FREMONT Hélène | IMS Bordeaux

Presentation

Publication

Contact

Article (38)

Evaluation of Hybrid Bonding Interface Quality by Contact Resistivity Measurement Author(s): Joris Jourdon, Sandrine Lhostis, Stéphane Moreau, Nicolas Bresson, Pascal Salomé, Hélène Fremont Year of publication: 2019 Journal: IEEE Transactions on Electron Devices DOI: 10.1109/TED.2019.2910528 HAL link: https://hal.science/hal-02118046v1

Source Separation Using Sensor’s Frequency Response: Theory and Practice on Carbon Nanotubes Sensors Author(s): Aurore Quelennec, Éric Duchesne, Hélène Fremont, Dominique A Drouin Year of publication: 2019 Journal: Sensors DOI: 10.3390/s19153389 HAL link: https://hal.science/hal-02453566v1

Sequential combined thermal cycling and vibration test and simulation of printed circuit board Author(s): Faical Arabi, Alexandrine Gracia, Hélène Fremont, Jean-Yves Delétage Year of publication: 2018 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-02516781v1

Creep measurement and choice of creep laws for BGA assemblies' reliability simulation Author(s): Samuel Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Fremont Year of publication: 2018 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-02516790v1

Proceedings of the 28th European Symposium on the reliability of electron devices, failure physics and analysis Author(s): Nathalie Labat, François Marc, Helene Frémont, Marise Bafleur Year of publication: 2017 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2017.08.002 HAL link: https://hal.science/hal-01660958v1

Editorial, Microelectronics Reliability, Volume 55, Issues 9–10, August–September 2015 Author(s): Marise Bafleur, Philippe Perdu, François Marc, Hélène Frémont, Nicolas Nolhier Year of publication: 2015 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2015.09.028 HAL link: https://hal.science/hal-01257965v1

A methodologic project to characterize and model COTS component reliability Author(s): André Durier, Alain Bensoussan, Moustafa Zerarka, Chaimae Ghfiri, Alexandre Boyer, Hélène Frémont Year of publication: 2015 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2015.06.140 HAL link: https://hal.science/hal-01582570v1

Characterization and model of temperature effect on the conducted immunity of Op. Amp Author(s): Tristan Dubois, Siham Hairoud, Marcio Gomes de Oliveira, Helene Frémont, Genevieve Duchamp Year of publication: 2015 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-01180983v1

Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications Author(s): M. Mickaël Pocheron,, J.-Y. Delétage, B. Plano, Alexandrine Gracia-Guedon, Hélène Fremont Year of publication: 2015 Journal: IEEE Transactions on Device and Materials Reliability DOI: HAL link: https://hal.science/hal-01257918v1

Dynamical IMC-growth calculation. Author(s): L. Meinshausen, K. Weide-Zaage, Hélène Frémont Year of publication: 2015 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-01257907v1

Virtual prototyping in a Design-for-Reliability approach Author(s): S. Barnat, A. Guédon-Gracia, Hélène Frémont Year of publication: 2015 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-01257900v1

Electro- and thermomigration induced Cu3Sn and Cu6Sn5 formation in SnAg3.0Cu0.5 bumps Author(s): L. Meinshausen, Hélène Frémont, Kirsten Weide-Zaage Year of publication: 2014 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-01257984v1

Qualification procedure for moisture in embedded capacitors Author(s): Hélène Frémont, Jörg Kludt, Massar Wade, Geneviève Duchamp, Kirsten Weide-Zaage, Isabelle Bord-Majek Year of publication: 2014 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2014.07.117 HAL link: https://hal.science/hal-01091487v1

Evaluation by three-point-bend and ball-on-ring tests of thinning process on silicon die strength Author(s): S. Barnat, Hélène Fremont, Alexandrine Guedon-Gracia, Eric Cadalen Year of publication: 2012 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00745982v1

Pushing toward the limits of acceleration: Example on wire-bond assemblies Author(s): Jean-Baptiste Jullien, Bernard Plano, Hélène Fremont Year of publication: 2012 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00745987v1

Electro- and Thermomigration induced Failure Mechanisms in Package on Package Author(s): Hélène Fremont, Lutz Meinshausen, Kirsten Weide-Zaage Year of publication: 2012 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00788562v1

Methodological approach for predictive reliability: practical case studies Author(s): Hélène Fremont, Geneviève Duchamp, Alexandrine Guedon-Gracia, Frédéric Verdier Year of publication: 2012 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00788556v1

Migration induced IMC formation in SAC305 solder joints on cu, NiAu and NiP metal layers Author(s): Lutz Meinshausen, Hélène Fremont, Kisten Weide-Zaage Year of publication: 2012 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00745990v1

ELLEIEC Project: A contribution to harmonise the European Higher Education Area Author(s): Hamed Yahoui, Olivier Bonnaud, Hélène Fremont, Anna Friesel, Samuel Nowakowski, Cristian Perra, Tony Ward Year of publication: 2011 Journal: Journal sur l'enseignement des sciences et technologies de l'information et des systèmes DOI: 10.1051/j3ea/2011011 HAL link: https://hal.science/hal-01991395v1

Migration induced material transport in Cu-Sn IMC and SnAgCu microbumps Author(s): Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Fremont Year of publication: 2011 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2011.06.032 HAL link: https://hal.science/hal-00671262v1

Toward an International Curricula Network for exchanges and LifeLong Learning Author(s): Jean-Marc Thiriet, Fabrice Null Mériaudeau, Juan Carlos Burguillo, Hélène Fremont, Hamed Yahoui, Pierre de Fooz Year of publication: 2010 Journal: Elektronika ir elektrotechnika - Electronics and Electrical Engineering DOI: HAL link: https://hal.science/hal-00547953v1

Analysis of 2 aging types for SAC solder joint: accelerated thermal cycling (ATC) and thermal storage Author(s): Berthou Matthieu, Pascal Retailleau, Hélène Frémont, Alexandrine Guédon-Gracia, Catherine Jéphos-Davennel Year of publication: 2009 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00415091v1

Microstructure evolution observation for SAC solder joint: Comparison between thermal cycling and thermal storage Author(s): M. Berthou, P. Retailleau, Hélène Frémont, A. Guédon-Gracia, C. Jéphos-Davennel Year of publication: 2009 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00477613v1

Sequential environmental stresses tests qualification for automotive components Author(s): M.A. Bahi, P. Lécuyer, J.P. Landesman, Hélène Frémont Year of publication: 2007 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00179915v1

Dynamic void formation in a DD-copper-structure with different metallization geometry Author(s): Kisten Weide-Zaage, David Dalleau, Yves Danto, Hélène Frémont Year of publication: 2007 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00160207v1

Torsion test applied for reballing and solder paste volume evaluation Author(s): W.C. Maia Filho, Hélène Frémont, M. Brizoux, Y. Danto Year of publication: 2007 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00179911v1

Improved physical understanding of intermittent failure in continuous monitoring method Author(s): Wilsoncarlos Maia-Filho, Michel Brizoux, Hélène Fremont, Yves Danto Year of publication: 2006 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00160203v1

Moisture diffusion in Printed Circuit Boards : Measurements and Finite- Element- Simulations Author(s): Kirsten Weide-Zaage, Walter Horaud, Hélène Fremont Year of publication: 2005 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00183957v1

How to study delamination in plastic encapsulated devices Author(s): Hélène Fremont, Jean-Yves Deletage, Kirsten Weide-Zaage, Yves Danto Year of publication: 2004 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00183958v1

Evaluation of the moisture sensitivity of molding compounds of IC's Packages. Author(s): Hélène Fremont, Jean-Yves Deletage, Alberto Pintus, Yves Danto Year of publication: 2001 Journal: ASME journal of electronic packaging DOI: HAL link: https://hal.science/hal-00183959v1

Reliability Evaluation of Adhesive bonded SMT Components in Industrial Applications Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto Year of publication: 2000 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00183960v1

Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system Author(s): Claude Pellet, Marc Lecouve, Hélène Fremont, A. Val Year of publication: 1998 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00183118v1

Applications of a theoretical model for Linewidth Control in photoresists sensitised by a laser beam Author(s): Emmanuel Saint-Christophe, Hélène Fremont, Gilles N'Kaoua, Yves Danto Year of publication: 1997 Journal: Electronics Letters DOI: HAL link: https://hal.science/hal-00183961v1

Evaluation of stresses in packaged Ics by in situ measurements with an assembly test chip and simulation Author(s): Christine Ducos, Emmanuel Saint-Christophe, Hélène Fremont, Gilles N'Kaoua, Claude Pellet, Yves Danto Year of publication: 1997 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00183120v1

Photoresist development Model for Linewidth Control in the fabrication of MCM and Customised ASICs Author(s): Emmanuel Saint-Christophe, Hélène Fremont, Mohammed Fathi, Yves Danto Year of publication: 1996 Journal: Journal de Physique III France DOI: HAL link: https://hal.science/hal-00183962v1

A general methodology using an electron beam tester applied to failure localization inside a logic integrated circuit Author(s): François Marc, Hélène Fremont, Paul Jounet, M. Barre, Yves Danto Year of publication: 1995 Journal: Microelectronic Engineering DOI: HAL link: https://hal.science/hal-00181885v1

Quick and exhaustive descrambling methodology for high density static random access memories using voltage contrast Author(s): François Marc, Hélène Fremont, Paul Jounet, Yves Danto Year of publication: 1994 Journal: Microelectronic Engineering DOI: HAL link: https://hal.science/hal-00181886v1

Functionnal localization in integrated circuits by Signal Selective Voltage Contrast in a scanning electron microscope Author(s): François Marc, Hélène Frémont, Paul Jounet, Yves Danto, Michel Barré Year of publication: 1994 Journal: Microelectronics Reliability DOI: HAL link: https://hal.science/hal-00326620v1

Special issue (2)

Proceedings of the 32nd European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis Author(s): Nathalie Labat, François Marc, Hélène Frémont, Nicolas Nolhier Year of publication: 2021 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2021.114403 HAL link: https://hal.science/hal-03408633v1

Proceedings of the 30th European Symposium on the reliability of electron devices, failure physics and analysis Author(s): Nicolas Nolhier, Nathalie Labat, Hélène Frémont, François Marc, Fabrice Caignet, Guillaume Bascoul Year of publication: 2019 Journal: Microelectronics Reliability DOI: 10.1016/j.microrel.2019.113498 HAL link: https://hal.science/hal-02884107v1

Book (1)

Microelectronics Reliability Volume 55, Issues 9–10 Author(s): Philippe Perdu, François Marc, Marise Bafleur, Hélène Fremont, Nicolas Nolhier Year of publication: 2015 Journal: DOI: HAL link: https://hal.science/hal-01257945v1

Patents (1)

Carbon nanotube-based multi-sensor Author(s): Eric Duchesne, Dominique Drouin, Hélène Frémont, Simon Landry, Aurore Quelennec, Umar Shafique, Patrick Rj Wilson Year of publication: 2020 Journal: DOI: HAL link: https://hal.science/hal-03683650v1

Other publication (2)

The alignment of generic, specific and language skills within the Electrical and Information Engineering discipline Author(s): Anthony- E. Ward, Jean-Marc Thiriet, Hélène Frémont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00399598v1

The Overview of the Bologna Process Implementation in Europe in Electrical and Information Engineering (Bachelor, Master, Doctoral studies) Author(s): Maria- J .Martins, Jean-Marc Thiriet, Hélène Frémont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00399599v1

Conference proceedings (93)

Characterization of the bulk moisture diffusion in epoxy-based potting compounds for IGBT semiconductor power modules Author(s): Ariane Tomas, Loic Théolier, Alexandrine Guédon-Gracia, Hélène Frémont, Pierre-Yves Pichon Year of publication: 2025 Journal: DOI: HAL link: https://hal.science/hal-05323088v1

Heat dissipation measurement in flip-chip package using microfabricated temperature sensors on lid Author(s): Arsène Guédon, Nizar Bouguerra, Etienne Paradis, Eric Duchesne, Stephanie Allard, Hélène Frémont, Dominique Drouin Year of publication: 2024 Journal: DOI: 10.1109/ECTC51529.2024.00245 HAL link: https://hal.science/hal-04654838v1

To avoid dropout: let student teach! Second act Author(s): Hélène Frémont, Florent Arnal Year of publication: 2022 Journal: DOI: 10.1109/EAEEIE54893.2022.9820322 HAL link: https://hal.science/hal-03736322v1

Readout Circuit Implemented on PCB-Level for Embedded CNT Sensors Author(s): Quentin Vandier, Julien Pezard, Hélène Fremont, Eric Duchesne, Dominique Drouin Year of publication: 2020 Journal: DOI: 10.1109/I2MTC43012.2020.9128884 HAL link: https://hal.science/hal-02895351v1

Integration of carbon nanotube-based sensors to a flip-chip package for micro-strain detection in microelectronic package Author(s): Julien Pezard, Yosri Ayadi, A Elshaer, E Duchesne, Hélène Frémont, Dominique Drouin Year of publication: 2019 Journal: DOI: HAL link: https://hal.science/hal-02453585v1

Electromigration Effects in Corroded BGA Author(s): Kirsten Weide-Zaage, Alexandrine Guedon-Gracia, Hélène Fremont Year of publication: 2019 Journal: DOI: HAL link: https://hal.science/hal-02516854v1

Vibration test and simulation of printed circuit board Author(s): Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Fremont Year of publication: 2018 Journal: DOI: HAL link: https://hal.science/hal-02516844v1

“New automotive” — Considerations for reliability, robustness and resilience for CMOS interconnects Author(s): Kirsten Weide-Zaage, Hélène Fremont, Verena Hein Year of publication: 2018 Journal: DOI: HAL link: https://hal.science/hal-02118006v1

Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints Author(s): Samuel Pin, Alexandrine Guedon-Gracia, Jean-Yves Delétage, Julie Fouquet, Hélène Fremont Year of publication: 2018 Journal: DOI: HAL link: https://hal.science/hal-02516819v1

Smart Packaging - Microscopic Temperature and Moisture Sensors Embedded in a Flip-Chip Package Author(s): Aurore Quelennec, Yosri Ayadi, Quentin Vandier, Eric Duchesne, Hélène Fremont, Dominique A Drouin Year of publication: 2018 Journal: DOI: 10.1109/ECTC.2018.00247 HAL link: https://hal.science/hal-02074111v1

Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package Author(s): Aurore Quelennec, Umar Shafique, Eric Duchesne, Hélène Fremont, Dominique A Drouin Year of publication: 2017 Journal: DOI: 10.1109/ECTC.2017.140 HAL link: https://hal.science/hal-02074222v1

Smart Packaging: A Micro-Sensor Array Integrated to a Flip-Chip Package to Investigate the Effect of Humidity in Microelectronics Package Author(s): Aurore Quelennec, Umar Shafique, Éric Duchesne, Hélène Frémont, Dominique Drouin Year of publication: 2017 Journal: DOI: HAL link: https://hal.science/hal-01660889v1

Lead free solder joints characterisation using single lap shear tests Author(s): Samuel Pin, Hélène Frémont, Alexandrine Guedon-Gracia Year of publication: 2017 Journal: DOI: HAL link: https://hal.science/hal-01660937v1

Numerical study of thermomechanical fatigue influence of intermetallic compounds in a lead free solder joint Author(s): Samuel Pin, Hélène Frémont, Alexandra Gracia Year of publication: 2016 Journal: DOI: 10.1109/ESTC.2016.7764674 HAL link: https://hal.science/hal-01688091v1

Measurement and simulation of electromagnetic drift for obsolescence management in electronics Author(s): Geneviève Duchamp, Tristan Dubois, Ala Ayed, Christian Marot, Hélène Fremont Year of publication: 2015 Journal: DOI: HAL link: https://hal.science/hal-01180999v1

La carte à puce : du sable au silicium Author(s): Hélène Frémont Year of publication: 2015 Journal: DOI: HAL link: https://hal.science/hal-02517402v1

Measurement and Simulation of Electromagnetic Drift for Obsolescence Management in Electronics Author(s): Geneviève Duchamp, Tristan Dubois, Ala Ayed, Christian Marot, Hélène Fremont Year of publication: 2015 Journal: DOI: HAL link: https://hal.science/hal-01153333v1

Simulations and Measurements to Predict EMC Characteristics in Electronic Assemblies: Obsolescence Management Author(s): Geneviève Duchamp, Tristan Dubois, Hélène Frémont Year of publication: 2015 Journal: DOI: HAL link: https://hal.science/hal-01153323v1

Barriers for young pupils with disabilities to access Higher Education. Breakpoints identified and levers to solve it Author(s): François Demontoux, Véronique Lespinet-Najib, Hélène Null Fremont, E. Woigard, C. Ponce, A. Grandpré Year of publication: 2014 Journal: DOI: HAL link: https://hal.science/hal-00984601v1

Investigation of Chip-Package Interaction in 3D Integration Author(s): K. Weide-Zaage, Hélène Fremont, J. Kludt, Angélique Tételin Year of publication: 2014 Journal: DOI: HAL link: https://hal.science/hal-00931476v1

AccessLab: A study of the accessibility of numeric documents in higher education courses. A lever against the digital divide for students with disabilities Author(s): Véronique Lespinet-Najib, François Demontoux, Nathalie Pinède, C. Belio, Vincent Liquète, Hélène Null Fremont Year of publication: 2014 Journal: DOI: HAL link: https://hal.science/hal-00984594v1

Influence of contact geometry variations on the lifetime distribution of IC packages during electromigration testing Author(s): L. Meinshausen, K. Weide-Zaage, Hélène Fremont Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-00853811v1

Criteria of the EIE courses accessible to disabled students. Legibility of cursus and experiences sharing for generalizing good practices Author(s): François Demontoux, Hélène Fremont, Eric Woirgard Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-00853821v1

Amélioration de la lisibilité des formations de l'EEA accessibles aux étudiants en situation de handicap - Vers une mutualisation des expériences et une généralisation des bonnes pratiques Author(s): François Demontoux, Hélène Fremont, Eric Woirgard Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-00873510v1

On the way of harmonization of PhD in Europe in Electrical and Information Engineering: status and recommendations Author(s): Olivier Bonnaud, Hélène Fremont, Jean-Marc Thiriet Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00676189v1

PhD in Electrical and Information Engineering in Europe: Towards a harmonization including LifeLong Learning Author(s): Olivier Bonnaud, Helene Frémont, Jean-Marc Thiriet, Hamed Yahoui Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00746003v1

Stage de microassemblage Pôle CNFM de Bordeaux / IMS Bordeaux : réalisation de circuits hybrides et capteurs Author(s): Hélène Debéda, Corinne Dejous, Hélène Frémont, Alexandrine Gracia, Isabelle Favre, Jean-Luc Lachaud, Bernard Plano, Jean Tomas Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00744834v1

International dimension to increase Lifelong Learning possibilities in Europe Author(s): Jean-Marc Thiriet, Hamed Yahoui, Hélène Fremont Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00719906v1

Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards Author(s): Hassene Fridhi, Geneviève Duchamp, Valerie Vigneras, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Hélène Fremont, Tristan Dubois Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00709116v1

International dimension to increase Lifelong Learning possibilities in Europe Author(s): Jean-Marc Thiriet, Hamed Yahoui, Olivier Bonnaud, A. Friesel, Hélène Fremont, Maria João Martins Year of publication: 2012 Journal: DOI: HAL link: https://hal.science/hal-00773156v1

Evaluation des solutions de packaging quasi-hermétique sur composants actifs hyperfréquences Author(s): Walim Ben Naceur, Nathalie Malbert, Nathalie Labat, Hélène Fremont, Jean-Luc Muraro, Philippe Monfraix Year of publication: 2011 Journal: DOI: HAL link: https://hal.science/hal-00585624v1

Set-in LifeLong Learning for PhD students in Electrical and Information Engineering Author(s): Olivier Bonnaud, Jean-Marc Thiriet, Hélène Frémont Year of publication: 2011 Journal: DOI: HAL link: https://hal.science/hal-00617944v1

Obtenir un doctorat en EEA par la voie de la formation continue en Europe : les pistes Author(s): Olivier Bonnaud, Hélène Fremont, Jean-Marc Thiriet, Hamed Yahoui Year of publication: 2011 Journal: DOI: HAL link: https://hal.science/hal-00658623v1

Prediction of Electromigration Induced Void Formation in TSV and SAC Contacts Author(s): Kirsten Weide-Zaage, Lutz Meinshausen, Hélène Fremont Year of publication: 2011 Journal: DOI: HAL link: https://hal.science/hal-00639192v1

ELLEIEC implementation issues in EIE: State of advancement Author(s): Jean-Marc Thiriet, Hamed Yahoui, Olivier Bonnaud, A. Friesel, Hélène Frémont Year of publication: 2011 Journal: DOI: HAL link: https://hal.science/hal-00617945v1

Mise en place d'une pédagogie d'apprentissage par problèmes au département GEII de l'IUT Bordeaux Author(s): Hélène Fremont, S. Moutault, I. Bord, B. Caillard, Francois Demontoux, Stéphane Grauby, P. Sentenac, M. Tarisien Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00467949v1

Die Attach Interface Property Characterization as Function of Temperature Using Cohesive Zone Modeling Method Author(s): Xiaosong Ma, G.Q. Zhang, Olaf van Der Sluis, Kaspar M.B. Jansen, Willem D van Driel, Leo J. Ernst, Charles Regard, Christian Gautier, Hélène Frémont Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00477599v1

Nouvelle préparation d'échantillon pour l'analyse de défaillance de technologie Cu/low-k encapsulée en boitier plastique Author(s): A. Aubert, L. Dantas de Morais, J.P. Rebrassé, Hélène Null Fremont, Nathalie Labat Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00585609v1

Virtual prototyping of PoP interconnections regarding electrically activated mechanisms Author(s): Lutz Meinshausen, Kirsten Weide-Zaage, Hélène Frémont, Wei Feng Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00477596v1

Influence of PCB design and materials on chip solder joint reliability Author(s): Matthieu Berthou, Hélène Frémont, Alexandrine Gracia, Catherine Jéphos-Davennel Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00477591v1

Field return on a Chinese-French double graduation of an International Master in Electronics and Telecommunications on the Base of the Bologna Process Author(s): Olivier Bonnaud, Lotfi Senhadji, Hélène Fremont, Lei Wei, Huazhong Shu, Limin Luo Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00506972v1

Field return on a Chinese-French double graduation of an International Master in Microelectronics on the Base of the Bologna Process Author(s): Olivier Bonnaud, Lotfi Senhadji, Lei Wei, Limin Luo, Hélène Frémont, Huazhong Shu Year of publication: 2010 Journal: DOI: 10.1109/ITHET.2010.5480087 HAL link: https://hal.science/hal-00479107v1

ELLEIEC Enhancing Lifelong Learning for the Electrical and Information Engineering Community Author(s): Hamed Yahoui, Olivier Bonnaud, Cyril Burkley, Hélène Frémont, Michael Hoffmann, Maria Joao Martins, Christian Perra, Jean-Marc Thiriet, Anthony E. Ward Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00467961v1

Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via Author(s): Samed Barnat, Hélène Frémont, Alexandrine Gracia, Eric Cadalen, Catherine Bunel, François Neuilly, Jean-René Tenailleau Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00477594v1

Electrically driven matter transport effects in PoP interconnections Author(s): W. Feng, K. Weide-Zaage, F. Verdier, B. Plano, A. Guédon-Gracia, Hélène Frémont Year of publication: 2009 Journal: DOI: HAL link: https://hal.science/hal-00385360v1

Moisture induced effects in PoP Author(s): A. Guédon-Gracia, W. Feng, J.-Y. Delétage, F. Verdier, Hélène Frémont Year of publication: 2009 Journal: DOI: HAL link: https://hal.science/hal-00385358v1

Results and dissemination of the EIE-Surveyor thematic network Author(s): Jean-Marc Thiriet, Anthony E. Ward, Maria Joao Martins, D. Deniz, Daniel Pasquet, Michael Hoffmann, Hélène Fremont, Hamed Yahoui, Olivier Bonnaud, Michel Robert, J. Barsics, José Vincente Benlloch-Dualde Year of publication: 2009 Journal: DOI: HAL link: https://hal.science/hal-00399569v1

Analytical Model for Thermally-induced Warpage of POP Author(s): Wei Feng, Helene Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323410v1

Solder fatigue of wafer level package assemblies. Comparison with flip chip BGA's Author(s): Charles Regard, Christian Gautier, Hélène Frémont, Alexandre Val, Frédéric Roullier, Patrick Schwindenhammer Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323406v1

Study of JEDEC B-condition JESD22-B111 Standard for Drop Test Reliability of Chip Scale Packages Author(s): Yassine Bentata, Stéphane Forster, K. Y. Goh, Hélène Frémont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323417v1

Balance of the EIE-Surveyor thematic network Author(s): Jean-Marc Thiriet, Michel Robert, Maria Joao Martins, Anthony E. Ward, Daniel Pasquet, D. Deniz, Hamed Yahoui, Olivier Bonnaud, Michael Hoffmann, Hélène Fremont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00364333v1

Influence of Underfill Methods on the Solder Joint Fatigue of Wafer Level Packaging Author(s): Charles Regard, Christian Gautier, Hélène Fremont, Patrick Poirier Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323432v1

Puces assemblées en flip-chip : comparaison normes « drop-test ». Author(s): Hélène Frémont, Stéphane Forster, Yassine Bentata Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323441v1

A Survey of the Evolution of the Bologna Process in EIE in Europe Author(s): Maria Joao Martins, Jean-Marc Thiriet, Olivier Bonnaud, Michael Hoffmann, Michel Robert, José Vincente Benlloch-Dualde, Anthony E. Ward, Hamed Yahoui, Hélène Fremont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00318724v1

New results for the EIE-Surveyor project Author(s): Jean-Marc Thiriet, Michel Robert, Maria João Martins, Anthony E. Ward, Olivier Bonnaud, Michael Hoffmann, Hamed Yahoui, Hélène Fremont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00349415v1

Development of an HMI Based on the OPC Standard Author(s): Serge Bouter, Rachid Malti, Hélène Frémont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323382v1

Life time prediction of BGA assemblies with experimental torsion test and finite element analysis Author(s): Wilson-Carlos Maia Filho, Hélène Frémont, Michel Brizoux, Yves Danto Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323420v1

Moisture Diffusion Model Verification of Packaging Materials Author(s): Xiaosong Ma, Kaspar-M.B. Jansen, L.J. Ernst, Willelm-D van Driel, Olaf van Der Sluis, Kuchi Zhang, Charles Regard, Christian Gautier, Hélène Frémont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323425v1

Analytical model for thermally-induced warpage of POP Author(s): Wei Feng, Hélène Fremont, Alexandrine Guédon-Gracia, Frédéric Verdier, Bernard Plano Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00326445v1

Bond Reliability Improvement at High Temperature by Pd Addition on Au Bonding Wires Author(s): Bahi M.A., P. Lecuyer, Hélène Frémont, A. Gentil, Jean-Pierre Landesman, Frédéric Christien Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00399566v1

Effect of packaging materials aging properties on die surface cracking of a SiP carrier Author(s): Xiaosong Ma, Kaspar-M.B. Jansen, L.J. Ernst, Willelm-D van Driel, Olaf van Der Sluis, Kuchi Zhang, Charles Regard, Christian Gauthier, Hélène Frémont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323423v1

New Results for the EIE-Surveyor Project 19th EAEEIE conference Author(s): Jean-Marc Thiriet, Michel Robert, Maria-J. Martins, Anthony- E. Ward, Olivier Bonnaud, Michael Hoffmann, Hamed Yahoui, Hélène Frémont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323380v1

Simulation of Migration effects in PoP Author(s): Kirsten Weide-Zaage, Li Wang, Hélène Frémont Year of publication: 2008 Journal: DOI: HAL link: https://hal.science/hal-00323415v1

High Density IC Packaging Reliability Author(s): Geneviève Duchamp, Alexandrine Guedon-Gracia, Frédéric Verdier, Hélène Frémont Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00323388v1

Experiences with Personal Professional Project (PPP) Author(s): Hélène Dufau, Hélène Frémont, Florent Richard Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00323374v1

EIE-Surveyor: Observatory of the Bologna-process in EIE: an aid for the enhancement of mobility Author(s): Jean-Marc Thiriet, Maria João Martins, Hamed Yahoui, Michel Robert, Hélène Fremont Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00162581v1

Observatory of the Bologna-process in EIE: an aid for the enhancement of mobility Author(s): Jean-Marc Thiriet, Maria-J. Martins, Hamed Yahoui, Michel Robert, Hélène Frémont Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00321973v1

EIE-Surveyor : un programme européen pour favoriser les échanges et la reconnaissance des diplômes au niveau européen Author(s): Olivier Bonnaud, Hélène Fremont, Maria João Martins, Daniel Pasquet, Michel Robert, Jean-Marc Thiriet, Hamed Yahoui Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00370675v1

Simple Analytical Model for Thermally-induced Warpage of POP Author(s): Wei Feng, Hélène Frémont, Frédéric Verdier, Bernard Plano Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00323385v1

SiP vs SoC : An application-driven perspective Author(s): Geneviève Duchamp, Hélène Frémont, Alexandrine Guédon-Gracia, Frédéric Verdier Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00327271v1

EIE-Surveyor : un programme européen pour favoriser les échanges et la reconnaissance des diplômes au niveau européen Author(s): Olivier Bonnaud, Hélène Frémont, Maria- J .Martins, Daniel Pasquet, Michel Robert, Jean-Marc Thiriet, Hamed Yahoui Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00323375v1

Fiabilité des assemblages microélectroniques complexes Author(s): Frédéric Verdier, Geneviève Duchamp, Hélène Frémont Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00167725v1

Le projet professionnel personnel au département Geii de l'Université Bordeaux 1 Author(s): Hélène Frémont, Hélène Dufau, Hervé Lévi, Florent Richard Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00323377v1

Existing and new Tools to improve student mobility at university level in Electrical and information engineering Author(s): Yahoui Hamed, Ligus Jan, Jean-Marc Thiriet, Genon-Catalot Denis, Hélène Frémont Year of publication: 2006 Journal: DOI: HAL link: https://hal.science/hal-00321970v1

Design for reliability - Impact of microvia technology and assembly process. Author(s): Walter Horaud, Hélène Fremont, Bernard Plano, Sylvain Leroux Year of publication: 2005 Journal: DOI: HAL link: https://hal.science/hal-00183963v1

Void formation in a copper-via-structure depending on the stress free temperature and metallization geometry Author(s): Kirsten Weide-Zaage, David Dalleau, Yves Danto, Hélène Fremont Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00183966v1

Some Mechanical and Metallurgical Aspects of the Degradation in Interconnects Author(s): Michel Ignat, Hélène Fremont, Jean-Yves Deletage, Yves Danto Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00183965v1

Test chip for qualification of packaging assemblies Author(s): Jean-Yves Deletage, Hélène Fremont, Olivier Puig, Claude Pellet, Pascal Fouillat, Yves Danto Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00183081v1

From the two tier degree struture of the Bologna process to the Erasmus Mundus European Master Author(s): A. Yahoui, Hélène Frémont, Jean-Marc Thiriet, Maria Joao Martins, Olivier Bonnaud Year of publication: 2004 Journal: DOI: HAL link: https://hal.science/hal-00909012v1

Evolution of Reliability Assessment In PCB Assemblies Author(s): Yves Danto, Jean-Yves Deletage, Frédéric Verdier, Hélène Fremont Year of publication: 2001 Journal: DOI: HAL link: https://hal.science/hal-00183967v1

Life prediction of BGA and CSP assemblies using an experimental degradation law and fem simulations Author(s): Jean-Yves Deletage, Hélène Fremont, Patrick Louis, Yves Danto, Bernard Plano, Bertrand Carbonne Year of publication: 2000 Journal: DOI: HAL link: https://hal.science/hal-00183968v1

Vieillissement par pénétration d humidité des résines d enrobage de circuits intégrés Author(s): Jean-Yves Deletage, Hélène Fremont, Yves Danto Year of publication: 2000 Journal: DOI: HAL link: https://hal.science/hal-00183969v1

Industrial use of conductive adhesives for SMT assemblie Author(s): Marie-Genevieve Perichaud, Hélène Fremont, Michel Salagoity, Christiane Faure, Yves Danto Year of publication: 1998 Journal: DOI: HAL link: https://hal.science/hal-00183971v1

Thermomechanical Behaviour of Adhesive Jointed SMT Components Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Davide Carboni, Hélène Fremont, Yves Danto, Christiane Faure Year of publication: 1998 Journal: DOI: HAL link: https://hal.science/hal-00183973v1

BJT avalanche breakdown voltage improvement by introduction of a floating P-layer in the epitaxial collector region Author(s): Thomas Zimmer, M. N?doye, Noelle Lewis, Jean Batiste Duluc, Helene Fremont, Jean Paul Dom Year of publication: 1998 Journal: DOI: HAL link: https://hal.science/hal-00189380v1

Optimisation of an Assembling Process of Passive Components reported with Conductive Adhesives Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Gilles N'Kaoua, Hélène Fremont, Yves Danto, Olivier Puig Year of publication: 1998 Journal: DOI: HAL link: https://hal.science/hal-00183972v1

Evaluation of conductive adhesives for industrial SMT assemblies Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto, Christiane Faure, Michel Salagoity Year of publication: 1998 Journal: DOI: HAL link: https://hal.science/hal-00183970v1

Report des composants CMS à l'aide d'une colle conductrice Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Yves Ousten, Hélène Fremont, Yves Danto Year of publication: 1997 Journal: DOI: HAL link: https://hal.science/hal-00182921v1

approach of integrated circuits failure location by voltage contrast in a scanning electron microscope Author(s): François Marc, Hélène Fremont, Paul Jounet, Yves Danto, M. Barre, C. Nouet Year of publication: 1993 Journal: DOI: HAL link: https://hal.science/hal-00181909v1

A fast VLSI SRAM mapping methodology using voltage contrast techniques on SEM Author(s): François Marc, Hélène Fremont, Paul Jounet, Andre Touboul, Yves Danto Year of publication: 1992 Journal: DOI: HAL link: https://hal.science/hal-00181911v1

Invited lectures (11)

Etude de fiabilité en microélectronique : principes généraux et nouvelles approches Author(s): Hélène Frémont Year of publication: 2019 Journal: DOI: HAL link: https://hal.science/hal-02517122v1

Etude de fiabilité en microélectronique : principes généraux et nouvelles approches Author(s): Hélène Frémont Year of publication: 2018 Journal: DOI: HAL link: https://hal.science/hal-02519525v1

Fiabilité des assemblages micro et nano-électroniques ; approche par la physique des défaillances Author(s): Hélène Fremont Year of publication: 2014 Journal: DOI: HAL link: https://hal.science/hal-01257994v1

Parameter extraction for simulations: silicon strength after thinning process Author(s): Hélène Fremont Year of publication: 2014 Journal: DOI: HAL link: https://hal.science/hal-00950182v1

Thermo-mechanical reliability issues in complex microelectronic assemblies: methodological approach Author(s): Hélène Fremont Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-00780832v1

Coordination and Alignment of Electrical and Information Engineering in European Higher Education Institutions Author(s): A. Friesel, Jean-Marc Thiriet, T. Wards, Hamed Yahoui, Olivier Bonnaud, Hélène Fremont, Joao Martins Maria Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-01102844v1

Thermal mechanical reliability issues in complex micro- and nano- electronic assemblies: a methodological approach Author(s): Hélène Fremont Year of publication: 2013 Journal: DOI: HAL link: https://hal.science/hal-00853816v1

How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies Author(s): Hélène Fremont Year of publication: 2010 Journal: DOI: HAL link: https://hal.science/hal-00477588v1

Improved physical understanding of intermittent failure in continuous monitoring method Author(s): Wilson Carlos Maia Filho, Hélène Frémont, Michel Brizoux, Yves Danto Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00167714v1

Reliability test method overview to characterize second level interconnects Author(s): Wilson Carlos Maia Filho, Hélène Frémont, M. Brizoux, Yves Danto Year of publication: 2007 Journal: DOI: HAL link: https://hal.science/hal-00167712v1

Send a email to Hélène FREMONT :

Hélène FREMONT