien Mermoz, Emeline Souchier, Emilie Deloffre, Stéphanie Escoubas, Thomas W Cornelius, Olivier Thomas Lien HAL : https://hal.science/hal-03672631v1 Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Jean-Gabriel Mattei, Anna Mukhtarov, Helene Fremont Lien HAL : https://hal.science/hal-04053545v1 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stephane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Hélène Frémont Lien HAL : https://hal.science/hal-03550481v1 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): S. Moreau, Joris Jourdon, S. Lhostis, D. Bouchu, Bassel Ayoub, L. Arnaud, Helene Fremont Lien HAL : https://hal.science/hal-03626780v1 (Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stéphane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Helene Fremont Lien HAL : https://hal.science/hal-03467419v1Poster communication (2)
Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Faycal Houssaini, Helene Fremont, Thomas W. Cornelius, Olivier Thomas Lien HAL : https://hal.science/hal-03962892v1 Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction Auteur(s): Bassel Ayoub, Faycal Houssaini, Stephane Moreau, Sandrine Lhostis, Thomas W. Cornelius, Olivier Thomas, Helene Fremont Lien HAL : https://hal.science/hal-03962880v1Conference proceedings (4)
Recent advances on electromigration in Cu/SiO 2 to Cu/SiO 2 hybrid bonds for 3D integrated circuits Auteur(s): S. Moreau, D. Bouchu, J. Jourdon, B. Ayoub, S. Lhostis, H. Frémont, P. Lamontagne Lien HAL : https://cea.hal.science/cea-04760292v1 RC delay mitigation for sub 700 nm hybrid bonding pitch Auteur(s): Sandrine Lhostis, Bassel Ayoub, Hélène Frémont, Stéphane Moreau, Sebastien Mermoz, Emilie Deloffre, Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke, Patrick Lamontagne, Christelle Rey, Arnaud Tournier Lien HAL : https://hal.science/hal-04762470v1 New Method to Perform TDDB Tests for Hybrid Bonding Interconnects Auteur(s): Bassel Ayoub, S. Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Helene Fremont Lien HAL : https://hal.science/hal-03781358v1 Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects Auteur(s): B. Ayoub, S. Lhostis, S. Moreau, E. Leon Perez, J. Jourdon, P. Lamontagne, E. Deloffre, S. Mermoz, C. de Buttet, V. Balan, C. Euvard, Y. Exbrayat, H. Fremont Lien HAL : https://hal.science/hal-03203851v1Invited lectures (2)
Reliability of the hybrid bonding level using submicrometric bonding pads Auteur(s): Sandrine Lhostis, Bassel Ayoub, Helene Fremont, Stephane Moreau, Jean-Gabriel Mattei, Patrick Lamontagne, Arnaud Tournier Lien HAL : https://hal.science/hal-04273117v1 Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs Auteur(s): Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont Lien HAL : https://hal.science/hal-04166906v1Send a email to Bassel AYOUB :
