The main activities carried out within the ASSEMBLY platform are
The INP and the University of Bordeaux involved in national and international programs of fundamental and applied research, concerned with technological stages.
This research concerns the design and manufacture of components which are then assembled and tested under real conditions or in severe environments.
Realization of wired bonding, transfer of ridged or QFN components, clean room rental
In the Electronics field from Bachelor’s level to Doctoral level and internships offered to IMS doctoral students or to European doctoral students as part of the Euro-dots-CNFM programme. These courses provide training on the technological tools used for the implementation of microassemblies.
