Article (37)
An Incremental Capacity Parametric Model Based on Logistic Equations for Battery State Estimation and Monitoring
Author(s): Matthieu Maures, Romain Mathieu, Armande Capitaine, Jean-Yves Delétage, Jean-Michel Vinassa, Olivier Briat
Year of publication: 2022
Journal: Batteries
DOI: 10.3390/batteries8050039
HAL link: https://hal.science/hal-03722553v1
Impact of temperature on the corrosion of lead-free solder alloy during salt spray test
Author(s): K.E. Akoda, A. Guédon-Gracia, J.-Y. Delétage, B. Plano, H. Frémont
Year of publication: 2021
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2021.114286
HAL link: https://hal.science/hal-03375855v1
Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging
Author(s): Pierre Roumanille, Emna Ben Romdhane, Samuel Pin, Patrick Nguyen, Jean-Yves Delétage, Alexandrine Guédon-Gracia, Hélène Frémont
Year of publication: 2021
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2021.114201
HAL link: https://hal.science/hal-03375916v1
Effect of thermal and vibrational combined ageing on QFN terminal pads solder reliability
Author(s): F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont
Year of publication: 2020
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2020.113883
HAL link: https://hal.science/hal-03011606v1
Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application
Author(s): M. Maures, A. Capitaine, J.-Y. Delétage, J.-M. Vinassa, O. Briat
Year of publication: 2020
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2020.113798
HAL link: https://hal.science/hal-03493060v1
Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints
Author(s): S. Pin, A. Gracia, J.-Y. Delétage, H. Fremont
Year of publication: 2019
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2019.113484
HAL link: https://hal.science/hal-02515004v1
Non-isothermal Ragone plots of Li-ion cells from datasheet and galvanostatic discharge tests
Author(s): Yuanci Zhang, Olivier Briat, Loïc Boulon, Jean-Yves Delétage, Cyril Martin, Fabio Coccetti, Jean-Michel Vinassa
Year of publication: 2019
Journal: Applied Energy
DOI: 10.1016/j.apenergy.2019.04.027
HAL link: https://hal.science/hal-02117604v1
Impact of temperature on calendar ageing of Lithium-ion battery using incremental capacity analysis
Author(s): Matthieu Maures, Yuanci Zhang, Cyril Martin, Jean-Yves Deletage, Jean-Michel Vinassa, Olivier Briat
Year of publication: 2019
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2019.06.056
HAL link: https://hal.science/hal-02506186v1
Efficient state of health estimation of Li-ion battery under several ageing types for aeronautic applications
Author(s): Yuanci Zhang, Olivier Briat, Jean-Yves Delétage, Cyril Martin, Nicolas Chadourne, Jean-Michel Vinassa
Year of publication: 2018
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2018.07.038
HAL link: https://hal.science/hal-01892422v1
Sequential combined thermal cycling and vibration test and simulation of printed circuit board
Author(s): Faical Arabi, Alexandrine Gracia, Hélène Fremont, Jean-Yves Delétage
Year of publication: 2018
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-02516781v1
Creep measurement and choice of creep laws for BGA assemblies' reliability simulation
Author(s): Samuel Pin, Alexandrine Guédon-Gracia, Jean-Yves Delétage, Hélène Fremont
Year of publication: 2018
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-02516790v1
Effect of HTRB lifetest on AlGaN/GaN HEMTs under different voltages and temperatures stresses
Author(s): Omar Chihani, Loïc Théolier, Alain Bensoussan, Jean-Yves Delétage, André Durier, Eric Woirgard
Year of publication: 2018
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2018.07.076
HAL link: https://hal.science/hal-02499971v1
Thermo-Mechanical Reliability Assessment of AlN Power Substrates Subjected to Severe Aging Tests
Author(s): Faical Arabi, Loic Theolier, Donatien Martineau, J.-Y. Delétage, Mathieu Médina, Eric Woirgard
Year of publication: 2017
Journal: Materials Focus
DOI: 10.1166/mat.2017.1413
HAL link: https://hal.science/hal-01662917v1
Effects of ageing on the conducted immunity of a voltage reference: Experimental study and modelling approach
Author(s): S. Hairoud-Airieau, G. Duchamp, Tristan Dubois, J.-Y. Delétage, A. Durier, H. Fremont
Year of publication: 2017
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2017.07.030
HAL link: https://hal.science/hal-01659294v1
Chemical rate phenomenon approach applied to lithium battery capacity fade estimation
Author(s): Issam Baghdadi, Olivier Briat, Jean-Yves Delétage, Philippe Gyan, Jean-Michel Vinassa
Year of publication: 2016
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-01657455v1
Power electronic assemblies: Thermo-mechanical degradations of gold-tin solder for attaching devices
Author(s): Faical Arabi, Loic Theolier, Donatien Martineau, J.-Y. Delétage, Mathieu Médina, Eric Woirgard
Year of publication: 2016
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2016.07.028
HAL link: https://hal.science/hal-01662946v1
Lithium battery aging model based on Dakin’s degradation approach
Author(s): Issam Baghdadi, Olivier Briat, Jean-Yves Delétage, Philippe Gyan, Jean-Michel Vinassa
Year of publication: 2016
Journal: Journal of Power Sources
DOI:
HAL link: https://hal.science/hal-01657446v1
Effects of salt spray test on lead-free solder alloy
Author(s): A. Guédon-Gracia, H. Frémont, B. Plano, Y. Delétage J., K. Weide-Zaage
Year of publication: 2016
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2016.07.034
HAL link: https://hal.science/hal-01400240v1
Assessment of constitutive properties of solder materials used in surface mounted devices for harsh environment applications
Author(s): M. Mickaël Pocheron,, J.-Y. Delétage, B. Plano, Alexandrine Gracia-Guedon, Hélène Fremont
Year of publication: 2015
Journal: IEEE Transactions on Device and Materials Reliability
DOI:
HAL link: https://hal.science/hal-01257918v1
Conductive adhesive joint for extreme temperature applications.
Author(s): J. B. Jullien, H. Frémont, J. Y. Deletage
Year of publication: 2013
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00905894v1
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach
Author(s): Fédia Baccar, Stéphane Azzopardi, Loïc Théolier, Kamal El Boubkari, Jean-Yves Deletage, Eric Woirgard
Year of publication: 2013
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00955719v1
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization
Author(s): François Le Henaff, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, Serge Bontemps, Julien Joguet
Year of publication: 2012
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00795345v1
Behavior and State-of-Health Monitoring of Li-ion Batteries Using Impedance Spectroscopy and Recurrent Neural Networks
Author(s): Akram Eddahech, Olivier Briat, Nicolas Bertrand, Jean-Yves Delétage, Jean-Michel Vinassa
Year of publication: 2012
Journal: International Journal of Electrical Power & Energy Systems
DOI:
HAL link: https://hal.science/hal-00709570v1
Ageing monitoring of lithium-ion cell during power cycling tests
Author(s): Akram Eddahech, Olivier Briat, Hervé Henry, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa
Year of publication: 2011
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2011.07.013
HAL link: https://hal.science/hal-00641829v1
How supercapacitors reach end of life criteria during calendar life and power cycling tests
Author(s): Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Eric Woirgard, Jean-Michel Vinassa
Year of publication: 2011
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2011.07.014
HAL link: https://hal.science/hal-00641859v1
Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature
Author(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2010
Journal: Microelectronics Reliability
DOI: 10.1016/j.microrel.2010.07.048
HAL link: https://hal.science/hal-00584164v1
Contribution of calendar ageing modes in the performances degradation of supercapacitors during power cycling
Author(s): Olivier Briat, Jean-Michel Vinassa, Nicolas Bertrand, Hassane El Brouji, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2010
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00527080v1
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation
Author(s): Yassine Belmehdi, Stephane Azzopardi, Adel Benmansour, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2009
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00414779v1
Challenges and potential of new approaches for reliability assessment of nanotechnologies
Author(s): L. Bechou, Y. Danto, J.Y. Deletage, F. Verdier, Y. Deshayes, S. Fregonese, C. Maneux, T. Zimmer, D. Laffitte
Year of publication: 2008
Journal: Comptes Rendus de l'Academie des Sciences. Série IV, Physique, Astronomie
DOI:
HAL link: https://hal.science/hal-00266387v1
Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly.
Author(s): J.-Y. Delétage, E. Woirgard, I. Favre, P. Lagonotte, G. Burban
Year of publication: 2007
Journal: SOCIÉTÉS DES INGÉNIEURS DE L'AUTOMOBILE
DOI:
HAL link: https://hal.science/hal-00380410v1
How to study delamination in plastic encapsulated devices
Author(s): Hélène Fremont, Jean-Yves Deletage, Kirsten Weide-Zaage, Yves Danto
Year of publication: 2004
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00183958v1
Moisture Diffusion in BCB Resins used for MEMS Packaging
Author(s): Angélique Tetelin, Claude Pellet, Jean-Yves Deletage, Bertrand Carbonne, Yves Danto
Year of publication: 2003
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00183113v1
Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations
Author(s): Jean-Yves Deletage, Frédéric Verdier, Bernard Plano, Yannick Deshayes, Laurent Bechou, Yves Danto
Year of publication: 2003
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00183949v1
Humidity Sensors for a Pulmonary Function Diagnostic Microsystem
Author(s): Céline Laville, Jean-Yves Deletage, Claude Pellet
Year of publication: 2001
Journal: Sensors and Actuators B: Chemical
DOI:
HAL link: https://hal.science/hal-00183117v1
Evaluation of the moisture sensitivity of molding compounds of IC's Packages.
Author(s): Hélène Fremont, Jean-Yves Deletage, Alberto Pintus, Yves Danto
Year of publication: 2001
Journal: ASME journal of electronic packaging
DOI:
HAL link: https://hal.science/hal-00183959v1
Reliability Evaluation of Adhesive bonded SMT Components in Industrial Applications
Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto
Year of publication: 2000
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00183960v1
The Use Impedance Spectroscopy, SEM and SAM Imaging for Early Detection of Failure in SMT Assemblies
Author(s): Y. Ousten, S. Medji, A. Fenech, J. Y. Deletage, L. Bechou, M.G. Perichaud, Y. Danto
Year of publication: 1998
Journal: Microelectronics Reliability
DOI:
HAL link: https://hal.science/hal-00164931v1
Proceeding (1)
Humidity Monitoring Using Flexible RF Sensors
Author(s): Bernard Bobby Ngoune, Hamida Hallil, Jean-Yves Deletage, Julien George, Corinne Dejous, Eric Cloutet, Stephane Bila, Dominique Baillargeat
Year of publication: 2022
Journal:
DOI: 10.1109/DTIP56576.2022.9911727
HAL link: https://hal.science/hal-04322761v1
Book sections (1)
Thermal Capability of Components
Author(s): Christian Zardini, Jean-Yves Delétage
Year of publication: 2011
Journal:
DOI:
HAL link: https://hal.science/hal-00988736v1
Conference proceedings (54)
Dynamics of the corrosion for SAC305 solder alloy in salt environment
Author(s): K. Akoda, A. Guedon-Gracia, Éric Lebraud, J.-Y. Deletage, B. Plano, H. Fremont
Year of publication: 2022
Journal:
DOI: 10.1109/EuroSimE54907.2022.9758896
HAL link: https://hal.science/hal-03665831v1
Printed Circuit Board Sequential Combined Thermal Cycling and Vibration Test and Simulations
Author(s): F. Arabi, A. Gracia, J.-Y. Delétage, H. Frémont
Year of publication: 2019
Journal:
DOI:
HAL link: https://hal.science/hal-02517306v1
Vibration test and simulation of printed circuit board
Author(s): Faical Arabi, Alexandrine Gracia, Jean-Yves Delétage, Hélène Fremont
Year of publication: 2018
Journal:
DOI:
HAL link: https://hal.science/hal-02516844v1
Initiation à la recherche sur la fiabilité en microélectronique par la physique : mini-projets en laboratoire
Author(s): O. Briat, J.-Y. Delétage, T. Dubois, G. Duchamp, H. Frémont, A. Guédon-Gracia, L. Theolier, J.-M. Vinassa, E. Woirgard
Year of publication: 2018
Journal:
DOI:
HAL link: https://hal.science/hal-02518400v1
Characterization of external pressure effects on lithium-ion pouch cell
Author(s): Yuanci Zhang, Olivier Briat, Jean-Yves Delétage, Cyril Martin, Guillaume Gager, Jean-Michel Vinassa
Year of publication: 2018
Journal:
DOI: 10.1109/ICIT.2018.8352505
HAL link: https://hal.science/hal-01892433v1
Temperature and voltage effects on HTRB and HTGB stresses for AlGaN/GaN HEMTs
Author(s): Omar Chihani, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard, Alain Bensoussan, André Durier
Year of publication: 2018
Journal:
DOI: 10.1109/irps.2018.8353685
HAL link: https://hal.science/hal-02500021v1
Initiation à la recherche sur la Fiabilité en microélectronique par la physique :Mini-projets en laboratoire
Author(s): J-y Deletage, T. Dubois, G. Duchamp, L. Theolier, J-M Vinassa, E. Woirgard, H. Fremont, O. Briat, A. Guédon-Gracia
Year of publication: 2018
Journal:
DOI:
HAL link: https://hal.science/hal-02516984v1
L'effet de la température et de la tension sur des vieillissements HTRB et HTGB pour des HEMTs GaN de puissance
Author(s): Omar Chihani, Loïc Théolier, Alain Bensoussan, Pierre Bondue, Jean-Yves Deletage, André Durier, Eric Woirgard
Year of publication: 2018
Journal:
DOI:
HAL link: https://hal.science/hal-02981877v1
Robustness of BGAs: Parametric study of voids' distribution in SAC solder joints
Author(s): Samuel Pin, Alexandrine Guedon-Gracia, Jean-Yves Delétage, Julie Fouquet, Hélène Fremont
Year of publication: 2018
Journal:
DOI:
HAL link: https://hal.science/hal-02516819v1
Effect of voids on crack propagation in AuSn die attach for high-temperature power modules
Author(s): Faical Arabi, Loic Théolier, Toni Youssef, Mathieu Medina, Jean-Yves Deletage, Eric Woirgard
Year of publication: 2017
Journal:
DOI: 10.1109/EuroSimE.2017.7926230
HAL link: https://hal.science/hal-01662929v1
Performance quantification of last generation Li-ion batteries in wide temperature range
Author(s): Yuanci Zhang, Olivier Briat, Cyril Martin, Jean-Yves Delétage, Guillaume Gager, Jean-Michel Vinassa
Year of publication: 2017
Journal:
DOI:
HAL link: https://hal.science/hal-01657701v1
Etude thermomécanique de la dégradation des assemblages de puissance soumis à des vieillissements à haute température
Author(s): Faical Arabi, Loïc Théolier, Martineau D., Jean-Yves Deletage, Eric Woirgard
Year of publication: 2016
Journal:
DOI:
HAL link: https://hal.science/hal-01361692v1
Dynamic battery aging model: representation of reversible capacity losses using first order model approach
Author(s): Issam Baghdadi, Olivier Briat, Jean-Yves Delétage, Philippe Gyan, Jean-Michel Vinassa
Year of publication: 2015
Journal:
DOI: 10.1109/VPPC.2015.7352932
HAL link: https://hal.science/hal-01308647v1
Silver sintering wire-bonding less power module for high temperature applications
Author(s): Francois Le Henaff, Stephane Azzopardi, Loïc Théolier, Jean-Yves Deletage, Eric Woirgard, Serge Bontemps, Julien Joguet
Year of publication: 2014
Journal:
DOI:
HAL link: https://hal.science/hal-01065293v1
Fiabilité d'une diode DT2 reportée sur un substrat DBC par frittage de pâte d'argent
Author(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2014
Journal:
DOI:
HAL link: https://hal.science/hal-01017558v1
Fiabilité d'une diode DT2 reportée sur un substrat DBC par frittage de pâte d'argent
Author(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, Francois Le Henaff, Jean-Yves Deletage, Eric Woirgard
Year of publication: 2014
Journal:
DOI:
HAL link: https://hal.science/hal-01065237v1
First Assemblies Using Deep Trench Termination Diodes
Author(s): Fédia Baccar, Loïc Théolier, Stephane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2014
Journal:
DOI: 10.1109/ISPSD.2014.6855996
HAL link: https://hal.science/hal-01017522v1
Processing and characterization of a 100 % low-temperature Ag-sintered three-dimensional structure, European Conference on Power Electronics and Applications
Author(s): Amandine Masson, Stéphane Azzopardi, François Le Henaff, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet
Year of publication: 2013
Journal:
DOI: 10.1109/EPE.2013.6631925
HAL link: https://hal.science/hal-00955727v1
Development of high temperature packaging technologies for SiC power devices based on finite elements simulanation and experiments: thermal approach
Author(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2012
Journal:
DOI:
HAL link: https://hal.science/hal-00795337v1
Frittage de nano-pâte d'argent : impact de la métallisation du substrat sur la tenue à la fatigue thermique des assemblages de puissance
Author(s): François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet
Year of publication: 2012
Journal:
DOI:
HAL link: https://hal.science/hal-00782838v1
Thermal performances evaluation of new high temperature power packages using SiC devices
Author(s): Ludi Zhang, Stephane Azzopardi, Alexandrine Gracia, Eric Woirgard, Jean-Yves Delétage
Year of publication: 2012
Journal:
DOI:
HAL link: https://hal.science/hal-00795339v1
2D finite elements electro-thermal modeling for IGBT: uni and multicellular approach
Author(s): Kamal El Boubkari, Stephane Azzopardi, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2012
Journal:
DOI:
HAL link: https://hal.science/hal-00795341v1
Intérêt de la simulation 2D multicellulaire par éléments-finis pour l'analyse d'un défaut lié un décollement de fil de câblage sur une puce de puissance IGBT
Author(s): Kamal El Boubkari, Stéphane Azzopardi, Loïc Théolier, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2012
Journal:
DOI:
HAL link: https://hal.science/hal-00955758v1
Measurement and simulation of moisture effects on electromagnetic radiation of printed circuit boards
Author(s): Hassene Fridhi, Geneviève Duchamp, Valerie Vigneras, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Hélène Fremont, Tristan Dubois
Year of publication: 2012
Journal:
DOI:
HAL link: https://hal.science/hal-00709116v1
Investigation of mechanical stress effect on electrical behavior of Trench Punch Through IGBT under short-circuit condition at low and high temperature
Author(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2011
Journal:
DOI:
HAL link: https://hal.science/hal-00955754v1
Transistor thermal fractional modeling for junction temperature estimation
Author(s): Jocelyn Sabatier, Christophe Farges, H.C. Nguyen, Xavier Moreau, Jean-Yves Delétage
Year of publication: 2011
Journal:
DOI: 10.3182/20110828-6-IT-1002.00780
HAL link: https://hal.science/hal-00668926v1
Ageing quantification of supercapacitors during power cycling using online and periodic characterization tests
Author(s): Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Richard Lallemand, Juliette Kauv, Gérard Coquery, Jean-Michel Vinassa
Year of publication: 2011
Journal:
DOI:
HAL link: https://hal.science/hal-00641857v1
Does power device sensitivity to mechanical stress can be used as sensor for power assembly health monitoring?
Author(s): Florence Capy, Stephane Azzopardi, Kama El Boubkari, Yassine Belmehdi, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2011
Journal:
DOI:
HAL link: https://hal.science/hal-00591063v1
Performances regeneration of supercapacitors during accelerated ageing tests in power cycling
Author(s): Ramzi Chaari, Olivier Briat, Jean-Yves Delétage, Jean-Michel Vinassa
Year of publication: 2011
Journal:
DOI:
HAL link: https://hal.science/hal-00641852v1
Thermo-mechanical simulations in double-sided heat transfer power assemblies
Author(s): Eric Woirgard, Isabelle Favre, Jean-Yves Delétage, Stephane Azzopardi, Renan Léon, Guy Convenant, Zoubir Khatir
Year of publication: 2010
Journal:
DOI:
HAL link: https://hal.science/hal-00584904v1
Caractérisation électromécanique en puces " flottantes " d'IGBT à grille planaire
Author(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Florence Capy, Eric Woirgard
Year of publication: 2010
Journal:
DOI:
HAL link: https://hal.science/hal-00584114v1
Electromechanical Characterization of "Flying" Planar Gate Punch Through IGBT Bare Die
Author(s): Yassine Belmehdi, Stephane Azzopardi, Florence Capy, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2010
Journal:
DOI:
HAL link: https://hal.science/hal-00585061v1
A first approach on the failure mechanisms of IGBT inverters for aeronautical applications: effect of humidity-pressure combination
Author(s): Hassan Abbad, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, P. Rollin, Karl Marchand, Tony Lhommeau, Michel Piton
Year of publication: 2010
Journal:
DOI:
HAL link: https://hal.science/hal-00584142v1
A connection of thermo-mechanical finite elements tools with electro-thermal finite elements simulation: towards an electro-thermo-mechanical finite elements modeling for power semiconductor devices
Author(s): Yassine Belmehdi, Stephane Azzopardi, Eric Woirgard, Jean-Yves Delétage, Isabelle Favre
Year of publication: 2010
Journal:
DOI:
HAL link: https://hal.science/hal-00585076v1
Evaluation of the performances of a novel Punch Through Trench IGBT using a Si(1-x)Ge(x) N+ buffer layer by using finite elements simulations
Author(s): Stephane Azzopardi, Yassine Belmehdi, Florence Capy, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2010
Journal:
DOI:
HAL link: https://hal.science/hal-00584133v1
Impact of temperature and voltage on the evolution of performance of supercapacitor in the calendar ageing
Author(s): Ramzi Chaari, Nicolas Bertrand, Olivier Briat, Hassane El Brouji, Jean-Yves Delétage, Jean-Michel Vinassa
Year of publication: 2010
Journal:
DOI:
HAL link: https://hal.science/hal-00584822v1
Assessment of uni-axial mechanical stress on Trench IGBT under severe operating conditions: a 2D physically-based simulation approach
Author(s): Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2009
Journal:
DOI:
HAL link: https://hal.science/hal-00585066v1
Moisture induced effects in PoP
Author(s): A. Guédon-Gracia, W. Feng, J.-Y. Delétage, F. Verdier, Hélène Frémont
Year of publication: 2009
Journal:
DOI:
HAL link: https://hal.science/hal-00385358v1
Thermo-mechanical optimization of heat spreader geometry for an automotive power assembly
Author(s): J.-Y. Delétage, E. Woigard, I. Favre, P. Lagonotte, G. Burban
Year of publication: 2007
Journal:
DOI:
HAL link: https://hal.science/hal-00380428v1
Thermo-mechanical optimization of heatspreader geometry for an automotive power assembly
Author(s): Eric Woirgard, Jean-Yves Delétage, Isabelle Favre, Patrick Lagonotte, Gwenael Burban
Year of publication: 2007
Journal:
DOI:
HAL link: https://hal.science/hal-00182176v1
Eurelnet (EUropean RE Liability NETwork)
Author(s): Yves Ousten, Jean-Yves Deletage
Year of publication: 2004
Journal:
DOI:
HAL link: https://hal.science/hal-00182906v1
Some Mechanical and Metallurgical Aspects of the Degradation in Interconnects
Author(s): Michel Ignat, Hélène Fremont, Jean-Yves Deletage, Yves Danto
Year of publication: 2004
Journal:
DOI:
HAL link: https://hal.science/hal-00183965v1
Test chip for qualification of packaging assemblies
Author(s): Jean-Yves Deletage, Hélène Fremont, Olivier Puig, Claude Pellet, Pascal Fouillat, Yves Danto
Year of publication: 2004
Journal:
DOI:
HAL link: https://hal.science/hal-00183081v1
New industrial application in 3D interconnection
Author(s): C. Val, O. Lignier, N. Chandler, A. Pizzato, Jean-Yves Deletage, Yves Ousten, A. Val
Year of publication: 2003
Journal:
DOI:
HAL link: https://hal.science/hal-00182865v1
Evolution of Reliability Assessment In PCB Assemblies
Author(s): Yves Danto, Jean-Yves Deletage, Frédéric Verdier, Hélène Fremont
Year of publication: 2001
Journal:
DOI:
HAL link: https://hal.science/hal-00183967v1
Life prediction of BGA and CSP assemblies using an experimental degradation law and fem simulations
Author(s): Jean-Yves Deletage, Hélène Fremont, Patrick Louis, Yves Danto, Bernard Plano, Bertrand Carbonne
Year of publication: 2000
Journal:
DOI:
HAL link: https://hal.science/hal-00183968v1
Humidity Sensors for a Pulmonary Function Diagnostic Microsystem
Author(s): Céline Laville, Jean-Yves Deletage, Claude Pellet
Year of publication: 2000
Journal:
DOI:
HAL link: https://hal.science/hal-00183136v1
Vieillissement par pénétration d humidité des résines d enrobage de circuits intégrés
Author(s): Jean-Yves Deletage, Hélène Fremont, Yves Danto
Year of publication: 2000
Journal:
DOI:
HAL link: https://hal.science/hal-00183969v1
Thermomechanical Behaviour of Adhesive Jointed SMT Components
Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Davide Carboni, Hélène Fremont, Yves Danto, Christiane Faure
Year of publication: 1998
Journal:
DOI:
HAL link: https://hal.science/hal-00183973v1
Optimisation of an Assembling Process of Passive Components reported with Conductive Adhesives
Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Gilles N'Kaoua, Hélène Fremont, Yves Danto, Olivier Puig
Year of publication: 1998
Journal:
DOI:
HAL link: https://hal.science/hal-00183972v1
Evaluation of conductive adhesives for industrial SMT assemblies
Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Hélène Fremont, Yves Danto, Christiane Faure, Michel Salagoity
Year of publication: 1998
Journal:
DOI:
HAL link: https://hal.science/hal-00183970v1
The use of impedance spectroscopy, SEM and SAM imaging for early detection of failure in SMT assemblies
Author(s): Yves Ousten, Said Mejdi, Alain Fenech, Jean-Yves Deletage, Laurent Bechou, Marie-Genevieve Perichaud, Yves Danto
Year of publication: 1997
Journal:
DOI:
HAL link: https://hal.science/hal-00182923v1
Report des composants CMS à l'aide d'une colle conductrice
Author(s): Marie-Genevieve Perichaud, Jean-Yves Deletage, Bernard Tregon, Yves Ousten, Hélène Fremont, Yves Danto
Year of publication: 1997
Journal:
DOI:
HAL link: https://hal.science/hal-00182921v1
Thermomechanical behaviour of ceramic ball grid array based on FEM simulations and experimentations
Author(s): Jean-Yves Delétage, Alain Fenech, Laurent Bechou, Yves Ousten, Yves Danto, Michel Salagoity, Christiane Faure, S. Rao
Year of publication: 1996
Journal:
DOI: 10.1109/IEMT.1996.559692
HAL link: https://hal.science/hal-00385312v1
Invited lectures (2)
Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test
Author(s): Komlan Elom Akoda, Alexandrine Guedon-Gracia, Jean-Yves Deletage, Bernard Plano, Helene Fremont
Year of publication: 2023
Journal:
DOI: 10.1016/j.microrel.2023.115194
HAL link: https://hal.science/hal-04273292v1
Nouveaux indicateurs de suivi de vieillissement des assemblages de puissance : impact des contraintes mécaniques sur les caractéristiques électriques des composants de puissance silicium
Author(s): Stephane Azzopardi, Yassine Belmehdi, Jean-Yves Delétage, Eric Woirgard
Year of publication: 2010
Journal:
DOI:
HAL link: https://hal.science/hal-00585071v1
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