Based on a broad academic and industrial partnership and an electrical and optical characterization platform, our research focuses on the study of the impact of:

  • integration of new (nano)materials, 
  • miniaturization, packaging and interconnection to operating environment,
  • severe environmental stresses

on the functionality of micro and nano-assembled electronic and photonic devices.

  • Electronic devices
  • Dielectric (nano)materials for capacitors: forming, electrical and physical characterizations
  • Passive devices and embedded technologies: assessment of electrical performances, durability, reliability
  • Advanced interconnections for packaging: FEM modeling, non-destructive imaging (Scanning Acoustic Microscopy)
  • Optoelectronic / Photonic devices (OpERaS platform)
  • LEDs, Laser diodes, photodetectors: Electro-optical characterizations, Physics of early failure, Packaging impact on performances (thermal/thermomechanical)
  • Luminescent (nano)materials for LED
  • Polymer-based integrated optics for optical sensing

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Presentation of the waves research activities of the EDMINA team

The activities of the EDMiNA team are focused on the integration of innovative materials, the design, modeling, characterization, performance study and assessment of the reliability of electronic and photonic devices. Understanding and modeling the physical mechanisms are at the heart of our issues.

In this way, the group relies on recognized skills in metrology, optical and optoelectronic (from UV to IR), electromagnetic (from DC to 110 GHz) and acoustic characterization of materials through dedicated platforms, and multi-physical modelling, whether through the use of analytical calculation codes or numerical approaches (FEM, FDTD).

Reliability of optoelectronic components

The implementation of dedicated fine characterization methodologies and the modeling of the physical mechanisms of degradation of optical semiconductor components give the group excellent recognition with industrial partners in the field (3SP Technologies, Renault, CEA-LETI, III-V Lab, THALES, CNES, SUNNA Design, Amplitude Systems, ALPHANOV…). 

The projects are carried out within the framework of various programs, addressing the development and assessment of the reliability of different optoelectronic technologies (LEDs, laser diodes, photodetectors). Let us mention the “IDE2aL” project co-financed by the regional council (2014-2017) dedicated among other things to the fine characterization in temperature of power laser diodes and the highlighting of particular effects linked to the presence of defects (microplasma) likely to affect the life of these components under operational conditions. This work has led to an optimized design of 980nm GaAs diodes by the company 3SP Technologies.

Waves research theme
EDMINA teams demonstration

Innovative Microelectronics Packaging

Included in this area are microdevices for electronics incorporating hybrid materials. The collaboration set up in 2015 with the NSERC/IBM Smarter Microelectronics Packaging for Performance Scaling Chair in close collaboration with ICMCB made it possible to finance a thesis in joint supervision with the University of Sherbrooke, which enabled the development of a ‘low-cost’ manufacturing process for capacitors based on thin films (∼ 200 nm) incorporating Ba0.6Sr0.4TiO3 nanoparticles synthesized by supercritical fluid.

 Capacitance densities close to the state of the art (1 to 2 uF.cm-2) have been obtained, demonstrating the promoting nature of this approach for the microelectronics industry. At the same time, on a European scale, the recognition of the group’s work in the field of the effects of packaging on the reliability of devices allows it to be involved in several European projects.

Integration of innovative materials

 The goal is to develop and characterize durable materials in order to integrate them into electronic and photonic devices with a high degree of miniaturization and at low cost.

Waves research group
Presention waves research team

Integrated optical microsensor

Background work, both fundamental and experimental, is carried out, making it possible to show the performance of a low-cost ring micro-resonator (OMR), and to identify the main design and production criteria carrying out a detection of water pollutants. With regard to the state of the art, the discriminating scientific element lies in the homogeneous detection (without surface functionalization) in the visible by measuring the changes in intensity (related to absorption) and wavelength resonance (linked to the change in optical index). In partnership with UMI LN2 (CRSNG funding), work is underway on the modeling and specific development of innovative resonant structures in integrated optics (OMR integrating porous sheath), targeting the detection of water pollutants.


Collaborations and partners

For the various research projects underway, the IMS Bordeaux laboratory and its teams rely on strong partnerships and collaborations, which allow for the creation of a synergy of strengths and a sharing of technical and human resources














3SP Technologies








Latest news from the team

Thesis defence of Brian DUSOLLE

Development of a supercritical millifluidics route for the synthesis of III-N colloidal nanocrystals applied to self-emissive QLED devices



Meet the members of the research team

Vuong-Son LUONG
Simon JOLY
Chaimae EL FAKIR
Laurent BECHOU
Alexandre BORDET
Dorian ADAM
Résumé en français

S’appuyant sur un solide partenariat académique et industriel ainsi que sur une plateforme  de caractérisations électriques et optiques, les recherches menées par l’équipe se focalisent sur le développement de méthodes permettant d’évaluer l’impact de :

  • l’intégration de nouveaux (nano)matériaux dans des composants et capteurs,
  • la miniaturisation, l’assemblage et linterconnexion à l’environnement d’utilisation,
  • contraintes environnementales sévères

sur la fonctionnalité de dispositifs électroniques et photoniques micro et nano-assemblés.


  • Dispositifs électroniques
  • (Nano)matériaux diélectriques pour condensateurs (découplage, filtrage, stockage) : mise en forme (couches minces), caractérisations électriques et physiques
  • Composants passifs et technologies couches minces « enterrées » : évaluation des performances électriques, durabilité et fiabilité
  • Interconnexions avancées pour l’assemblage : modélisation FEM, imagerie non-destructive (Microscopie Acoustique à Balayage)


  • Dispositifs optoélectroniques et photoniques (plateforme OpERaS)
  • LEDs, diodes Laser et photodétecteurs : caractérisations électro-optiques, physique de défaillance prématurée, impact du packaging sur les performances (thermique et thermomécanique)
  • (Nano)matériaux luminescents pour nouvelles sources optiques
  • Optique intégrée en technologie polymère pour la détection (capteur)

Contact our team

If you have a request or questions about the laboratory, please contact our team.