Article (11)
Methodology for data retrieval of MRAM: Technological analysis, sample preparation and internal electrical measurements Auteur(s): Louise Dumas, Christina Villeneuve-Faure, Francois Marc, Helene Fremont, Guillaume Bascoul, Christophe Guerin Année de publication: 2025 Journal: Microelectronic Engineering DOI: 10.1016/j.mee.2025.112351 Lien HAL: https://hal.science/hal-05256347v1 Investigation into Cu diffusion at the Cu/SiO2 hybrid bonding interface of 3D stacked integrated circuits Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Jean-Gabriel Mattei, Anna Mukhtarov, Helene Fremont Année de publication: 2025 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2023.114934 Lien HAL: https://hal.science/hal-04053545v1 Source Separation Using Sensor’s Frequency Response: Theory and Practice on Carbon Nanotubes Sensors Auteur(s): Aurore Quelennec, Éric Duchesne, Hélène Fremont, Dominique A Drouin Année de publication: 2025 Journal: Sensors DOI: 10.3390/s19153389 Lien HAL: https://hal.science/hal-02453566v1 Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 nm Auteur(s): Sandrine Lhostis, Bassel Ayoub, C. Sart, Stephane Moreau, Emeline Souchier, M. G. Gusmao Cacho, Emilie Deloffre, Sebastien Mermoz, C. Rey, F. Le Roux, E. Aybeke, S. Gallois-Garreignot, Helene Fremont, A. Tournier Année de publication: 2024 Journal: Journal of Electronic Materials DOI: 10.1007/s11664-024-11138-1 Lien HAL: https://hal.science/hal-04619894v1 Search for copper diffusion at hybrid bonding interface through chemical and electrical characterizations Auteur(s): Joris Jourdon, Sandrine Lhostis, Stéphane Moreau, Patrick Lamontagne, Hélène Frémont Année de publication: 2024 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2021.114217 Lien HAL: https://hal.science/hal-03375909v1 In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration Auteur(s): Bassel Ayoub, Stéphane Moreau, Sandrine Lhostis, Hélène Frémont, Sébastien Mermoz, Emeline Souchier, Emilie Deloffre, Stéphanie Escoubas, Thomas W Cornelius, Olivier Thomas Année de publication: 2023 Journal: Microelectronic Engineering DOI: 10.1016/j.mee.2022.111809 Lien HAL: https://hal.science/hal-03672631v1 Moisture Diffusion Inside the BEOL of an FC-PBGA Package Auteur(s): Quentin Vandier, Helene Fremont, Dominique Drouin Année de publication: 2023 Journal: IEEE Transactions on Components, Packaging and Manufacturing Technology DOI: 10.1109/tcpmt.2022.3226139 Lien HAL: https://hal.science/hal-03885127v1 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stephane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Hélène Frémont Année de publication: 2022 Journal: ECS Journal of Solid State Science and Technology DOI: 10.1149/2162-8777/ac4ffe Lien HAL: https://hal.science/hal-03550481v1 Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): S. Moreau, Joris Jourdon, S. Lhostis, D. Bouchu, Bassel Ayoub, L. Arnaud, Helene Fremont Année de publication: 2022 Journal: ECS Journal of Solid State Science and Technology DOI: Lien HAL: https://hal.science/hal-03626780v1 Moisture diffusion in plasma-enhanced chemical vapor deposition dielectrics characterized with three techniques under clean room conditions Auteur(s): Vivien Cartailler, Grégory Imbert, Névine Rochat, Catherine Chaton, Du Vo-Thanh, Daniel Benoit, Geneviève Duchamp, Hélène Frémont Année de publication: 2022 Journal: Thin Solid Films DOI: 10.1016/j.tsf.2020.137874 Lien HAL: https://hal.science/hal-03489597v1 (Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements Auteur(s): Stéphane Moreau, Joris Jourdon, Sandrine Lhostis, David Bouchu, Bassel Ayoub, Lucile Arnaud, Helene Fremont Année de publication: 2021 Journal: ECS Meeting Abstracts DOI: 10.1149/MA2021-0214662mtgabs Lien HAL: https://hal.science/hal-03467419v1Conference proceedings (16)
Comparative study of lead-free alloys submitted to thermomechanical ageing Auteur(s): Houda Friaa, Alexandrine Gracia, Helene Fremont, Laure Rocheron, Raphael Riva Année de publication: 2025 Journal: DOI: 10.1109/EuroSimE60745.2024.10491424 Lien HAL: https://hal.science/hal-05100833v1 Investigation of different thermomechanical behaviours in one batch of QFN packages Auteur(s): Ariane Tomas, Helene Fremont, Nathalie Malbert, Nathalie Labat, Benoit Lambert, Bernard Plano Année de publication: 2025 Journal: DOI: 10.1109/eurosime60745.2024.10491484 Lien HAL: https://hal.science/hal-04976119v1 Sub 1 μm pitch achievement for Cu/SiO2 hybrid bonding Auteur(s): Bassel Ayoub, Sandrine Lhostis, Stephane Moreau, Emeline Souchier, Emilie Deloffre, Sebastien Mermoz, Maria Gabriela Gusmao Cacho, Norah Szekely, Christelle Rey, Ece Aybeke, Victor Gredy, Patrick Lamontagne, Olivier Thomas, Helene Fremont Année de publication: 2025 Journal: DOI: 10.1109/eptc56328.2022.10013180 Lien HAL: https://hal.science/hal-04080577v1 Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules Auteur(s): Ariane Tomas, Loic Théolier, Alexandrine Guédon-Gracia, Hélène Frémont, Pierre-Yves Pichon Année de publication: 2025 Journal: DOI: Lien HAL: https://hal.science/hal-05323088v1 Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid Auteur(s): Arsène Guédon, Nizar Bouguerra, Etienne Paradis, Eric Duchesne, Stephanie Allard, Hélène Frémont, Dominique Drouin Année de publication: 2024 Journal: DOI: 10.1109/ECTC51529.2024.00245 Lien HAL: https://hal.science/hal-04654838v1 RC delay mitigation for sub 700 nm hybrid bonding pitch Auteur(s): Sandrine Lhostis, Bassel Ayoub, Hélène Frémont, Stéphane Moreau, Sebastien Mermoz, Emilie Deloffre, Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke, Patrick Lamontagne, Christelle Rey, Arnaud Tournier Année de publication: 2024 Journal: DOI: 10.1109/EPTC59621.2023.10457882 Lien HAL: https://hal.science/hal-04762470v1 To avoid dropout: let student teach! Second act Auteur(s): Hélène Frémont, Florent Arnal Année de publication: 2022 Journal: DOI: 10.1109/EAEEIE54893.2022.9820322 Lien HAL: https://hal.science/hal-03736322v1 New Method to Perform TDDB Tests for Hybrid Bonding Interconnects Auteur(s): Bassel Ayoub, S. Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Helene Fremont Année de publication: 2022 Journal: DOI: 10.1109/irps48227.2022.9764446 Lien HAL: https://hal.science/hal-03781358v1 2D Model for moisture diffusion in integrated Low-k dielectrics Auteur(s): Leo Mischler, Vivien Cartailler, Genevieve Duchamp, Helene Fremont, Gregory Imbert, J. Moulard, Olivier Kermarrec Année de publication: 2022 Journal: DOI: 10.1109/EuroSimE54907.2022.9758882 Lien HAL: https://hal.science/hal-03666398v1 Evaluation of SAC solder joint thermomechanical fatigue in different types of components Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Année de publication: 2022 Journal: DOI: 10.1109/EuroSimE54907.2022.9758868 Lien HAL: https://hal.science/hal-03665823v1 Dynamics of the corrosion for SAC305 solder alloy in salt environment Auteur(s): K. Akoda, A. Guedon-Gracia, Éric Lebraud, J.-Y. Deletage, B. Plano, H. Fremont Année de publication: 2022 Journal: DOI: 10.1109/EuroSimE54907.2022.9758896 Lien HAL: https://hal.science/hal-03665831v1 QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms Auteur(s): E. Ben Romdhane, P. Roumanille, Alexandrine Guedon-Gracia, S. Pin, P. Nguyen, Helene Fremont Année de publication: 2022 Journal: DOI: 10.1109/ectc51906.2022.00120 Lien HAL: https://hal.science/hal-03781126v1 Epoxy Mold Compound Characterization for Modeling Packaging Reliability Auteur(s): Ariane Tomas, Benoit Lambert, Helene Fremont, Nathalie Malbert, Nathalie Labat Année de publication: 2022 Journal: DOI: 10.1109/EuroSimE54907.2022.9758842 Lien HAL: https://hal.science/hal-03666406v1 Reliability of fan-out wafer level packaging For III-V RF power MMICs Auteur(s): Ariane Tomas, Laurent Marechal, Rodrigo Almeida, Mehdy Neffati, Nathalie Malbert, Helene Fremont, Nathalie Labat, Arnaud Garnier Année de publication: 2021 Journal: DOI: 10.1109/ECTC32696.2021.00281 Lien HAL: https://hal.science/hal-03336953v1 Impact of Process Variations on the Capacitance and Electrical Resistance down to $1.44\ \mu\mathrm{m}$ Hybrid Bonding Interconnects Auteur(s): B. Ayoub, S. Lhostis, S. Moreau, E. Leon Perez, J. Jourdon, P. Lamontagne, E. Deloffre, S. Mermoz, C. de Buttet, V. Balan, C. Euvard, Y. Exbrayat, H. Fremont Année de publication: 2021 Journal: DOI: 10.1109/EPTC50525.2020.9315028 Lien HAL: https://hal.science/hal-03203851v1 Early microstructural indicators of crack initiation in lead-free solder joints under thermal cycling Auteur(s): E. Ben Romdhane, P. Roumanille, A. Guedon-Gracia, S. Pin, P. Nguyen, H. Fremont Année de publication: 2021 Journal: DOI: 10.1109/ECTC32696.2021.00359 Lien HAL: https://hal.science/hal-03336972v1Invited lectures (8)
Towards measurements of global coefficient of thermal expansion of QFN Auteur(s): Vincent Sisomseun, Olivier Maire, Pascal Retailleau, Catherine Jephos, Helene Fremont, Alexandrine Guedon-Gracia Année de publication: 2025 Journal: DOI: 10.1109/eurosime60745.2024.10491477 Lien HAL: https://hal.science/hal-04965121v1 Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test Auteur(s): Komlan Elom Akoda, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Bernard Plano, Helene Fremont Année de publication: 2025 Journal: DOI: 10.1016/j.microrel.2023.115194 Lien HAL: https://hal.science/hal-04273292v1 Recent Advances on Qualification and Reliability of Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D ICs Auteur(s): Stephane Moreau, Bassel Ayoub, Sandrine Lhostis, David Bouchu, Helene Fremont Année de publication: 2023 Journal: DOI: Lien HAL: https://hal.science/hal-04166906v1 Using X-ray imaging for the study of crack development in solder reliability testing Auteur(s): Pierre Roumanille, Julien Lesseur, Julien Uzanu, Hoa Le Trong, Emna Ben Romdhane, Alexandrine Guedon-Gracia, Helene Fremont Année de publication: 2023 Journal: DOI: 10.1016/j.microrel.2023.115079 Lien HAL: https://hal.science/hal-04273250v1 Investigating the degradation mechanisms of moisture on the reliability of integrated low-k stack Auteur(s): Leo Mischler, Vivien Cartailler, Gregory Imbert, Genevieve Duchamp, Helene Fremont Année de publication: 2023 Journal: DOI: 10.1016/j.microrel.2023.115087 Lien HAL: https://hal.science/hal-04273097v1 Moisture absorption and desorption in epoxy mould compounds: Characterization of Fickian and non-Fickian behaviours in complex packages Auteur(s): Ariane Tomas, Helene Fremont, Nathalie Malbert, Mehdy Neffati, Benoit Lambert Année de publication: 2023 Journal: DOI: 10.1016/j.microrel.2023.115088 Lien HAL: https://hal.science/hal-04273061v1 Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe Auteur(s): Louise Dumas, Christina Villeneuve-Faure, Francois Marc, Helene Fremont, Christophe Guerin, Guillaume Bascoul Année de publication: 2023 Journal: DOI: 10.1016/j.microrel.2023.115102 Lien HAL: https://hal.science/hal-04273084v1 Reliability of the hybrid bonding level using submicrometric bonding pads Auteur(s): Sandrine Lhostis, Bassel Ayoub, Helene Fremont, Stephane Moreau, Jean-Gabriel Mattei, Patrick Lamontagne, Arnaud Tournier Année de publication: 2023 Journal: DOI: 10.1016/j.microrel.2023.115189 Lien HAL: https://hal.science/hal-04273117v1Send a email to Hélène FREMONT :
